Document
CYStech Electronics Corp.
PNP Epitaxial Planar Power Transistor
BTP949L3
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 1/6
Features
• Extremely low equivalent on-resistance, RCE(sat) = 75mΩ(max) @ IC = -3A, IB=-0.1A • 6A continuous current(up to 20A peak) • Excellent current gain linearity • Pb-free package
Symbol
BTP949L3
Outline
C
SOT-223
B:Base C:Collector E:Emitter
E C B
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
Collector-Base Voltage
VCBO
-50 V
Collector-Emitter Voltage
VCEO
-30 V
Emitter-Base Voltage
VEBO
-6 V
Collector Current (DC) Collector Current (Pulse)
IC ICP
-5.5 -20 (Note 1)
A
Power Dissipation @ TA=25℃
Ptot
3 (Note 2)
W
Junction Temperature
Tj 150 °C
Storage Temperature
Tstg
-55~+150
°C
Note : 1. Single Pulse , Pw≦380µs, Duty≦2%.
2. The power which can be dissipated assuming the device is mounted in a typical manner on a P.C.B. with copper
equal to 4 square inch minimum.
BTP949L3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 2/6
Characteristics (Ta=25°C)
Symbol
*BVCEO BVCBO BVCER BVEBO
ICER ICBO IEBO *VCE(sat) 1 *VCE(sat) 2 *VCE(sat) 3 *VCE(sat) 4 *VBE(sat) *VBE(on) *hFE 1 *hFE 2 *hFE 3 *hFE 4 fT Cob ton
toff
Min.
-30 -50 -50 -6
100 100 60 -
-
Typ.
-60 -100 -190 -380 -1.1 200 200 80 10 100 122 120
130
Max.
-50 -50 -10 -75 -140 -270 -440 -1.25 -1.06 300 -
-
Unit
V V V V µA nA nA mV mV mV mV V V MHz pF ns
ns
Test Conditions
IC=-10mA, IB=0 IC=-100µA, IE=0 IC=-1µA, RBE≤1kΩ IE=-100µA, IC=0 VCE=-40V, RBE≤1kΩ VCB=-40V, IB=0 VEB=-6V, IC=0 IC=-500mA, IB=-20mA IC=-1A, IB=-20mA IC=-2A, IB=-200mA IC=-5.5A, IB=-500mA IC=-5.5A, IB=-500mA VCE=-1V, IC=-5.5A VCE=-1V, IC=-10mA VCE=-1V, IC=-1A VCE=-1V, IC=-5A VCE=-2V, IC=-20A VCE=-10V, IC=-100mA, f=50MHz VCB=-10V, f=1MHz VCC=-10V, IC=10IB1=-10IB2=4A, RL=2.5Ω
*Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2%
Ordering Information
Device BTN949L3
Package
SOT-223 (Pb-free)
Shipping 1000 pcs / Tape & Reel
Marking P949
BTP949L3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 3/6
Characteristic Curves
Current Gain---HFE
Current Gain vs Collector Current 1000
VCE=2V
100 VCE=1V
10000
Saturation Voltage vs Collector Current
VCE(SAT)
1000
100 IC=30IB
IC=50IB
Saturation Voltage---(mV)
Saturation Voltage---(mV)
10 1
10 100 1000 Collector Current---IC(mA)
10000
10000
Saturation Voltage vs Collector Current
VBE(SAT)@IC=50IB
1000
100 1
10 100 1000 Collector Current---IC(mA)
10000
Collector Current---IC(mA)
10 1
10 100 1000 Collector Current---IC(mA)
10000
Grounded Emitter Output Characteristics
4000 3500
20mA
3000
2500 2000
10mA
1500
1000 500
0 0
6mA
2mA IB=0
12345 Collector-to-Emitter Voltage---VCE(V)
6
Collector Current---IC(mA)
Grounded Emitter Output Characteristics
8000 7000 6000 5000 4000 3000 2000 1000
0 0
50mA
25mA
10mA 5mA IB=0mA
12345 Collector-to-Emitter Voltage---VCE(V)
6
Power Dissipation---PD(W)
3.5 3
2.5 2
1.5 1
0.5 0 0
Power Derating Curve
50 100 150 Ambient Temperature---TA(℃)
200
BTP949L3
CYStek Product Specification
Reel Dimension
CYStech Electronics Corp.
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 4/6
BTP949L3
CYStek Product Specification
CYStech Electronics Corp.
Carrier Tape Dimension
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 5/6
BTP949L3
CYStek Product Specification
CYStech Electronics Corp.
SOT-223 Dimension
Spec. No. : C657L3 Issued Date : 2005.10.14 Revised Date : Page No. : 6/6
A Marking:
B 1
C 23
P949
D E
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
H a1 I a2
3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3
DIM
Inches Min. Max.
A 0.1142 0.1220
B 0.2638 0.2874
C 0.1299 0.1457
D 0.0236 0.0315
E *0.0906
-
F 0.2480 0.2638
Millimeters
Min. Max.
2.90 3.10
6.70 7.30
3.30 3.70
0.60 0.80
*2.30
-
6.30 6.70
DIM
Inches Min. Max.
G 0.0551 0.0709
H 0.0098 0.0138
I 0.0008 0.0039
a1 *13o
-
a2 0 o
10 o
*: Typical
Millimeters
Min. Max.
1.40 1.80
0.25 0.35
0.02 0.10
*13o
-
0 o 10 o
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Su.