500mW SUFACE MOUNT ZENER DIODE
GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
FEATURES
• Planar Die construction • 500mW Power Dissipation • Ideally Su...
Description
GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
FEATURES
Planar Die construction 500mW Power Dissipation Ideally Suited for Automated Assembly Processes Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above
MECHANICAL DATA
Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below Approx. Weight: 0.03 grams Mounting Position: Any
MINI-MELF / LL-34
0.063(1.6) 0.055(1.4) DIA.
0.020(0.5) 0.012(0.3)
0.146(3.7) 0.130(3.3)
0.020(0.5) 0.012(0.3)
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES)(TA=25℃ )
Symbols
Zener current see table "Characteristics"
Power dissipation at TA=25℃
Ptot
Junction temperature
TJ
Storage temperature range
TSTG
1)Valid provided that at a distance of 8mm from case are kept at ambient temperature
Value
5001) 175 -65 to + 175
Units
mW
℃ ℃
ELECTRICAL CHARACTERISTICS(TA=25℃ )
Symbols
Min.
Thermal resistance junction to ambient
RTHA
Forward voltage at IF=100mA
VF
1)Valid provided that leads at a distance of 8mm from case are kept at ambient temperature
Typ.
Max. 0.3 1) 1
Units K/mW
V
GLZ2.0 ~ GLZ56
500mW SUFACE MOUNT ZENER DIODE
Part Number GLZ 2.0 GLZ 2.2 GLZ 2.4 GLZ 2.7 GLZ 3.0 GLZ 3.3 GLZ 3.6 GLZ 3.9 GLZ 4.3
GLZ 4.7
GLZ 5.1
GLZ 5.6
GLZ 6.2
GLZ 6.8
GLZ 7.5
GLZ 8.2
GLZ 9.1
GLZ 10
GLZ 11
CLASS
A B A B A B A B A B A B A B A B A B C A B C A B C A B C A B C A B C A B C A B C A B C A B C D A ...
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