SN74LVC2G00 Gate Datasheet

SN74LVC2G00 Datasheet, PDF, Equivalent


Part Number

SN74LVC2G00

Description

Dual 2-Input Positive-NAND Gate

Manufacture

etcTI

Total Page 24 Pages
Datasheet
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SN74LVC2G00
SCES193N – APRIL 1999 – REVISED JANUARY 2015
SN74LVC2G00 Dual 2-Input Positive-NAND Gate
1 Features
1 Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.3 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Live Insertion, Partial Power
Down Mode, and Back Drive Protection
• Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 1000-V Charged-Device Model
2 Applications
• IP Phones: Wired and Wireless
• Optical Modules
• Optical Networking: EPON and Video Over Fiber
• Point-to-Point Microwave Backhaul
• Power: Telecom DC/DC Module:
Analog and Digital
• Private Branch Exchanges (PBX)
• TETRA Base Exchanges
• Telecom Base Band Units
• Telecom Shelters: Power Distribution Units (PDU),
Power Monitoring Units (PMU), Wireless Battery
Monitoring, Remote Electrical Tilt Units (RET),
Remote Radio Units (RRU), Tower Mounted
Amplifiers (TMA)
• Vector Signal Analyzers and Generators
• Video Conferencing: IP-Based HD
• WiMAX and Wireless Infrastructure Equipment
• Wireless Communications Testers and
Wireless Repeaters
• xDSL Modems and DSLAM
3 Description
This dual 2-input positive-NAND gate is designed for
1.65-V to 5.5-V VCC operation.
The SN74LVC2G00 device performs the Boolean
function Y = A × B or Y = A + B in positive logic.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
SM8 (8)
2.95 mm × 2.80 mm
SN74LVC2G00
US8 (8)
2.30 mm × 2.00 mm
DSBGA (8)
1.91 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
1
1A
2
1B
7
1Y
5
2A
6
2B
3
2Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G00
SN74LVC2G00
SCES193N – APRIL 1999 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Simplified Schematic............................................. 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics .......................................... 6
7.6 Electrical Characteristics (Continued)....................... 6
7.7 Switching Characteristics, -40°C to 85°C ................ 6
7.8 Switching Characteristics, -40°C to 125°C .............. 6
7.9 Typical Characteristics .............................................. 7
8 Parameter Measurement Information .................. 8
9 Detailed Description .............................................. 9
9.1 Overview ................................................................... 9
9.2 Functional Block Diagram ......................................... 9
9.3 Feature Description................................................... 9
9.4 Device Functional Modes.......................................... 9
10 Application and Implementation........................ 10
10.1 Application Information.......................................... 10
10.2 Typical Application ............................................... 10
11 Power Supply Recommendations ..................... 11
12 Layout................................................................... 12
12.1 Layout Guidelines ................................................. 12
12.2 Layout Example .................................................... 12
13 Device and Documentation Support ................. 12
13.1 Trademarks ........................................................... 12
13.2 Electrostatic Discharge Caution ............................ 12
13.3 Glossary ................................................................ 12
14 Mechanical, Packaging, and Orderable
Information ........................................................... 12
5 Revision History
Changes from Revision M (November 2013) to Revision N
Page
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Deleted Ordering Information table. ....................................................................................................................................... 1
Changes from Revision L (January 2007) to Revision M
Page
• Updated document to new TI data sheet format. ................................................................................................................... 1
• Updated operating temperature range in Recommended Operating Conditions table. ......................................................... 5
• Added ESD warning. ............................................................................................................................................................ 12
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Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: SN74LVC2G00


Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community SN74LVC2G00 SCES193N – APR IL 1999 – REVISED JANUARY 2015 SN74LV C2G00 Dual 2-Input Positive-NAND Gate 1 Features •1 Available in the Texas Instruments NanoFree™ Package • Sup ports 5-V VCC Operation • Inputs Acce pt Voltages to 5.5 V • Max tpd of 4.3 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Driv e at 3.3 V • Typical VOLP (Output Gro und Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Un dershoot) > 2 V at VCC = 3.3 V, TA = 25 °C • Ioff Supports Live Insertion, P artial Power Down Mode, and Back Drive Protection • Latch-Up Performance Exc eeds 100 mA Per JESD 78, Class II • E SD Protection Exceeds JESD 22 – 2000- V Human-Body Model – 1000-V Charged-D evice Model 2 Applications • IP Phone s: Wired and Wireless • Optical Modul es • Optical Networking: EPON and Vid eo Over Fiber • Point-to-Point Microwave Backhaul • Power: Telecom DC/DC Module: Analog and Digital • Pri.
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