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SN74LVC2G02 Dataheets PDF



Part Number SN74LVC2G02
Manufacturers Texas Instruments
Logo Texas Instruments
Description Dual 2-Input Positive-NOR Gate
Datasheet SN74LVC2G02 DatasheetSN74LVC2G02 Datasheet (PDF)

Product Folder Order Now Technical Documents Tools & Software Support & Community SN74LVC2G02 SCES194N – APRIL 1999 – REVISED MAY 2019 SN74LVC2G02 Dual 2-Input Positive-NOR Gate 1 Features •1 Available in the Texas Instruments NanoFree™ package • Supports 5-V VCC operation • Inputs accept voltages to 5.5 V • Max tpd of 4.9 ns at 3.3 V • Low power consumption, 10-μA Max ICC • ±24-mA Output drive at 3.3 V • Typical VOLP (output ground bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (.

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Product Folder Order Now Technical Documents Tools & Software Support & Community SN74LVC2G02 SCES194N – APRIL 1999 – REVISED MAY 2019 SN74LVC2G02 Dual 2-Input Positive-NOR Gate 1 Features •1 Available in the Texas Instruments NanoFree™ package • Supports 5-V VCC operation • Inputs accept voltages to 5.5 V • Max tpd of 4.9 ns at 3.3 V • Low power consumption, 10-μA Max ICC • ±24-mA Output drive at 3.3 V • Typical VOLP (output ground bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (output VOH undershoot) >2 V at VCC = 3.3 V, TA = 25°C • Ioff supports partial-power-down mode operation • Latch-up performance exceeds 100 mA er JESD 78, class II • ESD protection exceeds JESD 22 – 2000-V Human-body model (A114-A) – 1000-V Charged-device model (C101) 2 Applications • AV receiver • Audio dock: portable • Blu-ray player and home theater • Embedded PC • MP3 Player/recorder (portable audio) • Personal digital assistant (PDA) • Power: Telecom/server AC/DC supply: single controller: analog and digital • Solid state drive (SSD): client and enterprise • TV: LCD/digital and high-definition (HDTV) • Tablet: enterprise • Video analytics: server • Wireless headset, keyboard, and mouse 3 Description This dual 2-input positive-NOR gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G02 device performs the Boolean function Y = A + B or Y = A × B in positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74LVC2G02DCT SSOP (8) 2.95 mm × 2.8 mm SN74LVC2G02DCU VSSOP (8) 2.3 mm × 2.0 mm SN74LVC2G02YZP DSBGA (8) 1.91 mm × 0.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic 1 1A 2 1B 7 1Y 5 2A 6 2B 3 2Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LVC2G02 SCES194N – APRIL 1999 – REVISED MAY 2019 www.ti.com Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ..................................... 4 6.2 ESD Ratings ............................................................ 4 6.3 Recommended Operating Conditions ...................... 5 6.4 Thermal Information ................................................. 5 6.5 Electrical Characteristics .......................................... 6 6.6 Switching Characteristics ......................................... 6 6.7 Switching Characteristics ......................................... 6 6.8 Operating Characteristics.......................................... 6 6.9 Typical Characteristics .............................................. 7 7 Parameter Measurement Information .................. 8 8 Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application ................................................. 10 10 Power Supply Recommendations ..................... 11 11 Layout................................................................... 11 11.1 Layout Guidelines ................................................. 11 11.2 Layout Example .................................................... 11 12 Device and Documentation Support ................. 12 12.1 Community Resources.......................................... 12 12.2 Trademarks ........................................................... 12 12.3 Electrostatic Discharge Caution ............................ 12 12.4 Glossary ................................................................ 12 13 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ .


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