Diode Driver. LMH6526 Datasheet

LMH6526 Driver. Datasheet pdf. Equivalent


etcTI LMH6526
LMH6525, LMH6526
www.ti.com
SNOSAF1B – JUNE 2005 – REVISED MARCH 2013
LMH6525/LMH6526 Four–Channel Laser Diode Driver with Dual Output
Check for Samples: LMH6525, LMH6526
FEATURES
1
23 Fast Switching: Rise and Fall Times: 0.6/1.0
ns.
• Low Voltage Differential Signaling (LVDS)
Channels Enable Interface for the Fast
Switching Lines
• Low Output Current Noise: 0.24 nA/Hz
• Dual Output: Selectable by SELA/B Pin (Active
HIGH)
– SELA = LMH6526 SEB = LMH6525
• Four Independent Current Channels
– Gain of 300, 300 mA Write Channel
– Gain of 150, 150 mA Low-Noise Read
Channel
– Two Gain of 150, 150 mA Write Channels
– 600 mA Minimum Combined Output Current
• Integrated AC Coupled HFM Oscillator
– Selectable Frequency and Amplitude
Setting
– By External Resistors
– 200 MHz to 600 MHz Frequency Range
– Amplitude to 100 mA Peak-to-Peak
Modulation
• Complete Shutdown by ENABLE Pin
• 5V Single-Supply Operation
• Logic inputs TTL and CMOS compatible
• Space Saving Package (OFN)
• LMH6525 has Differential Enable Oscillator
Inputs
• LMH6526 has Single Ended Enable Oscillator
Inputs
APPLICATIONS
• Combination DVD/CD Recordable and
Rewritable Drives
• DVD Camcorders
• DVD Recorders
DESCRIPTION
The LMH™6525/6526 is a laser diode driver for use
in combination DVD/CD recordable and rewritable
systems. The part contains two high-current outputs
for reading and writing the DVD (650 nm) and CD
(780 nm) lasers. Functionality includes read, write
and erase through four separate switched current
channels. The channel currents are summed together
at the selected output to generate multilevel
waveforms for reading, writing and erasing of optical
discs. The LVDS interface delivers DVD write speeds
of 16x and higher while minimizing noise and
crosstalk. The LMH6525/6526 is optimized for both
speed and power consumption to meet the demands
of next generation systems. The part features a 150
mA read channel plus one 300 mA and two 150 mA
write channels, which can be summed to allow a total
output current of 600 mA or greater. The channel
currents are set through four independent current
inputs.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LMH is a trademark of Texas Instruments.
2
All other trademarks are the property of their respective owners.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated


LMH6526 Datasheet
Recommendation LMH6526 Datasheet
Part LMH6526
Description Four-Channel Laser Diode Driver
Feature LMH6526; LMH6525, LMH6526 www.ti.com SNOSAF1B – JUNE 2005 – REVISED MARCH 2013 LMH6525/LMH6526 Four–Channe.
Manufacture etcTI
Datasheet
Download LMH6526 Datasheet




etcTI LMH6526
LMH6525, LMH6526
SNOSAF1B – JUNE 2005 – REVISED MARCH 2013
Block Diagrams
I4
EN4
EN4B
I3
EN3
EN3B
I2
EN2
EN2B
IR
ENR
ENOSC
ENOSCB
CHANNEL 4
CHANNEL 3
CHANNEL 2
READ CHANNEL
RF OSCILLATOR
LMH6525
OUTPUT A
IOUTA
OUTPUT B
IOUTB
VDD
VDD
VDD
VDDA
I4
EN4
EN4B
I3
EN3
EN3B
I2
EN2
EN2B
IR
ENR
ENOSC
CHANNEL 4
CHANNEL 3
CHANNEL 2
READ CHANNEL
RF OSCILLATOR
www.ti.com
LMH6526
OUTPUT A
OUTPUT B
IOUTA
IOUTB
VDD
VDD
VDD
VDDA
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
An on-board High-Frequency Modulator (HFM) oscillator helps reduce low-frequency noise of the laser and is
enabled by applying LVDS levels on the ENOSC pins for the LMH6525, while the LMH6526 is enabled by
applying an asymmetrical signal on the ENOSC pin. The fully differential oscillator circuit minimizes supply line
noise, easing FCC approval of the overall system. The SELA/B pin (active HIGH) selects the output channel and
oscillator settings. External resistors determine oscillator frequency and amplitude for each setting. The write and
erase channels can be switched on and off through dedicated LVDS interface pins.
Absolute Maximum Ratings (1)(2)
ESD Tolerance
Supply Voltages V+ – V
Differential Input Voltage
Output Short Circuit to Ground (5)
Input Common Mode Voltage
Storage Temperature Range
Junction Temperature (6)
Human Body Model (3)
Machine Model (4)
2 KV
200V
5.5V
±5.5V
Continuous
Vto V+
65°C to +150°C
+150°C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(3) For testing purposes, ESD was applied using "Human Body Model”; 1.5 kin series with 100 pF.
(4) Machine Model, 0in series with 200 pF.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(6) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) — TA)/ θJA. All numbers apply for packages soldered directly onto a PC board..
Operating Ratings
Supply Voltage (V+ – V)
Operating Temperature Range (TA) (1)
Package Thermal Resistance (2), (1)
4.5V VS 5.5V
40°C TA 85°C
QFN Package
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. Parametric performance is as indicated in the electrical tables under conditions of
internal self-heating where TJ > TA. See Applications section for information on temperature de-rating of this device.
(2) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) — TA)/ θJA. All numbers apply for packages soldered directly onto a PC board..
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Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LMH6525 LMH6526



etcTI LMH6526
LMH6525, LMH6526
www.ti.com
SNOSAF1B – JUNE 2005 – REVISED MARCH 2013
Operating Ratings (continued)
(θJC)
(θJA) (no heatsink)
(θJA) (no heatsink see (3))
IINR/3/4
IIN2
RFREQ
RAMP
FOSC
AOSC
3°C/W
42°C/W
30.8°C/W
1.5 mA (Max)
1.0 mA (Max)
1000 (Min)
1000 (Min)
100-600 MHz
10-100 mAPP
(3) This figure is taken from a thermal modeling result. The test board is a 4 layer FR-4 board measuring 101 mm x 101 mm x 1.6 mm with
a 3 x 3 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Ambient temperature in simulation is 22°C, still air.
Power dissipation is 1W.
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LMH6525 LMH6526
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