Headphone Amplifier. TPA6132A2 Datasheet

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TPA6132A2
SLOS597B – DECEMBER 2008 – REVISED JULY 2017
TPA6132A2 25-mW DirectPath™ Stereo Headphone Amplifier With Pop Suppression
1 Features
1 Patented DirectPath™ Technology Eliminates
Need for DC-Blocking Capacitors
– Outputs Biased at 0 V
– Excellent Low Frequency Fidelity
• Active Click and Pop Suppression
• 2.1 mA Typical Supply Current
• Fully Differential or Single-Ended Inputs
– Built-In Resistors Reduces Component Count
– Improves System Noise Performance
• Constant Maximum Output Power from 2.3 V to
5.5 V Supply
– Simplifies Design to Prevent Acoustic Shock
• Improved RF Noise Immunity
• MicrosoftTM Windows VistaTM Compliant
• High Power Supply Noise Rejection
– 100 dB PSRR at 217 Hz
– 90 dB PSRR at 10 kHz
• Wide Power Supply Range: 2.3 V to 5.5 V
• Gain Settings: –6 dB, 0 dB, 3 dB, and 6 dB
• Short-Circuit and Thermal-Overload Protection
• ±8 kV HBM ESD Protected Outputs
• Small Package Available
– 16-Pin, 3 mm × 3 mm Thin QFN
2 Applications
• Smart Phones / Cellular Phones
• Notebook Computers
• CD / MP3 Players
• Portable Gaming
3 Description
The TPA6132A2 (sometimes referred to as TPA6132)
is a DirectPath™ stereo headphone amplifier that
eliminates the need for external dc-blocking output
capacitors. Differential stereo inputs and built-in
resistors set the device gain, further reducing external
component count. Gain is selectable at –6 dB, 0 dB,
3 dB or 6 dB. The amplifier drives 25 mW into 16
speakers from a single 2.3 V supply. The TPA6132A2
(TPA6132) provides a constant maximum output
power independent of the supply voltage, thus
facilitating the design for prevention of acoustic
shock.
The TPA6132A2 features fully differential inputs to
reduce system noise pickup between the audio
source and the headphone amplifier. The high power
supply noise rejection performance and differential
architecture provides increased RF noise immunity.
For single-ended input signals, connect INL+ and
INR+ to ground.
The device has built-in pop suppression circuitry to
completely eliminate disturbing pop noise during turn-
on and turn-off. The amplifier outputs have short-
circuit and thermal-overload protection along with
±8 kV HBM ESD protection, simplifying end
equipment compliance to the IEC 61000-4-2 ESD
standard.
The TPA6132A2 operates from a single 2.3 V to
5.5 V supply with 2.1 mA of typical supply current.
Shutdown mode reduces supply current to less than
1 μA.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6132A2
WQFN (16)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
OUTR+
OUTR-
CODEC
OUTL+
OUTL-
ENABLE
GAIN0
GAIN1
VBAT
INR+
INR-
OUTR
TPA6132A2
INL+
OUTL
INL-
EN
G0
G1
VDD
HPVDD
CPP
SGND
PGND
HPVSS
CPN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


TPA6132A2 Datasheet
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Part TPA6132A2
Description Stereo Headphone Amplifier
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TPA6132A2
SLOS597B – DECEMBER 2008 – REVISED JULY 2017
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Condtions........................ 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Operating Characteristics.......................................... 5
6.7 Typical Characteristics .............................................. 6
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Applications ................................................ 14
9 Power Supply Recommendations...................... 17
9.1 Power Supply and HPVDD Decoupling Capacitors 17
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
10.3 GND Connections ................................................. 18
11 Device and Documentation Support ................. 19
11.1 Receiving Notification of Documentation Updates 19
11.2 Community Resources.......................................... 19
11.3 Trademarks ........................................................... 19
11.4 Electrostatic Discharge Caution ............................ 19
11.5 Glossary ................................................................ 19
12 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (December 2008) to Revision B
Page
• Corrected the I/O/P column of the Pin Functions table .......................................................................................................... 3
• Changed the Input voltage for EN, G0, G1 MAX value From: HVDD + 0.3 To: VDD + 0.3 in the Absolute Maximum
Ratings ................................................................................................................................................................................... 4
• Changed Handling Ratings to ESD Ratings and moved the Storage temperature range to the Absolute Maximum
Ratings ................................................................................................................................................................................... 4
Changes from Original (December 2008) to Revision A
Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging sections. ........................................................................................................ 1
• Added Input voltage: EN, G0, G1 to the Absolute Maximum Ratings table........................................................................... 4
• Added Input voltage: INR+, INR-, INL+, INL- to the Recommended Operating Condtions table........................................... 4
• Changed Output impedance in shutdown From: TYP = 50 Ω To: TYP = 20 Ω in the Operating Characteristics table......... 5
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Product Folder Links: TPA6132A2
Copyright © 2008–2017, Texas Instruments Incorporated



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5 Pin Configuration and Functions
RTE (WQFN) Package
(Top View)
TPA6132A2
SLOS597B – DECEMBER 2008 – REVISED JULY 2017
INL- 1
INL+ 2
INR+ 3
INR- 4
12 HPVDD
11 CPP
10 PGND
9 CPN
NAME
INL-
INL+
PIN
INR+
INR-
OUTR
G0
GAIN0
G1
GAIN1
HPVSS
CPN
PGND
CPP
HPVDD
EN
VDD
SGND
OUTL
Thermal Pad
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
I/O/P
I
I
I
I
O
I
I
I
I
P
P
P
P
P
I
P
P
O
Pin Functions
DESCRIPTION
Inverting left input for differential signals; left input for single-ended signals
Non-inverting left input for differential signals. Connect to ground for single-ended input
applications
Non-inverting right input for differential signals. Connect to ground for single-ended input
applications
Inverting right input for differential signals; right input for single-ended signals
Right headphone amplifier output. Connect to right terminal of headphone jack
Gain select
Gain select
Charge pump output and negative power supply for output amplifiers; connect 1μF
capacitor to GND
Charge pump negative flying cap. Connect to negative side of 1μF capacitor between
CPP and CPN
Ground
Charge pump positive flying cap. Connect to positive side of 1μF capacitor between CPP
and CPN
Positive power supply for headphone amplifiers. Connect to a 2.2μF capacitor. Do not
connect to VDD
Amplifier enable. Connect to logic low to shutdown; connect to logic high to activate
Positive power supply for TPA6132A2
Amplifier reference voltage. Connect to ground terminal of headphone jack
Left headphone amplifier output. Connect to left terminal of headphone jack
Solder the exposed metal pad on the TPA6132A2RTE QFN package to the landing pad
on the PCB. Connect the landing pad to ground or leave it electrically unconnected
(floating).
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: TPA6132A2
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