DatasheetsPDF.com

MC33660 Dataheets PDF



Part Number MC33660
Manufacturers NXP
Logo NXP
Description ISO K line serial link interface
Datasheet MC33660 DatasheetMC33660 Datasheet (PDF)

NXP Semiconductors Technical Data Document Number: MC33660 Rev 6.0, 7/2016 ISO K line serial link interface The 33660 is a serial link bus interface device designed to provide bi-directional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle’s on-board microcontroller, and systems off-board the vehicle via the special ISO K line. The 33660 is designed to meet the Diagnostic Systems ISO9141 specification. The device’s K l.

  MC33660   MC33660


Document
NXP Semiconductors Technical Data Document Number: MC33660 Rev 6.0, 7/2016 ISO K line serial link interface The 33660 is a serial link bus interface device designed to provide bi-directional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle’s on-board microcontroller, and systems off-board the vehicle via the special ISO K line. The 33660 is designed to meet the Diagnostic Systems ISO9141 specification. The device’s K line bus driver’s output is fully protected against bus shorts and over-temperature conditions. The 33660 derives its robustness to temperature and voltage extremes by being built on a SMARTMOS process, incorporating CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs. Although the 33660 was principally designed for automotive applications, it is suited for other serial communication applications. It is parametrically specified over an ambient temperature range of -40 ºC ≤ TA ≤ 125 ºC and 8.0 V ≤ VBB ≤ 18 V supply. The economical SO-8 surface-mount plastic package makes the 33660 very cost effective. Features • Operates over a wide supply voltage of 8.0 V to 18 V • Operating temperature of -40 °C to 125 °C • Interfaces directly to standard CMOS microprocessors • ISO K line pin protected against shorts to battery • Thermal shutdown with hysteresis • ISO K line pin capable of high currents • ISO K line can be driven with up to 10 nF of parasitic capacitance • 8.0 kV ESD protection attainable with few additional components • Standby mode: no VBAT current drain with VDD at 5.0 V • Low current drain during operation with VDD at 5.0 V 33660 ISO9141 PHYSICAL INTERFACE EF SUFFIX (PB-FREE) 98ASB42564B 8-PIN SOICN Applications • Farm equipment • Automotive systems • Industrial equipment • Robotic equipment • Applications where module-to-module communications are required • Marine and aircraft networks +VBAT VDD VDD 33660 VDD VBB MCU Dx SCIRxD SCITxD CEN RX TX ISO GND ISO K-LINE Figure 1. 33660 simplified application diagram TXD RXD © 2016 NXP B.V. 1 Orderable parts Table 1. Orderable part variations Part number (1) Temperature (TA) Package Parameter MC33660EF -40 °C to 125 °C 8-SOICN VBB Load Dump Peak Voltage (in accordance with ISO 7637-2 & ISO 7637-3) MC33660BEF Module Level ESD (Air Discharge, Powered) Notes 1. To order parts in tape & reel, add the R2 suffix to the part number. 2. Recommended for all new designs Symbol VBB(5a) VBB(5b) VESD4 Condition 33660 33660B (2) Pulse 5a 470 ohm series resistor and 100 nF capacitor to GND on VBB Pulse 5b 470 ohm series resistor and 100 nF capacitor to GND on VBB – 45 V 82 V 45 V 33 V zener diode and 470 pF capacitor to GND on ISO – ±25000 V 33660 2 NXP Semiconductors 2 Internal block diagram VBB 60 V CEN 10 V 3.0 kΩ 600 kΩ * Only applies to 33660B 20 V 125 kΩ RHYS 55 kΩ 550 kΩ Master Bias 110 kΩ VDD 10 V TX 10 V 125 kΩ Thermal Shutdown 55 V 2.0 kΩ 10 V 45 V RX ISO GND Figure 2. 33660 simplified internal block diagram NXP Semiconductors 33660 3 3 Pin connections 3.1 Pinout diagram 3.2 Pin definitions VBB NC GND ISO 11 22 33 44 88 CEN 77 VDD 66 RX 55 TX Figure 3. 33660 pin connections Table 2. 33660 pin definitions Pin Number 1 2 Pin Name VBB NC Definition Battery power through external resistor and diode. Not to be connected. (3) 3 GND Common signal and power return. 4 ISO Bus connection. 5 TX Logic level input for data to be transmitted on the bus. 6 RX Logic output of data received on the bus. 7 VDD Logic power source input. 8 CEN Chip enable. Logic “1” for active state. Logic “0” for sleep state. Notes 3. NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits. 33660 4 NXP Semiconductors 4 Electrical characteristics 4.1 Maximum ratings Table 3. Maximum ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Rating Value Unit Notes VDD VBB(5a) VBB(5b) VISO VESD1 VESD2 VESD3-1 VESD3-2 VESD4 VDD DC Supply Voltage VBB Load Dump Peak Voltage (in accordance with ISO 7637-2 & ISO 7637-3) • Pulse 5a - 33660B only • Pulse 5b ISO Pin Load Dump Peak Voltage ESD Voltage • Human Body Model • Machine Model 33660 33660B • Charge Device Model Corner Pins All other Pins • Module Level ESD (Air Discharge, Powered) 33660B only ISO pin with 33 V zener diode and 470 pF capacitor to GND - -0.3 to 7.0 82 45 40 ±2000 ±150 ±200 ±750 ±500 ±25000 V V V (4) (5) (6) (6) V (6) (7) ECLAMP ISO Clamp Energy 10 mJ (8) TSTG Storage Temperature -55 to +150 °C TC Operating Case Temperature -40 to +125 °C TJ Operating Junction Temperature -40 to +150 °C PD TPPRT Power Dissipation TA = 25 °C Peak Package Reflow Temperature During Reflow 100 Note 10. mW °C (9).


33660 MC33660 LMV331


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)