SN74LVC1G38 Gate Datasheet

SN74LVC1G38 Datasheet, PDF, Equivalent


Part Number

SN74LVC1G38

Description

Single 2-Input NAND Gate

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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SN74LVC1G38
SCES538F – JANUARY 2004 – REVISED OCTOBER 2017
SN74LVC1G38 Single 2-Input NAND Gate With Open-Drain Output
1 Features
1 Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Supports Down Translation to VCC
• Maximum tpd of 4.5 ns at 3.3 V
• Low Power Consumption, 10-µA Maximum ICC
• ±24-mA Output Drive at 3.3 V
• Ioff Supports Partial-Power-Down Mode and Back-
Drive Protection
2 Applications
• AV Receivers
• Blu-ray Players and Home Theaters
• DVD Recorders and Players
• Desktop or Notebook PCs
• Digital Radio or Internet Radio Players
• Digital Video Cameras (DVC)
• Embedded PCs
• GPS: Personal Navigation Devices
• Mobile Internet Devices
• Network Projector Front-Ends
• Portable Media Players
• Pro Audio Mixers
• Smoke Detectors
• Solid State Drive (SSD): Enterprise
• High-Definition (HDTV)
• Tablets: Enterprise
• Audio Docks: Portable
• DLP Front Projection Systems
• DVR and DVS
• Digital Picture Frame (DPF)
• Digital Still Cameras
3 Description
The SN74LVC1G38 device is designed for 1.65-V to
5.5-V VCC operation.
This device is a single two-input NAND buffer gate
with open-drain output. It performs the Boolean
function Y = A × B or Y = A + B in positive logic.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.
NanoStar™ and NanoFree™ package technology is
a major breakthrough in IC packaging concepts,
using the die as the package.
Device Information(1)
DEVICE NAME
PACKAGE BODY SIZE (NOM)
SN74LVC1G38DBV SOT-23 (5)
2.90 mm × 1.60 mm
SN74LVC1G38DCK SC70 (5)
2.00 mm × 1.25 mm
SN74LVC1G38DRY SON (6)
1.45 mm × 1.00 mm
SN74LVC1G38DSF SON (6)
1.00 mm × 1.00 mm
SN74LVC1G38YZP DSBGA (5)
0.89 mm × 1.39 mm
SN74LVC1G38DPW X2SON (5)
0.80 mm × 0.80 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
1
A
4
Y
2
B
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC1G38
SN74LVC1G38
SCES538F – JANUARY 2004 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics, CL = 15 pF ...................... 6
6.7 Switching Characteristics, CL = 30 pF or 50 pF,
–40°C to +85°C.......................................................... 6
6.8 Switching Characteristics, CL = 30 pF or 50 pF,
–40°C to +125°C........................................................ 7
6.9 Operating Characteristics.......................................... 7
6.10 Typical Characteristics ............................................ 7
7 Parameter Measurement Information .................. 8
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 11
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 13
12 Device and Documentation Support ................. 14
12.1 Documentation Support ........................................ 14
12.2 Receiving Notification of Documentation Updates 14
12.3 Community Resources.......................................... 14
12.4 Trademarks ........................................................... 14
12.5 Electrostatic Discharge Caution ............................ 14
12.6 Glossary ................................................................ 14
13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (August 2017) to Revision F
Page
• Added values for DPW (X2SON) package in Thermal Information table. ............................................................................. 5
Changes from Revision D (December 2013) to Revision E
Page
• Added DPW (X2SON) package.............................................................................................................................................. 1
• Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal
Information table, Typical Characteristics, Detailed Description section, Application and Implementation section,
Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section .................................................................................................................................................................................... 1
• Added Maximum junction temperature, TJ ............................................................................................................................. 4
• Changed values in the Thermal Information table to align with JEDEC standards................................................................ 5
Changes from Revision C (March 2011) to Revision D
Page
• Updated document to new TI data sheet format. ................................................................................................................... 1
• Updated Ioff in Features. ......................................................................................................................................................... 1
• Added ESD warning. .............................................................................................................................................................. 1
• Updated operating temperature range. .................................................................................................................................. 5
2 Submit Documentation Feedback
Copyright © 2004–2017, Texas Instruments Incorporated
Product Folder Links: SN74LVC1G38


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity SN74LVC1G38 SCES538F – JANUAR Y 2004 – REVISED OCTOBER 2017 SN74LVC 1G38 Single 2-Input NAND Gate With Open -Drain Output 1 Features •1 Latch-Up Performance Exceeds 100 mA Per JESD 78 , Class II • ESD Protection Exceeds J ESD 22 – 2000-V Human-Body Model (A11 4-A) – 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101) Available in the Texas Instruments N anoStar™ and NanoFree™ Packages • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Supports D own Translation to VCC • Maximum tpd of 4.5 ns at 3.3 V • Low Power Consum ption, 10-µA Maximum ICC • ±24-mA O utput Drive at 3.3 V • Ioff Supports Partial-Power-Down Mode and Back- Drive Protection 2 Applications • AV Recei vers • Blu-ray Players and Home Theat ers • DVD Recorders and Players • D esktop or Notebook PCs • Digital Radi o or Internet Radio Players • Digital Video Cameras (DVC) • Embedded PCs • GPS: Personal Navigation Devices •.
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