SN74F240

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F241 and ′F244, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. The ′F240 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. The SN74F240 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54F240 is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74F240 is characterized for operation from 0°C to 70°C. 2Y1 GND 2A1 1Y4 2A2 SN54F240, SN74F240 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993 SN54F240 . . . J PACKAGE SN74F240 . . . DB, DW, OR N PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3...