SN74LVC2G06-Q1 Driver Datasheet

SN74LVC2G06-Q1 Datasheet, PDF, Equivalent


Part Number

SN74LVC2G06-Q1

Description

Dual Inverter Buffer and Driver

Manufacture

etcTI

Total Page 12 Pages
Datasheet
Download SN74LVC2G06-Q1 Datasheet


SN74LVC2G06-Q1
SN74LVC2G06-Q1
www.ti.com.................................................................................................................................................... SCES617A – OCTOBER 2004 – REVISED APRIL 2008
DUAL INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
FEATURES
1
Qualified for Automotive Applications
Supports 5-V VCC Operation
Max tpd of 3.4 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
1A
GND
2A
1
2
3
6 1Y
5 VCC
4 2Y
DESCRIPTION/ORDERING INFORMATION
This dual inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06-Q1 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
TA
–40°C to 125°C
ORDERING INFORMATION(1)
PACKAGE (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
SOT (SOT-23) – DBV
Tape and reel
SN74LVC2G06QDBVRQ1
C06_
SOT (SC-70) – DCK
Tape and reel
SN74LVC2G06QDCKRQ1
CT_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Pin 1 identifier
indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
H
L
OUTPUT
Y
L
H
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated

SN74LVC2G06-Q1
SN74LVC2G06-Q1
SCES617A – OCTOBER 2004 – REVISED APRIL 2008.................................................................................................................................................... www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
1A 1
6 1Y
2A 3
4 2Y
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VCC Supply voltage range
VI Input voltage range(2)
VO Voltage range applied to any output in the high-impedance or power-off state(2)
VO Voltage range applied to any output in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
Continuous current through VCC or GND
θJA Package thermal impedance(4)
DBV package
DCK package
Tstg Storage temperature range
MIN MAX UNIT
–0.5 6.5 V
–0.5 6.5 V
–0.5 6.5 V
–0.5 6.5 V
–50 mA
–50 mA
±50 mA
±100 mA
165
°C/W
259
–65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2 Submit Documentation Feedback
Copyright © 2004–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC2G06-Q1


Features SN74LVC2G06-Q1 www.ti.com.............. ....................................... ....................................... ....................................... ................. SCES617A – OCTOBER 2004 – REVISED APRIL 2008 DUAL INVERT ER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT S FEATURES 1 • Qualified for Automot ive Applications • Supports 5-V VCC O peration • Max tpd of 3.4 ns at 3.3 V • Low Power Consumption, 10-µA Max ICC • ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • T ypical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V • Ioff Supports Partial- Power-Down Mode Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds J ESD 22 – 2000-V Human-Body Model (A11 4-A) – 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101) D BV OR DCK PACKAGE (TOP VIEW) 1A GND 2A 1 2 3 6 1Y 5 VCC 4 2Y DESCRIPTION/ORDERING INFORMATION T.
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