Document
High End 24-Bit Sensor Signal Conditioner IC
ZSSC3224
Datasheet
Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC for highaccuracy amplification and analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor.
The measured and corrected sensor values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory. Programming the ZSSC3224 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3224 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency.
Applications
Barometric altitude measurement for portable navigation or emergency call systems; altitude measurement for car navigation
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
ZSSC3224 Application Example
VSS
VDD
Stacked-Die Sensor Module
VDD
VSS RES EOC MISO
VDD VSS
RES VDDB INN EOC MISO
ZSSC3224
VDDB
INP(+)
sensor element
INN(-)
VSSB
SS
INP VSSB MOSI
SDA SCLK
SCL
SS
MOSI SDA
SCLK SCL
Microcontroller
Signal Output / Post-processing
Features
Flexible, programmable analog front-end design; up to 24-bit analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing sensor signals: gain range 6.6 to 216 (linear)
Internal auto-compensated 18-bit temperature sensor
Digital compensation of individual sensor offset; 1st and 2nd order digital compensation of sensor gain as well as 1st and 2nd order temperature gain and offset drift
Programmable interrupt operation
High-speed sensing: e.g., 18-bit conditioned sensor signal measurement rate >200s-1
Typical sensor elements can achieve an accuracy of better than ±0.10% full scale output (FSO) at -40 to 85°C
Integrated 26-bit calibration math digital signal processor (DSP)
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for highdensity chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery applications
Optimized for operation in calibrated resistive (e.g., pressure) sensor or calibrated absolute voltage (e.g., thermopile) sensor modules
Supply voltage range: 1.68V to 3.6V
Operating mode current: ~1.0mA (typical)
Sleep Mode current: 20nA (typical)
Temperature resolution: <0.7mK/LSB
Excellent energy-efficiency: with 18-bit resolution: <100pJ/step with 24-bit resolution: <150nJ/step
Small die size
Operation temperature: –40°C to +85°C
Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer bonding
© 2018 Integrated Device Technology, Inc
1
November 12, 2018
ZSSC3224 Block Diagram
VDDB VTP
VTN
Temperature Reference
Sensor
Multiplexer
Sensor Bridge
INP INN VSSB
Power-ON Rese t
ZSSC3224 Datasheet
Vreg int
AGND / CM Generator
Bias Current Generator
Voltage Regulator Power Ctr.
ZSSC3224
Pre-amplifier
A D
24 Bit
DSP Core (Calculations, Communication)
Clock G enerat or
Oscillator
System Control
Unit
SPI MTP I2C
VDD VSS
EOC
SCLK/SCL SS MOSI/SDA MISO RES
© 2018 Integrated Device Technology, Inc
2
November 12, 2018
ZSSC3224 Datasheet
Contents
1. Pin and Pad Assignments and Descriptions.................................................................................................................................................6 1.1 ZSSC3224 Die Pad Assignments and Descriptions ............................................................................................................................6 1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions .............................................................................................................7
2. Absolute Maximum Ratings.............................................................................................................