LM3263 DC-DC Converter Datasheet

LM3263 Datasheet, PDF, Equivalent


Part Number

LM3263

Description

Step-Down DC-DC Converter

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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LM3263
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LM3263
SNVS837B – JUNE 2013 – REVISED APRIL 2016
LM3263 High-Current Step-Down DC-DC Converter With MIPI® RF Front-End
Control Interface for RF Power Amplifiers
1 Features
1 MIPI® RFFE Digital Control Interface
• Operates from a Single Li-Ion Cell: 2.7 V to 5.5 V
• Dynamically Adjustable Output Voltage: 0.4 V to
3.6 V (Typical) in PFM and PWM Modes
• High-Efficiency PFM and PWM Modes With
Internal Seamless Transition
• 2.5-A Maximum Load Current in PWM Mode
• 2.7 MHz (Typical) Switching Frequency
• ACB (Reduces Inductor Requirements and Size)
• Internal Compensation
• Current and Thermal Overload Protection
• Very Small Solution Size: Approximately 9.1 mm2
2 Applications
• Smartphones
• RF PC Cards
• Tablets, eBook Readers
• Handheld Radios
• Battery-Powered RF Devices
3 Description
The LM3263 is a DC-DC converter optimized for
powering multi-mode multi-band RF power amplifiers
(PAs) from a single lithium-ion cell. The LM3263
steps down an input voltage from 2.7 V to 5.5 V to a
dynamically adjustable output voltage of 0.4 V to
3.6 V. The output voltage is externally programmed
through the RFFE Digital Control Interface and is set
to ensure efficient operation at all power levels of the
RF PA.
When operating in pulse width modulated (PWM)
mode, the LM3263 produces a small and predictable
amount of output voltage ripple thus meeting the
power and stringent spectral-compliance needs of RF
PAs with minimal filtering and minimal excess
headroom. When operating in PFM mode, the
LM3263 enables the lowest current consumption
across PA output power level settings and therefore
maximizes system efficiency.
The LM3263 has a unique Active Current assist and
analog Bypass (ACB) feature to minimize inductor
size without any loss of output regulation for the
entire battery voltage and RF output power range,
until dropout. ACB provides a parallel current path,
when needed, to limit the maximum inductor current
to 1.45 A (typical) while still driving a 2.5-A load. The
ACB feature also enables operation with minimal
dropout voltage.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (MAX)
LM3263
DSBGA (16)
2.049 mm × 2.049 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
VBATT
2.7 V to 5.5 V
Typical Application
1.8 V
RFFE
Master
PVIN
PACB
SVDD
FB
VIO
SCLK
SDATA
LM3263
ACB
SW
GPO1
BGND SGND PGND
Output Voltage
0.4 V to 3.6 V
2G
VCC_PA
PA
3G/4G
VCC_PA
PA(s)
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM3263
LM3263
SNVS837B – JUNE 2013 – REVISED APRIL 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 System Characteristics ............................................ 6
6.7 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 17
7.5 Programming........................................................... 19
7.6 Register Map........................................................... 22
8 Application Information....................................... 24
8.1 Application Information............................................ 24
8.2 Typical Application ................................................. 24
9 Power Supply Recommendations...................... 26
10 Layout Considerations ....................................... 27
10.1 Layout Guidelines ................................................. 27
10.2 4. Layout Examples .............................................. 28
10.3 DSBGA Package Assembly and Use ................... 36
11 Device and Documentation Support ................. 37
11.1 Device Support...................................................... 37
11.2 Documentation Support ........................................ 37
11.3 Community Resources.......................................... 37
11.4 Trademarks ........................................................... 37
11.5 Electrostatic Discharge Caution ............................ 37
11.6 Glossary ................................................................ 37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (August 2013) to Revision B
Page
• Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Feature Description,
Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and
Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1
• Added Thermal Information table with revised RθJA value (from 50°C/W to 77.1°C/W) and additional thermal values. ....... 4
Changes from Original (June 2013) to Revision A
Page
• Added new inductor to recommended table......................................................................................................................... 36
2 Submit Documentation Feedback
Product Folder Links: LM3263
Copyright © 2013–2016, Texas Instruments Incorporated


Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community LM3263 SNVS837B – JUNE 201 3 – REVISED APRIL 2016 LM3263 High-Cu rrent Step-Down DC-DC Converter With MI PI® RF Front-End Control Interface for RF Power Amplifiers 1 Features •1 M IPI® RFFE Digital Control Interface Operates from a Single Li-Ion Cell: 2 .7 V to 5.5 V • Dynamically Adjustabl e Output Voltage: 0.4 V to 3.6 V (Typic al) in PFM and PWM Modes • High-Effic iency PFM and PWM Modes With Internal S eamless Transition • 2.5-A Maximum Lo ad Current in PWM Mode • 2.7 MHz (Typ ical) Switching Frequency • ACB (Redu ces Inductor Requirements and Size) • Internal Compensation • Current and Thermal Overload Protection • Very Sm all Solution Size: Approximately 9.1 mm 2 2 Applications • Smartphones • RF PC Cards • Tablets, eBook Readers Handheld Radios • Battery-Powered R F Devices 3 Description The LM3263 is a DC-DC converter optimized for powering multi-mode multi-band RF power amplifiers (PAs) from a sin.
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