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SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs
1 Features
•1 Dual Open-Drain Buffer Configuration • -24-mA Output Drive at 3.3 V • Support Translation-Up and Down • Available in the Texas Instruments
NanoFree™ Package • Supports 5-V VCC Operation • Inputs and Open-Drain Outputs Accept Voltages
Up to 5.5 V • Max tpd of 3.7 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C • Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection • Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II • ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)
2 Applications
• Blu-ray Players and Home Theaters • DVD Recorders and Players • Desktops or Notebook PCs • Digital Video Cameras (DVC) • Embedded PCs • GPS: Personal Navigation Devices • Mobile Phones • Network Projector Front Ends • Portable Media Players • Solid State Drive (SSD): Enterprise • High-Definition (HDTV) • Tablet: Enterprise • Audio Dock: Portable • DLP Front Projection System
3 Description
This dual buffer and driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
SC70 (6)
2.00 mm × 1.25 mm
SN74LVC2G07
DRY SON (6)
1.45 mm × 1.00 mm
DSF SON (6)
1.00 mm × 1.00 mm
DSBGA (6)
1.41 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at the end of the datasheet.
Functional Block Diagram
1A 1
6 1Y
2A 3
4 2Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ...................... 4 6.4 Thermal Information .................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Switching Characteristics from –40°C to 85°C ......... 5 6.7 Switching Characteristics from –40°C to 125°C ....... 5 6.8 Operating Characteristics.......................................... 5 6.9 Typical Characteristics .............................................. 6 7 Parameter Measurement Information .................. 7 7.1 (Open-Drain) ............................................................. 7 8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8 8.2 Functional Block Diagram ......................................... 8 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application ................................................... 9 10 Power Supply Recommendations ..................... 10 11 Layout................................................................... 10 11.1 Layout Guidelines ................................................. 10 11.2 Layout Examples................................................... 10 12 Device and Documentation Support ................. 11 12.1 Documentation Support ........................................ 11 12.2 Community Resources.......................................... 1.