TPSM53603 Power Module Datasheet

TPSM53603 Datasheet, PDF, Equivalent


Part Number

TPSM53603

Description

3-A Power Module

Manufacture

etcTI

Total Page 30 Pages
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TPSM53603
SNVSB77 – DECEMBER 2019
TPSM53603 36-V Input, 3-A Power Module in RLF QFN Package
1 Features
1 5-mm × 5.5-mm × 4-mm routable lead-frame
(RLF) QFN package
– Industry’s smallest 36-V, 3-A footprint:
85-mm2 solution size (single-sided)
– Low EMI: Meets CISPR11 radiated emissions
– Excellent thermal performance:
Up to 18 W output power at 85ºC, no airflow
– Standard footprint: single large thermal pad
and all pins accessible from perimeter
• 3.8 V to 36 V input voltage range
• Output voltage range: 1 V to 7 V
• Efficiency up to 95%
• Power-good flag
• Precision enable
• Built-in hiccup-mode short-circuit protection,
overtemperature protection, start-up into pre-bias
output, soft start, and UVLO
• Operating IC junction range: –40°C to +125°C
• Operating ambient range: –40°C to +105°C
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with: 4-A TPSM53604
and 2-A TPSM53602
• Create a custom design using the TPSM53603
with the WEBENCH® Power Designer
3 Description
The TPSM53603 power module is a highly integrated
3-A power solution that combines a 36-V input, step-
down, DC/DC converter with power MOSFETs, a
shielded inductor, and passives in a thermally-
enhanced QFN package. The 5-mm x 5.5-mm x 4-
mm, 15-pin QFN package uses routable lead-frame
technology for enhanced thermal performance, small
footprint, and low EMI. The package footprint has all
pins accessible from the perimeter and a single large
thermal pad for simple layout and easy handling in
manufacturing.
The total solution requires as few as four external
components and eliminates the loop compensation
and magnetics part selection from the design
process. The full feature set includes power good,
programmable UVLO, prebias start-up, overcurrent,
and overtemperature protections, making the
TPSM53603 an excellent device for powering a wide
range of applications.
Device Information(1)
DEVICE NUMBER
PACKAGE
BODY SIZE (NOM)
TPSM53603
QFN-RLFMOD (15) 5.0 mm × 5.5 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
General purpose wide VIN power supplies
Factory automation and control
Test and measurement
Aerospace and defense
Negative output voltage applications
Simplified Schematic
VIN
CIN
PGOOD
VIN
EN VOUT
TPSM53603
V5V
PGND
FB
AGND
RFBT
VOUT
COUT
RFBB
GND
RLF Package and Typical Layout
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
0
5 VOUT Efficiency
VOUT = 5 V
VIN
12 V
24 V
0.5 1 1.5 2 2.5 3
Output Current (A)
EFF2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPSM53603
TPSM53603
SNVSB77 – DECEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics (VIN = 5 V)............................ 7
6.7 Typical Characteristics (VIN = 12 V).......................... 8
6.8 Typical Characteristics (VIN = 24 V).......................... 9
6.9 Typical Characteristics (VIN = 36 V)........................ 10
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 19
8 Application and Implementation ........................ 20
8.1 Application Information............................................ 20
8.2 Typical Application .................................................. 20
9 Power Supply Recommendations...................... 22
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Examples................................................... 23
10.3 Theta JA versus PCB Area ................................... 24
10.4 Package Specifications ......................................... 25
10.5 EMI........................................................................ 25
11 Device and Documentation Support ................. 27
11.1 Device Support...................................................... 27
11.2 Documentation Support ........................................ 27
11.3 Receiving Notification of Documentation Updates 27
11.4 Support Resources ............................................... 27
11.5 Trademarks ........................................................... 27
11.6 Electrostatic Discharge Caution ............................ 27
11.7 Glossary ................................................................ 28
12 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
December 2019
REVISION
*
NOTES
Initial release
2 Submit Documentation Feedback
Product Folder Links: TPSM53603
Copyright © 2019, Texas Instruments Incorporated


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity TPSM53603 SNVSB77 – DECEMBER 2019 TPSM53603 36-V Input, 3-A Power Mo dule in RLF QFN Package 1 Features • 1 5-mm × 5.5-mm × 4-mm routable lead- frame (RLF) QFN package – Industry’ s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided) – Low EM I: Meets CISPR11 radiated emissions – Excellent thermal performance: Up to 1 8 W output power at 85ºC, no airflow Standard footprint: single large the rmal pad and all pins accessible from p erimeter • 3.8 V to 36 V input voltag e range • Output voltage range: 1 V t o 7 V • Efficiency up to 95% • Powe r-good flag • Precision enable • Bu ilt-in hiccup-mode short-circuit protec tion, overtemperature protection, start -up into pre-bias output, soft start, a nd UVLO • Operating IC junction range : –40°C to +125°C • Operating amb ient range: –40°C to +105°C • Sho ck and vibration tested to Mil-STD-883D • Pin compatible with: 4-A TPSM53604 and 2-A TPSM53602 • Create a .
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