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FEATURES
• Inputs Are TTL-Voltage Compatible • 4.5-V to 5.5-V VCC Operation • Typical tpd = 5.4 ns at 5 V • Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 5 V, TA = 25°C • Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 5 V, TA = 25°C • Supports Mixed-Mode Voltage Operation on
All Ports
DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW)
1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND
1 2 3 4 5 6 7 8 9 10
20 VCC 19 2OE 18 1Y1 17 2A4 16 1Y2 15 2A3 14 1Y3 13 2A2 12 1Y4 11 2A1
SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES572C – JUNE 2004 – REVISED AUGUST 2005
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)
RGY PACKAGE (TOP VIEW)
1OE VCC
1A1 2 2Y4 3 1A2 4 2Y3 5 1A3 6 2Y2 7 1A4 8 2Y1 9
1 10
20 19 2OE 18 1Y1 17 2A4 16 1Y2 15 2A3 14 1Y3 13 2A2 12 1Y4
11
GND 2A1
DESCRIPTION/ORDERING INFORMATION
This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74LV244AT is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
TA –40°C to 85°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
QFN – RGY
Reel of 1000
SN74LV244ATRGYR
SOIC – DW
Tube of 25 Reel of 2000
SN74LV244ATDW SN74LV244ATDWR
SOP – NS
Reel of 2000
SN74LV244ATNSR
SSOP – DB
Reel of 2000
SN74LV244ATDBR
Tube of 70
SN74LV244ATPW
TSSOP – PW
Reel of 2000
SN74LV244ATPWR
Reel of 250
SN74LV244ATPWT
TVSOP – DGV
Reel of 2000
SN74LV244ATDGVR
TOP-SIDE MARKING VV244 LV244AT 74LV244AT LV244AT
LV244AT
LV244AT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES572C – JUNE 2004 – REVISED AUGUST 2005
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
1 1OE 1A1 2
FUNCTION TABLE (EACH 4-BIT BUFFER/DRIVER)
INPUTS OE A LH LL HX
OUTPUT Y
H L Z
LOGIC DIAGRAM (POSITIVE LOGIC)
19 2OE
18 1Y1
2A1 11
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
3 2Y4
2
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Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES572C – JUNE 2004 – REVISED AUGUST 2005
VCC Supply voltage range
VI Input voltage range(2)
VO Voltage range applied to any output in the high-impedance or power-off state(2)
VO Output voltage range applied in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
VO = 0 to VCC
Continuous current through VCC or GND
DB package(4)
DGV package(4)
θJA Package thermal impedance
DW package(4) NS package(4)
PW package(4)
RGY package(5)
Tstg Storage temperature range
MIN MAX UNIT
–0.5 7 V
–0.5 7 V
–0.5 7 V
–0.5 VCC + 0.5 –20
V mA
–50 mA
±35 mA
±70 mA
70
92
58 °C/W
60
83
37
–65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) This value is limited to 5.5 V maximum. (4) The package thermal impedance is calculated in accordance with JESD 51-7 (5) The package thermal impedance is calculated in.