Power Amplifier. TPA6111A2 Datasheet

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TPA6111A2 Datasheet
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Part TPA6111A2
Description 150-mW Stereo Audio Power Amplifier
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TPA6111A2
SLOS313C – DECEMBER 2000 – REVISED MARCH 2016
TPA6111A2 150-mW Stereo Audio Power Amplifier
1 Features
1 150-mW Stereo Output
• PC Power Supply Compatible
– Fully Specified for 3.3-V and
5-V Operation
– Operation to 2.5 V
• Pop Reduction Circuitry
• Internal Midrail Generation
• Thermal and Short-Circuit Protection
• Surface-Mount Packaging
– PowerPAD™ MSOP
– SOIC
• Pin Compatible With TPA122, LM4880, and
LM4881 (SOIC)
3 Description
The TPA6111A2 is a stereo audio power amplifier
packaged in either an 8-pin SOIC or an 8-pin
PowerPAD MSOP package capable of delivering 150
mW of continuous RMS power per channel into 16-
loads. Amplifier gain is externally configured by
means of two resistors per input channel and does
not require external compensation for settings of 0 to
20 dB.
THD+N, when driving a 16-load from 5 V, is 0.03%
at 1 kHz, and less than 1% across the audio band of
20 Hz to 20 kHz. For 32-loads, the THD+N is
reduced to less than 0.02% at 1 kHz, and is less than
1% across the audio band of 20 Hz to 20 kHz. For
10-kloads, the THD+N performance is 0.005% at 1
kHz, and less than 0.5% across the audio band of 20
Hz to 20 kHz.
2 Applications
• Smart Phones and Wireless Handsets
• Portable Tablets
• Notebook PCs and Docking Stations
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6111A2
SOIC (8)
MSOP (8)
4.90 mm × 3.91 mm
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
Audio
Input
RI
CI
Audio
Input
C(BYP)
RI
CI
RF
2 IN 1−
3 BYPASS
6 IN 2−
From Shutdown
Control Circuit
5 SHUTDOWN
RF
VDD/2
+
VDD 8
VO1 1
VO2 7
+
Bias
Control
4
VDD
C(S)
C(C)
C(C)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



etcTI TPA6111A2
TPA6111A2
SLOS313C – DECEMBER 2000 – REVISED MARCH 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 3
7.1 Absolute Maximum Ratings ...................................... 3
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 DC Electrical Characteristics, VDD = 3.3 V ............... 4
7.6 AC Operating Characteristics, VDD = 3.3 V .............. 4
7.7 DC Electrical Characteristics, VDD = 5.5 V ............... 5
7.8 AC Operating Characteristics, VDD = 5.5 V .............. 5
7.9 AC Operating Characteristics, VDD = 3.3 V............... 5
7.10 AC Operating Characteristics, VDD = 5 V................ 5
7.11 Typical Characteristics ............................................ 6
8 Parameter Measurement Information ................ 11
9 Detailed Description ............................................ 12
9.1 Overview ................................................................. 12
9.2 Functional Block Diagram ....................................... 12
9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 12
10 Application and Implementation........................ 13
10.1 Application Information.......................................... 13
10.2 Typical Application ............................................... 13
11 Power Supply Recommendations ..................... 16
12 Layout................................................................... 17
12.1 Layout Guidelines ................................................. 17
12.2 Layout Examples................................................... 17
13 Device and Documentation Support ................. 19
13.1 Documentation Support ........................................ 19
13.2 Community Resources.......................................... 19
13.3 Trademarks ........................................................... 19
13.4 Electrostatic Discharge Caution ............................ 19
13.5 Glossary ................................................................ 19
14 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (June 2014) to Revision C
Page
• Added Device Comparison table, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
• Removed Dissipation Ratings table ....................................................................................................................................... 1
2 Submit Documentation Feedback
Product Folder Links: TPA6111A2
Copyright © 2000–2016, Texas Instruments Incorporated



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5 Device Comparison Table
AVAILABLE OPTIONS
Headphone Channels
Output Power (W)
PSRR (dB)
Pin/Package
TPA6100A2
Stereo
0.05
72
8-pin SOIC, 8-Pin
VSSOP
TPA6111A2
SLOS313C – DECEMBER 2000 – REVISED MARCH 2016
TPA6110A2
Stereo
0.15
83
8-pin MSOP
TPA6111A2
Stereo
0.15
83
8-pin MSOP, 8-Pin
SOIC
TPA6112A2
Stereo
0.15
83
10-pin MSOP
6 Pin Configuration and Functions
D or DGN Package
8-Pin SOIC or MSOP
Top View
VO1
IN1−
BYPASS
GND
1
2
3
4
8 VDD
7 VO2
6 IN2−
5 SHUTDOWN
NAME
PIN
NO.
BYPASS
3
GND
IN1–
IN2–
SHUTDO
WN
VDD
VO1
VO2
4
2
6
5
8
1
7
Pin Functions
I/O DESCRIPTION
I
Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1-µF to 1-µF low ESR capacitor
for best performance.
I GND is the ground connection.
I IN1– is the inverting input for channel 1.
I IN2– is the inverting input for channel 2.
I Puts the device in a low quiescent current mode when held high
I VDD is the supply voltage terminal.
O VO1 is the audio output for channel 1.
O VO2 is the audio output for channel 2.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VDD Supply voltage
VI Input voltage
Continuous total power dissipation
TJ Operating junction temperature
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Tstg Storage temperature
MIN MAX
6
–0.3
VDD + 0.3
Internally Limited
–40 150
260
–65 150
UNIT
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2000–2016, Texas Instruments Incorporated
Product Folder Links: TPA6111A2
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