DS90CP22 Crosspoint Switch Datasheet

DS90CP22 Datasheet, PDF, Equivalent


Part Number

DS90CP22

Description

800Mbps 2x2 LVDS Crosspoint Switch

Manufacture

etcTI

Total Page 19 Pages
Datasheet
Download DS90CP22 Datasheet


DS90CP22
DS90CP22
www.ti.com
SNLS053E – MARCH 2000 – REVISED APRIL 2013
DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch
Check for Samples: DS90CP22
FEATURES
1
2 DC - 800 Mbps Low Jitter, Low Skew Operation
• 65 ps (typ) of Pk-Pk Jitter with PRBS = 2231
Data Pattern at 800 Mbps
• Single +3.3 V Supply
• Less than 330 mW (typ) Total Power
Dissipation
• Non-Blocking "'Switch Architecture"'
• Balanced Output Impedance
• Output Channel-to-Channel Skew is 35 ps (typ)
• Configurable as 2:1 mux, 1:2 demux, Repeater
or 1:2 Signal Splitter
• LVDS Receiver Inputs Accept LVPECL Signals
• Fast Switch Time of 1.2ns (typ)
• Fast Propagation Delay of 1.3ns (typ)
• Receiver Input Threshold < ±100 mV
• Available in 16 Lead TSSOP and SOIC
Packages
• Conforms to ANSI/TIA/EIA-644-1995 LVDS
Standard
• Operating Temperature: 40°C to +85°C
DESCRIPTION
DS90CP22 is a 2x2 crosspoint switch utilizing LVDS
(Low Voltage Differential Signaling) technology for
low power, high speed operation. Data paths are fully
differential from input to output for low noise
generation and low pulse width distortion. The non-
blocking design allows connection of any input to any
output or outputs. LVDS I/O enable high speed data
transmission for point-to-point interconnects. This
device can be used as a high speed differential
crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2
signal splitter. The mux and demux functions are
useful for switching between primary and backup
circuits in fault tolerant systems. The 1:2 signal
splitter and 2:1 mux functions are useful for
distribution of serial bus across several rack-mounted
backplanes.
The DS90CP22 accepts LVDS signal levels, LVPECL
levels directly or PECL with attenuation networks.
The individual LVDS outputs can be put into TRI-
STATE by use of the enable pins.
For more details, please refer to the Application
Information section of this datasheet.
Connection Diagram
Figure 1. SOIC-16 Package
or
TSSOP-16 Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated

DS90CP22
DS90CP22
SNLS053E – MARCH 2000 – REVISED APRIL 2013
www.ti.com
Figure 2. Diff. Output Eye-Pattern in 1:2 split mode @ 800 Mbps
Conditions: 3.3 V, PRBS = 2231 data pattern,
VID = 300mV, VCM = +1.2 V, 200 ps/div, 100 mV/div
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC)
CMOS/TTL Input Voltage (EN0, EN1, SEL0, SEL1)
LVDS Receiver Input Voltage (IN+, IN)
LVDS Driver Output Voltage (OUT+, OUT)
LVDS Output Short Circuit Current
Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 4 sec.)
Maximum Package Power Dissipation at
25°C
16L SOIC
16L SOIC Package Derating
16L TSSOP
16L TSSOP Package Derating
ESD Rating
(HBM, 1.5kΩ, 100pF)
(EIAJ, 0Ω, 200pF)
0.3V to +4V
0.3V to (VCC + 0.3V)
0.3V to +4V
0.3V to +4V
Continuous
+150°C
65°C to +150°C
+260°C
1.435 W
11.48 mW/°C above +25°C
0.866 W
9.6 mW/°C above +25°C
> 5 kV
> 250 V
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(2) “Absolute Maximum Ratings” are these beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. “Electrical Characteristics” provides conditions for actual device operation.
Recommended Operating Conditions
Supply Voltage (VCC)
Receiver Input Voltage
Operating Free Air Temperature
Min Typ Max Units
3.0 3.3 3.6
V
0 VCC
-40 +25 +85
V
°C
2 Submit Documentation Feedback
Product Folder Links: DS90CP22
Copyright © 2000–2013, Texas Instruments Incorporated


Features DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch Che ck for Samples: DS90CP22 FEATURES 1 2 DC - 800 Mbps Low Jitter, Low Skew O peration • 65 ps (typ) of Pk-Pk Jitte r with PRBS = 223−1 Data Pattern at 8 00 Mbps • Single +3.3 V Supply • Le ss than 330 mW (typ) Total Power Dissip ation • Non-Blocking "'Switch Archite cture"' • Balanced Output Impedance Output Channel-to-Channel Skew is 35 ps (typ) • Configurable as 2:1 mux, 1:2 demux, Repeater or 1:2 Signal Split ter • LVDS Receiver Inputs Accept LVP ECL Signals • Fast Switch Time of 1.2 ns (typ) • Fast Propagation Delay of 1.3ns (typ) • Receiver Input Threshol d < ±100 mV • Available in 16 Lead T SSOP and SOIC Packages • Conforms to ANSI/TIA/EIA-644-1995 LVDS Standard • Operating Temperature: −40°C to +85 °C DESCRIPTION DS90CP22 is a 2x2 cros spoint switch utilizing LVDS (Low Volta ge Differential Signaling) technology for low power, high speed operation. Data paths are fully differen.
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