DS90C401 Signaling Driver Datasheet

DS90C401 Datasheet, PDF, Equivalent


Part Number

DS90C401

Description

Dual Low Voltage Differential Signaling Driver

Manufacture

etcTI

Total Page 19 Pages
Datasheet
Download DS90C401 Datasheet


DS90C401
NRND
DS90C401
www.ti.com
SNLS002C – JUNE 1998 – REVISED APRIL 2013
DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver
Check for Samples: DS90C401
FEATURES
1
2 Ultra Low Power Dissipation
• Operates Above 155.5 Mbps
• Standard TIA/EIA-644
• 8 Lead SOIC Package Saves Space
• Low Differential Output Swing typical 340 mV
DESCRIPTION
The DS90C401 is a dual driver device optimized for
high data rate and low power applications. This
device along with the DS90C402 provides a pair chip
solution for a dual high speed point-to-point interface.
The DS90C401 is a current mode driver allowing
power dissipation to remain low even at high
frequency. In addition, the short circuit fault current is
also minimized. The device is in a 8 lead small
outline package. The differential driver outputs
provides low EMI with its low output swings typically
340 mV.
Connection Diagram
Functional Diagram
See Package Number D (SOIC)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated

DS90C401
DS90C401
NRND
SNLS002C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC)
Input Voltage (DIN)
Output Voltage (DOUT+, DOUT)
Short Circuit Duration
(DOUT+, DOUT)
Maximum Package Power Dissipation @ +25°C
Storage Temperature Range
Lead Temperature Range
Soldering (4 sec.)
Maximum Junction Temperature
ESD Rating(3)
D Package
Derate D Package
(HBM, 1.5 kΩ, 100 pF)
(EIAJ, 0 Ω, 200 pF)
0.3V to +6V
0.3V to (VCC + 0.3V)
0.3V to (VCC + 0.3V)
Continuous
1068 mW
8.5 mW/°C above +25°C
65°C to +150°C
+260°C
+150°C
3,500V
250V
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) ESD Ratings:
HBM (1.5 kΩ, 100 pF) 3,500V
EIAJ (0Ω, 200 pF) 250V
Recommended OperatingConditions
Min Typ Max Units
Supply Voltage (VCC)
Operating Free Air Temperature (TA)
+4.5 +5.0 +5.5
40 +25 +85
V
°C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified.(1)(2)
Symbol
Parameter
Conditions
Pin
VOD1
ΔVOD1
Differential Output Voltage
Change in Magnitude of VOD1 for
Complementary Output States
RL = 100Ω (Figure 1)
DOUT,
DOUT+
VOS
ΔVOS
Offset Voltage
Change in Magnitude of VOS for
Complementary Output States
VOH Output Voltage High
VOL Output Voltage Low
IOS Output Short Circuit Current
VIH Input Voltage High
VIL Input Voltage Low
II Input Current
VCL Input Clamp Voltage
ICC No Load Supply Current
ICCL Loaded Supply Current
RL = 100Ω
VOUT = 0V (3)
VIN = VCC, GND, 2.5V or 0.4V
ICL = 18 mA
DIN = VCC or GND
DIN = 2.5V or 0.4V
RL = 100Ω All Channels
VIN = VCC or GND (all inputs)
DIN
VCC
Min
250
1.125
0.90
2.0
GND
10
1.5
Typ
340
4
1.25
5
1.41
1.07
3.5
±1
0.8
1.7
3.5
8
Max
450
35
1.375
25
1.60
5.0
VCC
0.8
+10
3.0
5.5
14.0
Units
mV
|mV|
V
|mV|
V
V
mA
V
V
μA
V
mA
mA
mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except: VOD1 and ΔVOD1.
(2) All typicals are given for: VCC = +5.0V, TA = +25°C.
(3) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
2 Submit Documentation Feedback
Product Folder Links: DS90C401
Copyright © 1998–2013, Texas Instruments Incorporated


Features NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 DS90 C401 Dual Low Voltage Differential Sign aling (LVDS) Driver Check for Samples: DS90C401 FEATURES 1 •2 Ultra Low Pow er Dissipation • Operates Above 155.5 Mbps • Standard TIA/EIA-644 • 8 Le ad SOIC Package Saves Space • Low Dif ferential Output Swing typical 340 mV DESCRIPTION The DS90C401 is a dual driv er device optimized for high data rate and low power applications. This device along with the DS90C402 provides a pai r chip solution for a dual high speed p oint-to-point interface. The DS90C401 i s a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circu it fault current is also minimized. The device is in a 8 lead small outline pa ckage. The differential driver outputs provides low EMI with its low output sw ings typically 340 mV. Connection Diag ram Functional Diagram See Package Nu mber D (SOIC) These devices have limited built-in ESD protection. The leads .
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