W25N02JW DUAL/QUAD SPI Datasheet

W25N02JW Datasheet, PDF, Equivalent


Part Number

W25N02JW

Description

1.8V 2G-BIT SERIAL SLC NAND FLASH MEMORY DUAL/QUAD SPI

Manufacture

Winbond

Total Page 30 Pages
Datasheet
Download W25N02JW Datasheet


W25N02JW
W25N02JWxxIF/IC
1.8V 2G-BIT
SERIAL SLC NAND FLASH MEMORY
DUAL/QUAD SPI WITH 166MHZ STR & 80MHZ DTR
BUFFER READ & CONTINUOUS READ
Release Date: November 18th, 2019
Revision A

W25N02JW
W25N02JWxxIF/IC
Table of Contents
1. GENERAL DESCRIPTIONS....................................................................................................... 6
2. FEATURES................................................................................................................................. 6
3. PACKAGE TYPES AND PIN CONFIGURATIONS .................................................................... 7
3.1 Pad Configuration WSON 8x6-mm ................................................................................ 7
3.2 Pad Description WSON 8x6-mm.................................................................................... 7
3.3 Pin Configuration SOIC 300-mil ..................................................................................... 8
3.4 Pin Description SOIC 300-mil......................................................................................... 8
3.5 Ball Configuration TFBGA 8x6-mm (5x5-1 Ball Array) ................................................... 9
3.6 Ball Description TFBGA 8x6-mm ................................................................................... 9
4. PIN DESCRIPTIONS ................................................................................................................ 10
4.1 Chip Select (/CS).......................................................................................................... 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................ 10
4.3 Write Protect (/WP)....................................................................................................... 10
4.4 HOLD (/HOLD) ............................................................................................................. 10
4.5 Serial Clock (CLK) ........................................................................................................ 10
4.6 Reset (/RESET)............................................................................................................ 10
5. BLOCK DIAGRAM .................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS............................................................................................... 12
6.1 Device Operation Flow ................................................................................................. 12
6.1.1 Standard SPI Instructions .............................................................................................. 12
6.1.2 Dual SPI Instructions...................................................................................................... 12
6.1.3 Quad SPI Instructions .................................................................................................... 13
6.1.4 DTR Read Instructions................................................................................................... 13
6.1.5 Hold Function................................................................................................................. 13
6.1.6 Software Reset & Hardware /RESET pin ....................................................................... 13
6.2 Write Protection ............................................................................................................ 14
6.3 DLP (Data Learning Pattern) ........................................................................................ 15
6.4 Interface States ............................................................................................................ 16
7. PROTECTION, CONFIGURATION AND STATUS REGISTERS ............................................ 17
7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable)................... 17
7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable........... 17
7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable .......................... 18
7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable .............. 18
7.2 Configuration Register / Status Register-2 (Volatile Writable ...................................... 19
7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable.................................................... 19
7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable .............................................. 19
7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable....................................................... 19
7.2.4 ECC Enable Bit (ECC-E) Volatile Writable.................................................................. 20
7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable.............................. 20
7.2.6 Quad Enable (QE) Volatile Writable............................................................................ 20
7.3 Status Register-3 (Status only) .................................................................................... 21
7.3.1 Look-Up Table Full (LUT-F) Status Only..................................................................... 21
7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ................................................ 21
7.3.3 Program Failure (P-FAIL) Status Only ........................................................................ 22
Release Date: November 18th, 2019
- 1 - Revision A


Features W25N02JWxxIF/IC 1.8V 2G-BIT SERIAL SLC N AND FLASH MEMORY DUAL/QUAD SPI WITH 166 MHZ STR & 80MHZ DTR BUFFER READ & CONTI NUOUS READ Release Date: November 18th, 2019 Revision A W25N02JWxxIF/IC Table of Contents 1. GENERAL DESCRIPTIONS... ....................................... ....................................... ...................... 6 2. FEATURES... ....................................... ....................................... ....................................... ......... 6 3. PACKAGE TYPES AND PIN CO NFIGURATIONS .......................... ....................................... ... 7 3.1 Pad Configuration WSON 8x6-mm ...................................... ....................................... ... 7 3.2 Pad Description WSON 8x6-mm.. ....................................... ....................................... .... 7 3.3 Pin Configuration SOIC 300-m il .................................... ....................................... .......... 8 3.4 Pin Description SOIC 300-mil...................
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