OCTAL BUFFERS/DRIVERS
• 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
• Package Options Include Plastic
Small-Outline (SO...
Description
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
Package Options Include Plastic
Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
description
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F240 and ′F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs.
The ′F244 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
The SN74F244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F244 is characterized for operation over the full military temperature range of − 55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.
2Y1 GND 2A1 1Y4 2A2
SN54F244, SN74F244 OCTAL BUFFERS/DRIVERS
WITH 3ĆSTATE OUTPUTS
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993
SN54F244 . . . J PACKAGE SN74F244 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
1OE 1A1 2Y4 1A2 2Y3 1A3...
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