Headset Interface. TPA6166A2 Datasheet

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TPA6166A2
SLAS997B – MARCH 2014 – REVISED JANUARY 2015
TPA6166A2 3.5-mm Jack Detect and Headset Interface IC
1 Features
1 Ultra Low-Power, High-Performance DirectPath™
Class-G Headphone Amplifier
– Ground-Centered Output Eliminates DC-
Blocking Capacitors
– 30 mW/Ch into 32 / Ch at 1% THD+N
– –42 dB to +6 dB Volume Control
– 2.0 µV Output Noise at –42 dB Gain
– 91-dB PSRR
– Ground Loop Rejection for Reducing Crosstalk
• Fully Differential Mic Preamplifier With Variable
Gain and 3.4-µV Low Noise
– Integrated AC-Coupling Capacitor
– Ground Loop Rejection for Reducing
Headphone to Mic Crosstalk
• Choice of Two Mic Bias Voltages: 2.0 V and 2.6 V
– 92-dB PSRR
– Integrated Programmable Mic Bias Resistor
• Advanced Accessory Insertion, Removal, and
Type Detection
• Passive Multi-button Support Using 10-Bit SAR
ADC
– Implements Proprietary Scheme to Reduce
Error Caused by Audio Playback Signal in
Presence of Finite Resistance on Headset
Ground Return Path
• Integrated Level-4 IEC ESD Protection on Jack
Connected Pins (on EVM)
• Ultra Low-Power Chip Shutdown Mode
• I2C Interface
• Short-Circuit Protection
• 0.4-mm Pitch 25-Ball WCSP
2 Applications
• Smart Phones and Wireless Handsets
• Portable Tablets
• Notebook PCs and Docking Stations
3 Description
The TPA6166A2 single-chip headset interface IC
simplifies the challenges of detecting what kind of
device an end user has plugged into the headphone
jack while delivering excellent audio quality. The
device enables smaller end products by integrating a
high-performance, low-power DirectPath variable-
attenuation class-G stereo headphone amplifier,
variable-gain microphone preamplifier with bias with
advanced accessory detection circuitry, all in a tiny
5-mm × 5-mm terminal, 0.4-mm pitch WCSP
package.
The class-G headphone amplifier maximizes battery
life by adjusting the supply voltage of the headphone
amplifier based on audio signal level. With 8-µV
output noise at 0-dB gain and PSRR of 91 dB, the
headphone amplifier provides excellent audio
performance. DirectPath eliminates the need for DC-
blocking capacitors. The microphone preamplifier has
two programmable gains of 12 dB and 24 dB, and
3.4 µV input referred noise.
The microphone bias voltage has two programmable
settings of 2 V and 2.6 V. The bias output drives up
to 1.2 mA of current, has a low output noise of 2 µV,
and 92-dB PSRR, providing excellent rejection of
power supply noise in wireless handsets.
The advanced accessory detection algorithm
automatically detects six supported accessories and
enables or disables internal components.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6166A2
WSCP (25)
2.50 mm × 2.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
CPVDD CPVSS C1P C1N VDD MICVDD
INL
INR
MOUTP
MOUTN
Class- G
Stereo Headphone
Amplifier
Mic
Bias
Switch
Matrix
and
Detection
Circuit
ESD
Prot.
RING1
TIP
JACK_SENSE
RING2
SLEEVE
SDA
SCL
IRQ
Digital
Interface
and
Control
SAR
ADC
GND1 GND2 PGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


TPA6166A2 Datasheet
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Part TPA6166A2
Description 3.5-mm Jack Detect and Headset Interface
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TPA6166A2
SLAS997B – MARCH 2014 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Electrical Characteristics, Audio Amplifiers............... 6
6.7 Electrical Characteristics, Mic Preamplifier and Bias 7
6.8 Timing Requirements ................................................ 8
6.9 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 19
7.5 Register Maps ......................................................... 23
8 Application and Implementation ........................ 38
8.1 Application Information............................................ 38
8.2 Typical Application .................................................. 38
9 Power Supply Recommendations...................... 40
9.1 Decoupling Capacitors ............................................ 40
10 Layout................................................................... 41
10.1 Layout Guidelines ................................................. 41
10.2 Layout Example .................................................... 42
11 Device and Documentation Support ................. 43
11.1 Development Support ........................................... 43
11.2 Trademarks ........................................................... 43
11.3 Electrostatic Discharge Caution ............................ 43
11.4 Glossary ................................................................ 43
12 Mechanical, Packaging, and Orderable
Information ........................................................... 43
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2014) to Revision B
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Original (January 2014) to Revision A
Page
• Changed to new data sheet format ........................................................................................................................................ 1
• Added specifications and application information ................................................................................................................. 1
• Changed status to Production Data ...................................................................................................................................... 1
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5 Pin Configuration and Functions
YFF Package
Top View
TPA6166A2
SLAS997B – MARCH 2014 – REVISED JANUARY 2015
A1 A2 A3 A4 A5
GND1
B1
INR
B2
INL CPVDD JACK_SENSE
B3 B4 B5
NC* GND2 IRQ MOUTN TIP
C1 C2 C3 C4 C5
CPVSS
D1
SCL
D2
GND
D3
MOUTP
D4
RING1
D5
C1N
SDA
PGND
NC*
MICVDD
E1 E2 E3 E4 E5
C1P
PGND
VDD
RING2 SLEEVE
All NC pins should be left floating. Do not connect them to GND.
NAME
GND1
INR
INL
CPVDD
PIN
NO.
A1
A2
A3
A4
JACK_SENSE
A5
NC (Floating)
GND2
IRQ
MOUTN
TIP
CPVSS
B1
B2
B3
B4
B5
C1
SCL
GND
MOUTP
RING1
C1N
SDA
PGND
NC (Floating)
MICVDD
C1P
VDD
RING2
SLEEVE
C2
C3
C4
C5
D1
D2
D3, E2
D4
D5
E1
E3
E4
E5
Pin Functions
I/O / TYPE
DESCRIPTION
P Analog / digital ground 1
I Headphone right channel input
I Headphone left channel input
I Headphone charge-pump positive supply (internally generated). Connect a 1-µF capacitor
to ground.
I/O Connect to headset jack terminal 5 (for mechanical switch). If mechanical switch is not
available, then this terminal can be kept floating.
O Leave floating (no connection)
I Ground 2 - Connect to ground 1 on board.
O Active low interrupt output
O Microphone preamplifier negative output
O Left headphone / line output. Connect to headset jack TIP (terminal 1).
I Headphone charge-pump negative supply (internally generated). Connect a 1-µF capacitor
to ground.
I I2C clock line
I Connect to ground
O Microphone preamplifier positive output
O Right headphone / line output. Connect to headset jack RING1 (terminal 2).
P Charge pump flying capacitor positive terminal
I/O I2C data line
P Power ground
O Leave floating (no connection)
P Analog supply
P Charge pump flying capacitor negative terminal
P Analog / digital supply
I/O Connect to headset jack RING2 (terminal 3)
I/O Connect to headset jack SLEEVE (terminal 4)
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: TPA6166A2
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