GLZ2.7

GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES Planar Die construction 500mW Power Dissipation Ideally Suited for Automated Assembly Processes Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below Approx. Weight: 0.03 grams Mounting Position: Any MINI-MELF / LL-34 0.063(1.6) 0.055(1.4) DIA. 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) 0.020(0.5) 0.012(0.3) Dimensions in inches and (millimeters) ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ ) Symbols Zener current see table "Characteristics" Power dissipation at TA=25℃ Ptot Junction temperature TJ Storage temperature range TSTG 1)Valid provided that at a distance of 8mm from case are kept at ambient temperature Value 5001) 175 -65 to + 175 Units mW ℃ ℃ ELECTRICAL CHARACTERISTICS(TA=25℃ ) Symbols Min. Thermal resistance junction to ambient RTHA Forward voltage at IF=100mA VF 1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature Typ. Max. 0.3 1) 1 Units K/mW V GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE Part Number GLZ 2.0 GLZ 2.2 GLZ 2.4 GLZ 2.7 GLZ 3.0 GLZ 3.3 GLZ 3.6 GLZ 3.9 GLZ 4.3 GLZ 4.7 GLZ 5.1 GLZ 5.6 GLZ 6.2 GLZ 6.8 GLZ 7.5 GLZ 8.2 GLZ 9.1 GLZ 10 GLZ 11 CLASS A B A B A B A B A B A B A B A B A B C A B C A B C A B C A B C A B C A B C A B C A B C A B C D A ...