Document
Datasheet
Power Management Integrated Circuit
BD71850MWV
General Description BD71850MWV is a programmable Power Management
IC (PMIC) for powering single-core, dual-core, and quad-core SoC’s such as NXP-i.MX 8M Nano. It is
optimized for low BOM cost and compact solution footprint. It integrates 6 Buck regulators and 6 LDO’s to
provide all the power rails required by the SoC and the
commonly used peripherals. QFN package and pinout support low cost Type 3
(non-HDI) PCB. Programmable power sequencing
and output voltages, flexible power state control for
easier system design and supports a wide variety of
processors and system implementations.
Features 6 Buck Regulators 2.0 MHz Switching Frequency.
(BUCK1, BUCK2, BUCK5, BUCK7, and BUCK8). 1.5MHz Switching Frequency. (BUCK6) Target Efficiency: 83% to 95%. Output Current & Voltage.
BUCK1: 3.0 A, 0.7 V to 1.3 V/10 mV step, DVS
BUCK2: 3.0 A, 0.7 V to 1.3 V/10 mV step, DVS
BUCK5: 3.0 A, 0.70 V to 1.35 V/8steps, DVS
BUCK6: 3.0 A, 2.6 V to 3.3 V/100 mV step
BUCK7: 1.5 A, 1.605 V to 1.995 V/8steps
BUCK8: 3.0 A, 0.8 V to 1.4 V/10 mV step 6ch Linear Regulators (6 LDOs)
LDO1: 10 mA, 3.0 V to 3.3 V, 1.6 V to 1.9 V LDO2: 10 mA, 0.9 V, 0.8 V LDO3: 300 mA, 1.8 V to 3.3 V LDO4: 250 mA, 0.9 V to 1.8 V LDO5: 300 mA, 0.8 V to 3.3 V LDO6: 300 mA, 0.9 V to 1.8 V Power Mux Switch 1.8V Input: 500 mΩ(Max) 3.3V Input: 500 mΩ(Max) 32.768 kHz Crystal Oscillator Driver Power Button Detector Protection and Monitoring: Soft Start, Power Rails Fault
Detection, UVLO, OVP and TSD OTP Configurable Power Sequencing OTP and Software Programmable Output Voltage,
Ramp rates. Hardware Signaling with SoC for Transition into or out
of Low Power States Interfaces:
I2C: 100 kHz/400 kHz, 1 MHz Power-on Reset Output: POR_B, RTC_RESET_B, Watchdog Reset Input: WDOG_B: Power State Control:
PMIC_STBY_REQ, PMIC_ON_REQ, PWRON_B Interrupt to SoC: IRQ_B Type3 PCB Applicable
Key Specifications Input Voltage Range (VSYS):
SNVS State Current: SUSPEND State Current: IDLE State Current: RUN State Current: Operating Temperature Range:
2.7 V to 5.5 V 30 μA(Typ)
115 μA(Typ) 125 μA(Typ) 125 μA(Typ)
-40°C to +85°C
Applications
Streaming Media Boxes and Dongles AV Receivers and Wireless Sound Bars Industrial HMI, SBC, IPC and Panel Computer
Package UQFN56BV7070
W(Typ) x D(Typ) x H(Max) 7.00 mm x 7.00 mm x 1.00 mm
Product structure : Silicon integrated circuit. This product has no designed protection against radioactive rays
www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. TSZ2211114001
1/116
TSZ02201-0Q2Q0A500680-1-2 27.Sep.2019 Rev.001
BD71850MWV
Contents
General Description ................................................................................................................................................................1
Features .................................................................................................................................................................................1
Key Specifications...................................................................................................................................................................1
Applications ............................................................................................................................................................................1
Package
W(Typ) x D(Typ) x H(Max) ...........................................................................................................1
1. Introduction.....................................................................................................................................................................7
1.1. Terminology ............................................................................................................................................................7
1.2. System Power Map & Typical Application Circuit ......................................................................................................8
1.3. Pin Configuration .................................................................................................................................................. 10
1.4. Pin Description...................................................................................................................................................... 11
1.5. I/O Equivalence Circuit .......................................................................................................................................... 12
1.6. Power Rail ............................................................................................................................................................ 13
1.7. Register Map ............................................................................................