Document
DS1624
Digital Thermometer and Memory
General Description
The DS1624 consists of two separate functional units: a 256-byte nonvolatile E2 memory and a direct-to-digital temperature sensor.
The nonvolatile memory is made up of 256 bytes of E2 memory. This memory can be used to store any type of information the user wishes. These memory locations are accessed through the 2-wire serial bus.
The direct-to-digital temperature sensor allows the DS1624 to measure the ambient temperature and report the temperature in a 12-bit word with 0.0625°C resolution. The temperature sensor and its related registers are accessed through the 2-wire serial interface. Figure 1 shows a block diagram of the DS1624.
Benefits and Features
●● Reduces Component Count with Integrated Temperature Sensor and Nonvolatile E2 Memory • Measures Temperatures from -55°C to +125°C in 0.0625°C Increments • ±0.5°C Accuracy from 0°C to 70°C • 256 Bytes of E2 Memory for Storing Information Such as Frequency Compensation Coefficients • No External Components
●● Easy-to-Use 2-Wire Serial Interface • Temperature is Read as a 12-Bit Value (2-Byte Transfer)
●● Available in 8-Pin SO and DIP Packages
Figure 1. Block Diagram
Ordering Information appears at end of data sheet.
VDD SCL SDA
A0 ADDRESS AND A1 I/O CONTROL A2 GND
STATUS REGISTER AND CONTROL LOGIC
TEMPERATURE SENSOR
EEPROM MEMORY (256 BYTES)
DS1624
19-6288; Rev 5; 8/15
DS1624
Digital Thermometer and Memory
Absolute Maximum Ratings
Voltage Range on Any Pin Relative to Ground.....-0.5V to +6.0V Continuous Power Dissipation (TA = +70°C) PDIP (derate 9.10mW/°C above +70°C).................727.30mW Operating Temperature Range.......................... -55°C to +125°C
Storage Temperature Range............................. -55°C to +125°C Soldering Temperature (reflow)........................................+260°C Lead Temperature (soldering, 10s).................................. +300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability.
Package Thermal Characteristics (Note 1)
PDIP Junction-to-Ambient Thermal Resistance (θJA).........110°C/W
Junction-to-Case Thermal Resistance (θJC)................40°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Recommended Operating Conditions
PARAMETER Supply Voltage
SYMBOL VDD
(Note 2)
CONDITIONS
MIN TYP MAX UNITS
2.7 5.0 5.5
V
DC Electrical Characteristics
(VDD = 2.7V to 5.5V, TA = -55°C to +125°C, unless otherwise noted.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
Thermometer Error
TERR
0°C to +70°C -55°C to +125°C
Thermometer Resolution
12-bit
Low-Level Input Voltage
High-Level Input Voltage
Pulse Width of Spikes That Must Be Suppressed by the Input Filter
VIL VIH
tSP Fast mode
Low-Level Output Voltage (SDA)
Input Current Each I/O Pin I/O Capacitance
VOL1 VOL2
CI/O
3mA sink current (Note 2) 6mA sink current (Note 2) 0.4 < VI/O < 0.9VDD (Note 4)
Temperature conversion
Active Supply Current
ICC E2 write (Notes 5, 6) Communication only
Standby Supply Current
ISTBY
(Notes 5, 6, 7)
MIN TYP MAX
±0.5
±2.0
0.0625
-0.3 0.7 x VDD
0.3 x VDD VDD + 0.3
UNITS
°C
°C V V
0 50 ns
0 0.4 V
0 0.6 -1 +1 µA
10 pF 1250 400 µA 125 1 3 µA
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DS1624
Digital Thermometer and Memory
AC Electrical Characteristics
(VDD = 2.7V to 5.5V, TA = -55°C to +125°C, unless otherwise noted. All values referred to VIH = 0.9VDD and VIL = 0.1VDD.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Temperature Conversion Time EEPROM Write Cycle Time EEPROM Endurance EEPROM Data Retention SLK Clock Frequency
tTC tWR
NEEWR
tEEDR
fSCL
0°C to +70°C (Note 8)
-20°C to +70°C
TA = +25°C -40°C to +70°C
(Note 9)
Fast mode Standard mode
(Note 10)
200 ms
50 ms
10k 20k 40k 80k
Write Cycles
10 20
Years
0 400 kHz
0 100
Bus Free Time Between a STOP and START Condition
tBUF
Fast mode Standard mode
(Note 10)
1.3 4.7
µs
Hold Time (Repeated) START Condition
tHD:STA
Fast mode Standard mode
(Notes 10, 11)
0.6 4.0
µs
Low Period of SCL Clock
tLOW
Fast mode Standard mode
(Note 10)
1.3 4.7
µs
High Period of SCL Clock
tHIGH
Fast mode Standard mode
(Note 10)
0.6 4.0
µs
Setup Time for a Repeated START Condition
tSU:STA
Fast mode Standard mode
(Note 10)
0.6 4.7
µs
Data Hold Time
tHD:DAT
Fast mode Standard mode
(Note 10)
0 0
0.9 µs
0.9
Data Setup Time
tSU:DAT
Fast mode Standard mode
(Notes 10, 11, 12)
100 250
ns
Rise Time of Both SDA and SCL Signals
Fall Time of Both S.