SN74LVC2G07 Driver Datasheet

SN74LVC2G07 Datasheet, PDF, Equivalent


Part Number

SN74LVC2G07

Description

Dual Buffer and Driver

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs
1 Features
1 Dual Open-Drain Buffer Configuration
• -24-mA Output Drive at 3.3 V
• Support Translation-Up and Down
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs and Open-Drain Outputs Accept Voltages
Up to 5.5 V
• Max tpd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
• Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
2 Applications
• Blu-ray Players and Home Theaters
• DVD Recorders and Players
• Desktops or Notebook PCs
• Digital Video Cameras (DVC)
• Embedded PCs
• GPS: Personal Navigation Devices
• Mobile Phones
• Network Projector Front Ends
• Portable Media Players
• Solid State Drive (SSD): Enterprise
• High-Definition (HDTV)
• Tablet: Enterprise
• Audio Dock: Portable
• DLP Front Projection System
3 Description
This dual buffer and driver is designed for 1.65-V to
5.5-V VCC operation. The output of the
SN74LVC2G07 device is open drain and can be
connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND
functions. The maximum sink current is 32 mA.
NanoFree package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
SC70 (6)
2.00 mm × 1.25 mm
SN74LVC2G07
DRY SON (6)
1.45 mm × 1.00 mm
DSF SON (6)
1.00 mm × 1.00 mm
DSBGA (6)
1.41 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Functional Block Diagram
1A 1
6 1Y
2A 3
4 2Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G07
SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics from –40°C to 85°C ......... 5
6.7 Switching Characteristics from –40°C to 125°C ....... 5
6.8 Operating Characteristics.......................................... 5
6.9 Typical Characteristics .............................................. 6
7 Parameter Measurement Information .................. 7
7.1 (Open-Drain) ............................................................. 7
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application ................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Examples................................................... 10
12 Device and Documentation Support ................. 11
12.1 Documentation Support ........................................ 11
12.2 Community Resources.......................................... 11
12.3 Trademarks ........................................................... 11
12.4 Electrostatic Discharge Caution ............................ 11
12.5 Glossary ................................................................ 11
13 Mechanical, Packaging, and Orderable
Information ........................................................... 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (November 2013) to Revision L
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision J (August 2012) to Revision K
Page
• Updated document to new TI data sheet format. ................................................................................................................... 1
• Updated operating temperature range. .................................................................................................................................. 4
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Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: SN74LVC2G07


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity SN74LVC2G07 SCES308L – AUGUST 2001 – REVISED MAY 2015 SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs 1 Features •1 Dual Open-Drai n Buffer Configuration • -24-mA Outpu t Drive at 3.3 V • Support Translatio n-Up and Down • Available in the Texa s Instruments NanoFree™ Package • S upports 5-V VCC Operation • Inputs an d Open-Drain Outputs Accept Voltages Up to 5.5 V • Max tpd of 3.7 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • Typical VOLP (Output Ground Bo unce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoo t) >2 V at VCC = 3.3 V, TA = 25°C • Ioff Supports Live Insertion, Partial-P ower-Down Mode, and Back-Drive Protecti on • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Prote ction Exceeds JESD 22 – 2000-V Human- Body Model (A114-A) – 200-V Machine M odel (A115-A) – 1000-V Charged-Device Model (C101) 2 Applications • Blu-ray Players and Home Theaters .
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