2:1 Mux/DeMux. PI3B3257 Datasheet

PI3B3257 Mux/DeMux. Datasheet pdf. Equivalent

PI3B3257 Datasheet
Recommendation PI3B3257 Datasheet
Part PI3B3257
Description 3.3V Quad 2:1 Mux/DeMux
Feature PI3B3257; A product Line of Diodes Incorporated PI3B3257 3.3V, Quad 2:1 Mux/DeMux NanoSwitch™ Features ¼¼Ne.
Manufacture Diodes
Datasheet
Download PI3B3257 Datasheet




Diodes PI3B3257
A product Line of
Diodes Incorporated
PI3B3257
3.3V, Quad 2:1 Mux/DeMux NanoSwitch™
Features
¼¼Near-Zero propagation delay
¼¼5Ω switches connect inputs to outputs
¼¼Fast Switching Speed: 4.8ns max.
¼¼Ultra-Low Quiescent Power: 0.1µA typical
– Ideally suited for notebook applications
¼¼Pin compatible with 74 series 257 logic devices
¼¼Packaging (Pb-free & Green avaliable):
– 16-pin, QSOP (Q)
– 16-pin, SOIC (W)
– 16-pin, TSSOP (L)
– 16-pin, UQFN (ZHD)
Block Diagram
IA0 IA1 IB0 IB1 IC0 IC1 ID0 ID1
SW
SW
E SW
SW
SW
S SW
SW
SW
YA YB
SW
YC YD
IY
E
Pin Configuration (QSOP, SOIC, TSSOP)
S
IA0
IA1
YA
IB0
IB1
YB
GND
1
2
3
4
5
6
7
8
16 VCC
15 E
14 ID0
13 ID1
12 YD
11 IC0
10 IC1
9 YC
PI3B3257
Document Number DS40430 Rev 2-2
Description
The PI3B3257 is a 3.3 Volt, Quad 2:1 multiplexer/demultiplexer
with three-state outputs that is pinout and function compatible
with the PI74FCT257T, 74F257, and 74ALS/AS/LS257. Inputs can
be connected to outputs with low On-Resistance (5Ω) with no
additional ground bounce noise or propagation delay.
Pin Configuration (UQFN)
16 15 14 13
S1
12 YD
IA0 2
11 IC0
IA1 3
10 IC1
YA 4
9 YC
5678
Transparent top view
Truth Table(1)
E S YA YB
H X Hi-Z Hi-Z
L L IA0 IB0
L H IA1 IB1
Note:
1. H = High Voltage Level
L = Low Voltage Level
Pin Description
YC
Hi-Z
IC0
IC1
YD
Hi-Z
ID0
ID1
Function
Disable
S=0
S=1
Pin Name
IAN-IDN
S
Description
Data Inputs
Select Inputs
E Enable
YA-YD
GND
Data Outputs
Ground (1)
VCC Power
NC No Connect
Note 1: UQFN16 package die supply ground is connected to both GND pin and
exposed center pad. GND pin must be connected to supply ground for proper de-
vice operation. For enhanced thermal, electrical, and board level performance, the
exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need
to be incorporated in the PCB in the thermal pad region.
www.diodes.com
April 2018
1 Diodes Incorporated



Diodes PI3B3257
A product Line of
Diodes Incorporated
PI3B3257
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature...................................................................... –65°C to +150°C
Ambient Temperature with Power Applied..................................... –40°C to +85°C
Supply Voltage to Ground Potential..................................................–0.5V to +4.6V
DC Input Voltage..............................................................................–0.5V to +4.6V
DC Output Current......................................................................................... 120mA
Note:
Stresses greater than those listed under MAXIMUM
RATINGS may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification
is not mplied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Power Dissipation............................................................................................. 0.5W
DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC = 3.3V ±10%)
Parameters Description
Test Conditions(1)
Min. Typ.(2)
Max.
Units
VIH Input HIGH Voltage
VIL Input LOW Voltage
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
2
–0.5
V
0.8
IIH Input HIGH Current
VCC = Max., VIN = VCC
±1
IIL Input LOW Current
VCC = Max., VIN = GND
±1 µA
IOZH
High Impedance Output Current 0 ≤ In, Yn ≤ VCC
±1
VIK Clamp Diode Voltage
VCC = Min., IIN = –18mA
–1.2 V
VCC = Min., VIN = 0.0V,
RON
Switch On-Resistance(3)
Ion = 48mA or 64mA
VCC = Min., VIN = 2.4V, ION = 15mA
58
8 17
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VCC = 3.3V, TA = 25°C ambient and maximum loading.
3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two
(I,Y) pins.
Capacitance (TA = 25°C, f = 1 MHz)
Parameters(1) Description
Test Conditions
CIN Input Capacitance
COFFYN
COFFIN
YN Capacitance, Switch OFF
IN Capacitance, Switch OFF
VIN = 0V
CON IN/YN Capacitance, Switch ON
Notes:
1. This parameter is determined by device characterization but is not production tested.
Typ. Units
3.0
17.0 pF
8.5
25
Power Supply Characteristics
Parameters Description
Test Conditions(1)
Min. Typ.(2) Max. Units
ICC
∆ICC
Quiescent Power Supply Current
Supply Current per Input @ TTL
HIGH(3, 4)
VCC = Max.
VCC = Max.
VIN = GND or VCC
VIN = 3.0
0.1 3.0
µA
750
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device.
2. Typical values are at VCC = 3.3V, +25°C ambient.
3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC.
4. This current applies to the control inputs only and represent the current required to switch internal capacitance at the specified frequency. The I and Y inputs
generate no significant AC or DC currents as they transition. This parameter is not tested, but is guaranteed by design.
PI3B3257
Document Number DS40430 Rev 2-2
www.diodes.com
April 2018
2 Diodes Incorporated



Diodes PI3B3257
A product Line of
Diodes Incorporated
PI3B3257
Switching Characteristics Over Operating Range
PI3B3257
Parameters Description
Conditions
Com.
Units
tIY Propagation Delay In to Yn(1,2)
Min.
Max.
0.25
tSY Bus Select Time, Sn to Yn
tPZH
tPZL
Bus Enable Time, E to Yn
tPHZ
tPLZ
Bus Disable Time, E to Yn
CL = 50pF
RL = 500Ω
1 4.5
1 4.5 ns
1 4.8
Notes:
1. This parameter is guaranteed but not tested on Propagation Delays.
2. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The switch’s time constant
alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propaga-
tional delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and
its interaction with the load on the driven side.
Applications Information
Logic Inputs
The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a + 3.3V supply, IN may be driven
low to 0V and high to 3.6V. Driving IN Rail-to-Rail® minimizes power consumption.
Power-Supply Sequencing and Hot-Plug Information
Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/
output or control pins.
Rail-to-Rail is a registeredtrademark of Nippon Motorola, Ltd.
Part Marking
Q Package W Package L Package
PI3B
3257QE
YWXX
PI3B
3257WE
YYWWXX
PI3B
3257LE
YYWWXX
Y: Year
W: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
YY: Date Code (Year)
WW: Date Code (Workweek)
1st X: Assembly Site Code
2nd X: Fab Site Code
YY: Year
WW: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
ZHD Package
wDZHDE
YWXX
Y: Year
W: Workweek
1st X: Assembly Site Code
2nd X: Fab Site Code
PI3B3257
Document Number DS40430 Rev 2-2
www.diodes.com
April 2018
3 Diodes Incorporated





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