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DLPC3430, DLPC3435 DLPS038F – JULY 2014 –DRLEPVCIS3ED43N0O,VDELMPBECR32403250
DLPS038F – JULY 2014 – REVISED NOVEMBER 2020
DLPC3430 and DLPC3435 Display Controller
1 Features
• Display controller for DLP2010 (.2 WVGA) DMD – Supports input image sizes up to 720p and scales to WVGA – Low-power DMD interface with interface training
• Input frame rates up to 240 Hz • Pixel data processing:
– IntelliBright™ suite of image processing algorithms • Content adaptive illumination control (CAIC) • Local area brightness boost (LABB)
– Image resizing (scaling) – 1D Keystone correction – Color coordinate adjustment – Active power management processing – Programmable degamma – Color space conversion – 4:2:2 to 4:4:4 chroma interpolation • 24-Bit, input pixel interface support: – Parallel or BT656, interface protocols – Pixel clock up to 155 MHz – Multiple input pixel data format options • MIPI® DSI (display serial interface) Type 3 (DLPC3430 controller only): – 1-4 lanes, up to 470 Mbps lane speed • External flash support • Auto DMD parking at power down • Embedded frame memory (eDRAM) • System Features: – I2C device control – Programmable splash screens – Programmable LED current control – Display image rotation – One frame latency • Pair with DLPA2000, DLPA2005, or DLPA3000 PMIC (power management integrated circuit) and LED driver
2 Applications
• Mobile projector • Smart display • Smartphone • Augmented reality glasses • Smart home displays • Pico projectors
3 Description
The DLPC3430 or DLPC3435 digital controller, part of the DLP2010 (.2 WVGA) chipset, enables operation of the DLP2010 digital micromirror device (DMD). The DLPC3430 and DLCP3435 controllers provide a convenient, multi-functional interface between user electronics and the DMD, enabling small form factor and low power display applications.
Visit the getting started with TI DLP®Pico™ display technology page, and view the programmer's guide to learn how to get started.
The chipsets include established resources to help the user accelerate the design cycle, which include production ready optical modules, optical module manufacturers, and design houses.
Device Information (1) (2)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DLPC3430
NFBGA (176)
7.00 × 7.00 mm2
DLPC3435
NFBGA (201)
13.00 × 13.00 mm2
(1) For all available packages, see the orderable addendum at the end of the datasheet.
(2) DSI is available only for the DLPC3430. DSI not available for DLPC3435.
SYSPWR
1.8 V external PROJ_ON
I2C HOST_IRQ
DSI (10)
Parallel (28)
SPI (4)
1.8 V
GPIO_8
SPI1
RESETZ
PARKZ
VDDLP12 VDD
DLPC34xx
SPI0
VCC_18 VCC_INTF VCC_FLSH
VLED 1.8 V
DLPA200x
RLIM
Illumination optics VOFFSET, VBIAS, VRESET
CTRL Sub-LVDS
1.8 V
DMD
To Flash
Typical, Simplified System
CopyrighAtn©I2M0P20OTReTxaAsNInTsNtruOmTeInCtsEInactotrhpeoreatnedd of this data sheet addresses availability, warranty, changes, use iSnusbamfeittyD-corcituicmael anpt pFleiceadtbioancsk,
1
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLPC3430, DLPC3435
DLPS038F – JULY 2014 – REVISED NOVEMBER 2020
www.ti.com
Table of Contents
1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................6
5.1 Test Pins and General Control.................................... 8 5.2 Parallel Port Input....................................................... 9 5.3 DSI Input Data and Clock......................................... 10 5.4 DMD Reset and Bias Control....................................10 5.5 DMD Sub-LVDS Interface......................................... 10 5.6 Peripheral Interface...................................................11 5.7 GPIO Peripheral Interface.........................................12 5.8 Clock and PLL Support............................................. 14 5.9 Power and Ground....................................................14 6 Specifications................................................................ 16 6.1 Absolute Maximum Ratings...................................... 16 6.2 ESD Ratings............................................................. 16 6.3 Recommended Operating Conditions.......................17 6.4 Thermal Information..................................................17 6.5 Power Electrical Characteristics............................... 18 6.6 Pin Electrical Characteristics.................................... 19 6.7 Internal Pullup and Pulldown Electrical
Characteristics.............................................................21 6.8 DMD Sub-LVDS Interface Electrical
Cha.