Headphone Amplifier. TPA6135A2 Datasheet

TPA6135A2 Amplifier. Datasheet pdf. Equivalent

TPA6135A2 Datasheet
Recommendation TPA6135A2 Datasheet
Part TPA6135A2
Description Stereo Headphone Amplifier
Feature TPA6135A2; TPA6135A2 www.ti.com ................................................................................
Manufacture etcTI
Datasheet
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etcTI TPA6135A2
TPA6135A2
www.ti.com .................................................................................................................................................. SLOS623A – FEBRUARY 2009 – REVISED APRIL 2009
DIRECTPATH™ Stereo Headphone Amplifier
With Differential Input and HI-Z Mode
FEATURES
1
23 Patented DirectPath™ Technology Eliminates
Need for DC-Blocking Capacitors
– Outputs Biased at 0 V
– Excellent Low Frequency Fidelity
Active Click and Pop Suppression
HI-Z Output Mode
2.1 mA Typical Supply Current
Fully Differential or Single-Ended Inputs
– Built-In Resistors Reduces Component
Count
– Improves System Noise Performance
Constant Maximum Output Power from 2.3 V
to 5.5 V Supply
– Simplifies Design to Prevent Acoustic
Shock
Improved RF Noise Immunity
MicrosoftTM Windows VistaTM Compliant
High Power Supply Noise Rejection
– 100 dB PSRR at 217 Hz
– 90 dB PSRR at 10 kHz
Wide Power Supply Range: 2.3 V to 5.5 V
Gain Settings: 0 dB and 6 dB
Short-Circuit and Thermal-Overload Protection
±8 kV HBM ESD Protected Outputs
Small Package Available
– 16-Pin, 3 mm × 3 mm Thin QFN
APPLICATIONS
Smart Phones / Cellular Phones
Notebook Computers
CD / MP3 Players
Portable Gaming
DESCRIPTION
The TPA6135A2 (sometimes referred to as TPA6135)
is a DirectPath™ stereo headphone amplifier that
eliminates the need for external dc-blocking output
capacitors. Differential stereo inputs and built-in
resistors set the device gain, further reducing external
component count. Gain is selectable at 0 dB or 6 dB.
The amplifier drives 25 mW into 16 speakers from
a single 2.3 V supply. The TPA6135A2 (TPA6135)
provides a constant maximum output power
independent of the supply voltage, thus facilitating the
design for prevention of acoustic shock.
The TPA6135A2 (TPA6135) features HI-Z mode
which can set the outputs to a high impedance
configuration. The fully differential inputs reduce
system noise pickup between the audio source and
the headphone amplifier. The high power supply
noise rejection performance and differential
architecture provide increased RF noise immunity.
For single-ended input signals, connect INL+ and
INR+ to ground.
The device has built-in pop suppression circuitry to
completely eliminate disturbing pop noise during
turn-on and turn-off. The amplifier outputs have
short-circuit and thermal-overload protection along
with ±8 kV HBM ESD protection, simplifying end
equipment compliance to the IEC 61000-4-2 ESD
standard.
The TPA6135A2 (TPA6135) operates from a single
2.3 V to 5.5 V supply with 2.1 mA of typical supply
current. Shutdown mode reduces supply current to
less than 1 µA.
OUTR+
OUTR-
CODEC
OUTL+
OUTL-
ENABLE
GAIN
HI-Z MODE
VBAT
INR+
INR-
OUTR
TPA6135A2
INL+
OUTL
INL-
EN
GAIN
HI-Z
VDD
HPVDD
CPP
SGND
PGND
HPVSS
CPN
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DirectPath is a trademark of Texas Instruments.
2
Windows Vista is a trademark of Microsoft Corporation.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated



etcTI TPA6135A2
TPA6135A2
SLOS623A – FEBRUARY 2009 – REVISED APRIL 2009 .................................................................................................................................................. www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
VDD
INL-
INL+
INR-
INR+
HI-Z
GAIN
Resistor
Array
HPVDD
HPVSS
Supply
Control
Short-Circuit
Protection
HPVDD
2.2 mF
PGND
OUTL
Resistor
Array
Control
HPVDD
Thermal
Protection
HPVSS
HPVDD
Click-and-Pop
Suppression
Charge
Pump
SGND
HPVSS
1 mF
EN
OUTR
CPP
1 mF
CPN
2 Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA6135A2



etcTI TPA6135A2
TPA6135A2
www.ti.com .................................................................................................................................................. SLOS623A – FEBRUARY 2009 – REVISED APRIL 2009
DEVICE PINOUT
RTE (QFN) PACKAGE
(TOP VIEW)
INL- 1
INL+ 2
INR+ 3
INR- 4
12 HPVDD
11 CPP
10 PGND
9 CPN
PIN
NAME
QFN
INL- 1
INL+
2
INR+
3
INR-
4
OUTR
5
HI-Z 6
GAIN
HPVSS
CPN
PGND
CPP
HPVDD
EN
VDD
SGND
OUTL
Thermal
Pad
7
8
9
10
11
12
13
14
15
16
PIN FUNCTIONS
I/O/P
PIN DESCRIPTION
I Inverting left input for differential signals; left input for single-ended signals
I Non-inverting left input for differential signals. Connect to ground for single-ended input applications
I Non-inverting right input for differential signals. Connect to ground for single-ended input applications
I Inverting right input for differential signals; right input for single-ended signals
O Right headphone amplifier output. Connect to right terminal of headphone jack
I Output impedance select. Set to logic LOW for normal operation and to logic HIGH for high output
impedance
I Gain select. Set to logic LOW for a gain of 0dB and to logic HIGH for a gain of 6dB
P Charge pump output and negative power supply for output amplifiers; connect 1µF capacitor to GND
P Charge pump negative flying cap. Connect to negative side of 1µF capacitor between CPP and CPN
P Ground
P Charge pump positive flying cap. Connect to positive side of 1µF capacitor between CPP and CPN
P Positive power supply for headphone amplifiers. Connect to a 2.2µF capacitor. Do not connect to VDD
I Amplifier enable. Connect to logic LOW to shutdown; connect to logic HIGH to activate
P Positive power supply for TPA6135A2
I Amplifier reference voltage. Connect to ground terminal of headphone jack
O Left headphone amplifier output. Connect to left terminal of headphone jack
P Solder the exposed metal pad on the TPA6135A2RTE QFN package to the landing pad on the PCB.
Connect the landing pad to ground or leave it electrically unconnected (floating).
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA6135A2
3







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