HEADPHONE AMPLIFIER. TPA6140A2 Datasheet

TPA6140A2 AMPLIFIER. Datasheet pdf. Equivalent


etcTI TPA6140A2
TPA6140A2
www.ti.com................................................................................................................................................. SLOS598A – MARCH 2009 – REVISED OCTOBER 2009
CLASS-G DIRECTPATH™ STEREO HEADPHONE AMPLIFIER
WITH I2C VOLUME CONTROL
Check for Samples: TPA6140A2
FEATURES
1
2 TI Class-G Technology Significantly Prolongs
Battery Life and Music Playback Time
– 0.6 mA / Ch Quiescent Current
– 50% to 80% Lower Quiescent Current than
Ground-Referenced Class-AB Headphone
Amplifiers
• DirectPathTM Technology Eliminates Large
Output DC-Blocking Capacitors
– Outputs Biased at 0 V
– Improves Low Frequency Audio Fidelity
• I2C Volume Control
– –59 dB to +4 dB Gain
• Active Click and Pop Suppression
• Fully Differential Inputs Reduce System Noise
– Also Configurable as Single-Ended Inputs
• SGND Pin Eliminates Ground Loop Noise
• Wide Power Supply Range: 2.5 V to 5.5 V
• 100 dB Power Supply Noise Rejection
• Short-Circuit Current Limiter
• Thermal-Overload Protection
• Software Compatible with TPA6130A2
• 0,4 mm Pitch, 1,6 mm × 1,6 mm WCSP
Package
APPLICATIONS
• Cellular Phones / Music Phones
• Portable Media / MP3 Players
• Portable CD / DVD Players
DESCRIPTION
The TPA6140A2 (also known as TPA6140) is a
Class-G DirectPath™ stereo headphone amplifier
with built-in I2C volume control. Class-G technology
maximizes battery life by adjusting the voltage
supplies of the headphone amplifier based on the
audio signal level. At low level audio signals, the
internal supply voltage is reduced to minimize power
dissipation. DirectPathTM technology eliminates
external DC-blocking capacitors.
The device operates from a 2.5 V to 5.5 V supply
voltage. Class-G operation keeps total supply current
below 5.0 mA while delivering 500 μW per channel
into 32 . Shutdown mode reduces the supply
current to less than 3 μA and is activated through the
I2C interface.
The TPA6140A2 (TPA6140) I2C register map is
compatible to the TPA6130A2, simplifying software
development.
The amplifier outputs have short-circuit and
thermal-overload protection along with ±8 kV HBM
ESD protection, simplifying end equipment
compliance to the IEC 61000-4-2 ESD standard.
The TPA6140A2 (TPA6140) is available in a 0,4 mm
pitch, 16-bump 1,6 mm × 1,6 mm WCSP (YFF)
package.
OUTR+
OUTR-
CODEC
OUTL+
OUTL-
1 mF
INR+
INR-
OUTR
TPA6140A2
INL+
OUTL
SCL
SDA
Vbat
2.2 mH
2.2 mF
INL-
SCL
SDA
AVDD
SW
HPVDD
CPP
SGND
AGND
HPVSS
CPN
2.2 mF
1 mF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Class-G DirectPath, DirectPath are trademarks of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated


TPA6140A2 Datasheet
Recommendation TPA6140A2 Datasheet
Part TPA6140A2
Description STEREO HEADPHONE AMPLIFIER
Feature TPA6140A2; TPA6140A2 www.ti.com................................................................................
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Datasheet
Download TPA6140A2 Datasheet




etcTI TPA6140A2
TPA6140A2
SLOS598A – MARCH 2009 – REVISED OCTOBER 2009................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
AVDD
INL-
INL+
INR-
INR+
SDA
SCL
Ramp
Generator
+
Comparator
Compensation
Network
Gate
Drivers
+
SW
AGND
2.2 mH
HPVDD
2.2 mF
Audio
Level
Detector
AVDD
Optimizer
HPVDD
Thermal
Protection
OUTL
HPVSS
HPVDD
Short-Circuit
Protection
OUTR
I2C Interface
HPVSS
HPVDD
Click-and-Pop
Suppression
HPVDD
Charge
Pump
CPP
1 mF
CPN
SGND
HPVSS
2.2 mF
2 Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPA6140A2



etcTI TPA6140A2
TPA6140A2
www.ti.com................................................................................................................................................. SLOS598A – MARCH 2009 – REVISED OCTOBER 2009
DEVICE PINOUT
WCSP PACKAGE
(TOP VIEW)
A1 A2 A3 A4
SW AVDD OUTL INL-
B1
AGND
B2
CPP
B3
HPVDD
B4
INL+
C1
CPN
C2 C3
HPVSS SGND
C4
INR+
D1
SDA
D2
SCL
D3
OUTR
D4
INR-
TERMINAL
NAME
BALL
WCSP
INL–
A4
INL+
B4
INR–
D4
INR+
C4
SGND
SDA
SCL
OUTL
OUTR
CPP
CPN
SW
AVDD
HPVDD
AGND
HPVSS
C3
D1
D2
A3
D3
B2
C1
A1
A2
B3
B1
C2
INPUT /
OUTPUT /
POWER
(I/O/P)
I
I
I
I
I
I/O
I
O
O
P
P
P
P
P
P
P
TERMINAL FUNCTIONS
DESCRIPTION
Inverting left input for differential signals; connect to left input signal through 1 μF capacitor for
single-ended input applications
Non-inverting left input for differential signals; connect to ground through 1 μF capacitor for
single-ended input applications
Inverting right input for differential signals; connect to right input signal through 1 μF capacitor for
single-ended input applications
Non-inverting right input for differential signals; connect to ground through 1 μF capacitor for
single-ended input applications
Sense Ground; connect to shield terminal of headphone jack or to AGND
I2C Data; 1.8 V logic compliant
I2C Clock; 1.8 V logic compliant
Left headphone amplifier output; connect to left terminal of headphone jack
Right headphone amplifier output; connect to right terminal of headphone jack
Charge pump positive flying cap; connect to positive side of capacitor between CPP and CPN
Charge pump negative flying cap; connect to negative side of capacitor between CPP and CPN
Buck converter switching node
Primary power supply for device
Power supply for headphone amplifier (DC/DC output node)
Main Ground for headphone amplifiers, DC/DC converter, and charge pump
Charge pump output; connect 2.2 μF capacitor to GND
TA
–40°C to 85°C
ORDERING INFORMATION
PACKAGED DEVICES (1)
16-ball, 1,6 mm × 1,6 mm WCSP
16-ball, 1,6 mm × 1,6 mm WCSP
PART NUMBER (2)
TPA6140A2YFFR
TPA6140A2YFFT
SYMBOL
AIFI
AIFI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) YFF packages are only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250.
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPA6140A2
3







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