32-bit MCU. STM32L152ZD Datasheet


STM32L152ZD MCU. Datasheet pdf. Equivalent


Part Number

STM32L152ZD

Description

Ultra-low-power 32-bit MCU

Manufacture

STMicroelectronics

Total Page 30 Pages
Datasheet
Download STM32L152ZD Datasheet


STM32L152ZD
STM32L151xD STM32L152xD
Ultra-low-power 32-bit MCU Arm® Cortex®-M3, 384KB Flash, 48KB
SRAM, 12KB EEPROM, LCD, USB, ADC, DAC, memory I/F
Datasheet - production data
Features
Ultra-low-power platform
– 1.65 V to 3.6 V power supply
-40°C to 105°C temperature range
– 305 nA Standby mode (3 wakeup pins)
– 1.15 µA Standby mode + RTC
– 0.475 µA Stop mode (16 wakeup lines)
– 1.35 µA Stop mode + RTC
– 11 µA Low-power run mode
– 230 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
Core: Arm® Cortex®-M3 32-bit CPU
– From 32 kHz up to 32 MHz max
– 33.3 DMIPS peak (Dhrystone 2.1)
– Memory protection unit
Up to 34 capacitive sensing channels
CRC calculation unit, 96-bit unique ID
Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factory-
trimmed RC (+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz
– PLL for CPU clock and USB (48 MHz)
Pre-programmed bootloader
– USB and USART supported
Serial wire debug, JTAG and trace
Up to 116 fast I/Os (102 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
LQFP144 (20 × 20 mm)
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
UFBGA132
(7 × 7 mm)
WLCSP64
(0.4 mm pitch)
Memories
– 384 Kbytes of Flash memory with ECC
(with 2 banks of 192 Kbytes enabling Rww
capability)
– 48 Kbytes of RAM
– 12 Kbytes of true EEPROM with ECC
– 128-byte backup register
– Memory interface controller supporting
SRAM, PSRAM and NOR Flash
LCD driver (except STM32L151xD devices) up
to 8x40 segments, contrast adjustment,
blinking mode, step-up converter
Rich analog peripherals (down to 1.8V)
– 3x operational amplifiers
– 12-bit ADC 1 Msps up to 40 channels
– 12-bit DAC 2 ch with output buffers
– 2x ultra-low-power-comparators
(window mode and wakeup capability)
DMA controller 12x channels
12x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 5x USARTs
– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
– 2x I2Cs (SMBus/PMBus)
– 1x SDIO interface
11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels, 2x 16-bit basic timers,
2x watchdog timers (independent and window)
Table 1. Device summary
Reference
Part number
STM32L151xD
STM32L152xD
STM32L151QD, STM32L151RD,
STM32L151VD, STM32L151ZD
STM32L152QD, STM32L152RD,
STM32L152VD, STM32L152ZD
October 2017
This is information on a product in full production.
DocID022027 Rev 12
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www.st.com

STM32L152ZD
Contents
Contents
STM32L151xD STM32L152xD
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2 Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2.1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2.2 Shared peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2.3 Common system strategy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2.4 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Arm® Cortex®-M3 core with MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3 Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5 Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 25
3.6 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8 FSMC (flexible static memory controller) . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.9 DMA (direct memory access) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.10 LCD (liquid crystal display) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.11 ADC (analog-to-digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.11.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.11.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.12 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.13 Operational amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.14 Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 29
3.15 System configuration controller and routing interface . . . . . . . . . . . . . . . 29
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Features STM32L151xD STM32L152xD Ultra-low-power 32-bit MCU Arm® Cortex®-M3, 384KB Fl ash, 48KB SRAM, 12KB EEPROM, LCD, USB, ADC, DAC, memory I/F Datasheet - produc tion data Features • Ultra-low-power platform – 1.65 V to 3.6 V power sup ply – -40°C to 105°C temperature ra nge – 305 nA Standby mode (3 wakeup p ins) – 1.15 µA Standby mode + RTC 0.475 µA Stop mode (16 wakeup lines) – 1.35 µA Stop mode + RTC – 11 µ A Low-power run mode – 230 µA/MHz Ru n mode – 10 nA ultra-low I/O leakage – 8 µs wakeup time • Core: Arm® C ortex®-M3 32-bit CPU – From 32 kHz u p to 32 MHz max – 33.3 DMIPS peak (Dh rystone 2.1) – Memory protection unit • Up to 34 capacitive sensing channe ls • CRC calculation unit, 96-bit uni que ID • Reset and supply management – Low-power, ultrasafe BOR (brownout reset) with 5 selectable thresholds – Ultra-low-power POR/PDR – Programmab le voltage detector (PVD) • Clock sou rces – 1 to 24 MHz crystal oscillator – 32 kHz oscillator for RTC with calibration – High Speed Internal 16 MHz factory.
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