TXB0102 Translator Datasheet

TXB0102 Datasheet, PDF, Equivalent


Part Number

TXB0102

Description

2-Bit Bidirectional Voltage-Level Translator

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and
±15-kV ESD Protection
1 Features
1 Available in the Texas Instruments NanoFree™
Packages
• 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
B Port (VCCA VCCB)
• VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
• OE Input Circuit Referenced to VCCA
• Low Power Consumption, 4-µA Max ICC
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 15-kV Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
2 Applications
• Handsets
• Smartphones
• Tablets
• Desktop PCs
3 Description
The TXB0102 device is a 2-bit noninverting translator
that uses two separate configurable power-supply
rails. The A port is designed to track VCCA. VCCA
accepts any supply voltage from 1.2 V to 3.6 V. The
B port is designed to track VCCB. VCCB accepts any
supply voltage from 1.65 V to 5.5 V. This allows for
universal low-voltage bidirectional translation between
any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V
voltage nodes. VCCA must not exceed VCCB.
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.
OE must be tied to GND through a pulldown resistor
to assure the high-impedance state during power up
or power down; the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
NanoFree™ technology is a major breakthrough in IC
packaging concepts, using the die as the package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TXB0102DCU
VSSOP (8)
2.30 mm × 2.00 mm
TXB0102YZP
DSBGA (8)
0.90 mm × 1.80 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Operating Circuit
VCCB
Processor
Peripheral
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TXB0102
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics: TA = 25°C ....................... 6
6.6 Electrical Characteristics: TA = –40°C to +85°C(1) (2)
................................................................................... 7
6.7 Operating Characteristics.......................................... 8
6.8 VCCA = 1.2 V Timing Requirements ........................ 10
6.9 VCCA = 1.5 V ± 0.1 V Timing Requirements ........... 10
6.10 VCCA = 1.8 V ± 0.15 V Timing Requirements ....... 10
6.11 VCCA = 2.5 V ± 0.2 V Timing Requirements ......... 10
6.12 VCCA = 3.3 V ± 0.3 V Timing Requirements ......... 11
6.13 VCCA = 1.2 V Switching Characteristics ................ 11
6.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics ... 13
6.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics . 15
6.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics ... 17
6.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics ... 18
6.18 Typical Characteristics .......................................... 19
7 Parameter Measurement Information ................ 20
8 Detailed Description ............................................ 21
8.1 Overview ................................................................. 21
8.2 Functional Block Diagram ....................................... 21
8.3 Feature Description................................................. 22
8.4 Device Functional Modes........................................ 23
9 Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Application ................................................. 24
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 26
12 Device and Documentation Support ................. 27
12.1 Documentation Support ........................................ 27
12.2 Receiving Notification of Documentation Updates 27
12.3 Community Resources.......................................... 27
12.4 Trademarks ........................................................... 27
12.5 Electrostatic Discharge Caution ............................ 27
12.6 Glossary ................................................................ 27
13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2014) to Revision D
Page
• Changed format of Pin Functions tables. ............................................................................................................................... 3
• Added Junction temperature, TJ in Absolute Maximum Ratings ............................................................................................ 4
Changes from Revision B (March 2012) to Revision C
Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision A (January 2011) to Revision B
Page
• Added notes to pin out graphics............................................................................................................................................. 3
Changes from Original (May 2007) to Revision A
Page
• Added ball labels to the YZP Package. .................................................................................................................................. 3
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Product Folder Links: TXB0102
Copyright © 2007–2017, Texas Instruments Incorporated


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity Reference Design TXB0102 SCES6 41D – MAY 2007 – REVISED OCTOBER 20 17 TXB0102 2-Bit Bidirectional Voltage- Level Translator With Auto Direction Se nsing and ±15-kV ESD Protection 1 Fea tures •1 Available in the Texas Instr uments NanoFree™ Packages • 1.2 V t o 3.6 V on A Port and 1.65 V to 5.5 V O n B Port (VCCA ≤ VCCB) • VCC Isolat ion Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Imp edance State • OE Input Circuit Refer enced to VCCA • Low Power Consumption , 4-µA Max ICC • Ioff Supports Parti al-Power-Down Mode Operation • Latch- Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Bo dy Model (A114-B) – 200-V Machine Mod el (A115-A) – 1500-V Charged-Device M odel (C101) – B Port – 15-kV Human- Body Model (A114-B) – 200-V Machine M odel (A115-A) – 1500-V Charged-Device Model (C101) 2 Applications • Handsets • Smartphones • Tablets • De.
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