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ZSSC3224 Dataheets PDF



Part Number ZSSC3224
Manufacturers Renesas
Logo Renesas
Description High End 24-Bit Sensor Signal Conditioner
Datasheet ZSSC3224 DatasheetZSSC3224 Datasheet (PDF)

High End 24-Bit Sensor Signal Conditioner IC ZSSC3224 Datasheet Brief Description The ZSSC3224 is a sensor signal conditioner (SSC) IC for highaccuracy amplification and analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it .

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High End 24-Bit Sensor Signal Conditioner IC ZSSC3224 Datasheet Brief Description The ZSSC3224 is a sensor signal conditioner (SSC) IC for highaccuracy amplification and analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected sensor values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory. Programming the ZSSC3224 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3224 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency. Applications  Barometric altitude measurement for portable navigation or emergency call systems; altitude measurement for car navigation  Weather forecast  Fan control  Industrial, pneumatic, and liquid pressure  High-resolution temperature measurements  Object-temperature radiation (via thermopile) ZSSC3224 Application Example VSS VDD Stacked-Die Sensor Module VDD VSS RES EOC MISO VDD VSS RES VDDB INN EOC MISO ZSSC3224 VDDB INP(+) sensor element INN(-) VSSB SS INP VSSB MOSI SDA SCLK SCL SS MOSI SDA SCLK SCL Microcontroller Signal Output / Post-processing Features  Flexible, programmable analog front-end design; up to 24-bit analog-to-digital converter (ADC)  Fully programmable gain amplifier for optimizing sensor signals: gain range 6.6 to 216 (linear)  Internal auto-compensated 18-bit temperature sensor  Digital compensation of individual sensor offset; 1st and 2nd order digital compensation of sensor gain as well as 1st and 2nd order temperature gain and offset drift  Programmable interrupt operation  High-speed sensing: e.g., 18-bit conditioned sensor signal measurement rate >200s-1  Typical sensor elements can achieve an accuracy of better than ±0.10% full scale output (FSO) at -40 to 85°C  Integrated 26-bit calibration math digital signal processor (DSP)  Fully corrected signal at digital output  Layout customized for die-die bonding with sensor for highdensity chip-on-board assembly  One-pass calibration minimizes calibration costs  No external trimming, filter, or buffering components required  Highly integrated CMOS design  Integrated reprogrammable non-volatile memory  Excellent for low-voltage and low-power battery applications  Optimized for operation in calibrated resistive (e.g., pressure) sensor or calibrated absolute voltage (e.g., thermopile) sensor modules  Supply voltage range: 1.68V to 3.6V  Operating mode current: ~1.0mA (typical)  Sleep Mode current: 20nA (typical)  Temperature resolution: <0.7mK/LSB  Excellent energy-efficiency: with 18-bit resolution: <100pJ/step with 24-bit resolution: <150nJ/step  Small die size  Operation temperature: –40°C to +85°C  Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer bonding © 2018 Integrated Device Technology, Inc 1 November 12, 2018 ZSSC3224 Block Diagram VDDB VTP VTN Temperature Reference Sensor Multiplexer Sensor Bridge INP INN VSSB Power-ON Rese t ZSSC3224 Datasheet Vreg int AGND / CM Generator Bias Current Generator Voltage Regulator Power Ctr. ZSSC3224 Pre-amplifier A D 24 Bit DSP Core (Calculations, Communication) Clock G enerat or Oscillator System Control Unit SPI MTP I2C VDD VSS EOC SCLK/SCL SS MOSI/SDA MISO RES © 2018 Integrated Device Technology, Inc 2 November 12, 2018 ZSSC3224 Datasheet Contents 1. Pin and Pad Assignments and Descriptions.................................................................................................................................................6 1.1 ZSSC3224 Die Pad Assignments and Descriptions ............................................................................................................................6 1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions .............................................................................................................7 2. Absolute Maximum Ratings.............................................................................................................


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