Feedback Amplifier. LM7171QML Datasheet

LM7171QML Amplifier. Datasheet pdf. Equivalent


etcTI LM7171QML
LM7171QML, LM7171QML-SP
www.ti.com
SNOSAR5C – FEBRUARY 2009 – REVISED APRIL 2013
LM7171QML Very High Speed, High Output Current, Voltage Feedback Amplifier
Check for Samples: LM7171QML, LM7171QML-SP
FEATURES
1
23 (Typical Unless Otherwise Noted)
• Easy-To-Use Voltage Feedback Topology
• Very High Slew Rate: 2400V/μs
• Wide Unity-Gain Bandwidth: 200 MHz
3 dB Frequency @ AV = +2: 220 MHz
• Low Supply Current: 6.5 mA
• High Open Loop Gain: 85 dB
• High Output Current: 100 mA
• Specified for ±15V and ±5V Operation
• Available with Radiation Guarantee
– Total Ionizing Dose 300 Krad(Si)
– ELDRS Free 300 Krad(Si)
APPLICATIONS
• HDSL and ADSL Drivers
• Multimedia Broadcast Systems
• Professional Video Cameras
• Video Amplifiers
• Copiers/Scanners/Fax
• HDTV Amplifiers
• Pulse Amplifiers and Peak Detectors
• CATV/Fiber Optics Signal Processing
DESCRIPTION
The LM7171 is a high speed voltage feedback
amplifier that has the slewing characteristic of a
current feedback amplifier; yet it can be used in all
traditional voltage feedback amplifier configurations.
The LM7171 is stable for gains as low as +2 or 1. It
provides a very high slew rate at 4100V/μs and a
wide unity-gain bandwidth of 200 MHz while
consuming only 6.5 mA of supply current. It is ideal
for video and high speed signal processing
applications such as HDSL and pulse amplifiers. With
100 mA output current, the LM7171 can be used for
video distribution, as a transformer driver or as a
laser diode driver.
Operation on ±15V power supplies allows for large
signal swings and provides greater dynamic range
and signal-to-noise ratio. The LM7171 offers low
SFDR and THD, ideal for ADC/DAC systems. In
addition, the LM7171 is specified for ±5V operation
for portable applications.
The LM7171 is built on Texas Instruments's
advanced VIP™ III (Vertically integrated PNP)
complementary bipolar process.
Connection Diagram
Figure 1. 8-Pin CDIP Top View
NC 1
IN- 2
NC 3
IN+ 4
V- 5
10 NC
9 V+
8 NC
7 VOUTPUT
6 NC
Figure 2. 10-Pin CFP Top View
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VIP is a trademark of Texas Instruments.
2
All other trademarks are the property of their respective owners.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2013, Texas Instruments Incorporated


LM7171QML Datasheet
Recommendation LM7171QML Datasheet
Part LM7171QML
Description Voltage Feedback Amplifier
Feature LM7171QML; LM7171QML, LM7171QML-SP www.ti.com SNOSAR5C – FEBRUARY 2009 – REVISED APRIL 2013 LM7171QML Very H.
Manufacture etcTI
Datasheet
Download LM7171QML Datasheet




etcTI LM7171QML
LM7171QML, LM7171QML-SP
SNOSAR5C – FEBRUARY 2009 – REVISED APRIL 2013
Simplified Schematic Diagram
www.ti.com
Note: M1 and M2 are current mirrors.
Typical Performance
Large Signal Pulse Response
AV = +2, VS = ±15V
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2 Submit Documentation Feedback
Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LM7171QML LM7171QML-SP



etcTI LM7171QML
LM7171QML, LM7171QML-SP
www.ti.com
SNOSAR5C – FEBRUARY 2009 – REVISED APRIL 2013
Absolute Maximum Ratings(1)
Supply Voltage (V+–V)
Differential Input Voltage(2)
Maximum Power Dissipation(3)
Output Short Circuit to Ground(4)
Storage Temperature Range
Thermal Resistance(5)
θJA
8LD CDIP (Still Air)
8LD CDIP (500LF/Min Air flow)
10LD CFP (Still Air)
10LD CFP (500LF/Min Air flow)
10LD CFP "WG" (device 01, 02) (Still Air)
10LD CFP "WG" (device 01, 02) (500LF/Min Air flow)
θJC 8LD CDIP
10LD CFP
10LD CFP "WG" (device 01, 02)(6)
Package Weight (Typical)
8LD CDIP
10LD CFP
Maximum Junction Temperature(3)
ESD Tolerance(7)
10LD CFP "WG" (device 01, 02)
36V
±10V
730mW
Continuous
65°C TA +150°C
106°C/W
53°C/W
182°C/W
105°C/W
182°C/W
105°C/W
3°C/W
5°C/W
5°C/W
965mg
235mg
230mg
150°C
3000V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) Differential input voltage is applied at VS = ±15V.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) All numbers apply for packages soldered directly into a PC board.
(6) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be
calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat
transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package
base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
(7) Human body model, 1.5 kΩ in series with 100 pF.
Recommended Operating Conditions(1)
Supply Voltage
Operating Temperature Range
5.5V VS 36V
55°C TA +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Copyright © 2009–2013, Texas Instruments Incorporated
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Product Folder Links: LM7171QML LM7171QML-SP
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