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DS2477
EVALUATION KIT AVAILABLE
DeepCover Secure SHA-3 Coprocessor with ChipDNA PUF Protection
General Description
The DS2477 secure I2C coprocessor with built-in 1-Wire® master combines FIPS202-compliant secure hash algorithm (SHA-3) challenge and response authentication with Maxim’s patented ChipDNATM feature, a physically unclonable technology (PUF) to provide a cost-effective solution with the ultimate protection against security attacks. The ChipDNA implementation utilizes the random variation of semiconductor device characteristics that naturally occur during wafer fabrication. The ChipDNA circuit generates a unique output value that is repeatable over time, temperature, and operating voltage. Attempts to probe or observe ChipDNA operation modifies the underlying circuit characteristics thus preventing discovery of the unique value used by the chip cryptographic functions. The DS2477 utilizes the ChipDNA output as key content to cryptographically secure all device-stored data. With ChipDNA capability, the device provides a core set of cryptographic tools derived from integrated blocks including a SHA-3 engine, a FIPS/NIST compliant true random number generator (TRNG), 2Kb of secured EEPROM, and a unique 64-bit ROM identification number (ROM ID). The unique ROM ID is used as a fundamental input parameter for cryptographic operations and serves as an electronic serial number within the application. The DS2477 provides the SHA-3 and memory functionality required by a host system to communicate with and operate a 1-Wire SHA-3 slave. In addition, it performs protocol conversion between the I2C master and any attached 1-Wire SHA-3 slaves. For 1-Wire line driving, internal user-adjustable timers relieve the system host processor from generating time-critical 1-Wire waveforms, supporting both standard and overdrive 1-Wire communication speeds. The 1-Wire line can be powered down under software control. Strong pullup features support 1-Wire power delivery for commands that require higher current consumption.
Applications
●● Authentication of Medical Sensors and Tools ●● Secure Management of Limited Use Consumables ●● IoT Node Authentication ●● Peripheral Authentication ●● Reference Design License Management ●● Printer Cartridge Identification and Authentication
Benefits and Features
●● Robust Countermeasures Protect Against Security Attacks • Patented Physically Unclonable Function Secures Device Data • Actively Monitored Die Shield Detects and Reacts to Intrusion Attempts • All Stored Data Cryptographically Protected from Discovery
●● Efficient Secure Hash Algorithm Authenticates and Manages Peripherals • FIPS 202-Compliant SHA-3 Algorithm for Bidirectional Authentication • FIPS 198-Compliant Keyed-Hash Message Authentication Code (HMAC) • TRNG with NIST SP 800-90B Compliant Entropy Source
●● Supplemental Features Enable Easy Integration into End Applications • 2Kb of EEPROM for User Data, Key, and Control Registers • One Open-Drain GPIO Pin • Unique and Unalterable Factory Programmed 64-Bit Identification Number (ROM ID) • Large 1-Wire Block Buffer (126 bytes) for Efficient Data Transfer • 1-Wire Standard and Overdrive Timing Communication Speeds • I2C Communication, Up to 1MHz • Operating Range: 2.2V to 3.63V, -40°C to +85°C • 6-Pin TDFN-EP Package (3mm x 3mm)
Ordering Information appears at end of data sheet.
1-Wire is a registered trademark and ChipDNA is a trademark of Maxim Integrated Products, Inc.
19-100402; Rev 0; 9/18
DS2477
DeepCover Secure SHA-3 Coprocessor with ChipDNA PUF Protection
Typical Application Circuit
VCC
RP1
VCC I2C
µC PORT
GND
RP2 VCC
GPIO
DS2477
SDA IO SCL
GND
RP3 IO
IO GPIO
DS28E50
CEXT GND
IO CX
IO GPIO
DS28E50
CEXT GND
IO CX
IO GPIO
DS28E50
CEXT GND
IO CX
www.maximintegrated.com
Maxim Integrated │ 2
DS2477
DeepCover Secure SHA-3 Coprocessor with ChipDNA PUF Protection
Absolute Maximum Ratings
Voltage Range on Any Pin Relative to GND...........-0.5V to 4.0V
Storage Temperature Range............................. -40°C to +125°C
Maximum Current into Any Pin........................... -20mA to 20mA
Lead temperature (soldering, 10s)................................... +300°C
Operating Temperature Range............................ -40°C to +85°C
Soldering Temperature (reflow)........................................+260°C
Junction Temperature.......................................................+150°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Infor.