Nano Module. LMZ10500 Datasheet

LMZ10500 Module. Datasheet pdf. Equivalent

LMZ10500 Datasheet
Recommendation LMZ10500 Datasheet
Part LMZ10500
Description 650-mA Nano Module
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Texas Instruments LMZ10500
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
LMZ10500
SNVS723G – OCTOBER 2011 – REVISED JULY 2018
LMZ10500 650-mA Nano Module With 5.5-V Maximum Input Voltage
1 Features
1 Output Current Up to 650 mA
• Input Voltage Range 2.7 V to 5.5 V
• Output Voltage Range 0.6 V to 3.6 V
• Efficiency up to 95%
• Integrated Inductor
• 8-Pin microSiP Footprint
• –40°C to 125°C Junction Temperature Range
• Adjustable Output Voltage
• 2-MHz Fixed PWM Switching Frequency
• Integrated Compensation
• Soft-Start Function
• Current Limit Protection
• Thermal Shutdown Protection
• Input Voltage UVLO for Power-Up, Power-Down,
and Brownout Conditions
• Only 5 External Components — Resistor Divider
and 3 Ceramic Capacitors
• Small Solution Size
• Low Output Voltage Ripple
• Easy Component Selection and Simple PCB
Layout
• High Efficiency Reduces System Heat Generation
• Create a Custom Design Using the LMZ10500
With the WEBENCH® Power Designer
2 Applications
• Point of Load Conversions From 3.3-V and 5-V
Rails
• Space Constrained Applications
• Low Output Noise Applications
3 Description
The LMZ10500 nano module is an easy-to-use step-
down DC/DC solution capable of driving up to 650
mA load in space-constrained applications. Only an
input capacitor, an output capacitor, a small VCON
filter capacitor, and two resistors are required for
basic operation. The nano module comes in an 8-pin
µSiP footprint package with an integrated inductor.
Internal current limit based soft-start function, current
overload protection, and thermal shutdown are also
provided.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
LMZ10500
µSiP (8)
3.00 mm × 2.60 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
space
space
space
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Typical Efficiency at VIN = 3.6 V
100
90
80
70
60
50
40
30
20
0
VOUT=1.2V
VOUT=1.8V
VOUT=2.5V
VOUT=3.3V
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65
LOAD CURRENT (A)
C009
Radiated EMI (CISPR22)
VIN = 5 V, VOUT = 1.8 V, IOUT = 650 mA
80
Evaluation Board
70 EN 55022 Class B Limit
60 EN 55022 Class A Limit
50
40
30
20
10
0
0 200 400 600 800 1000
Frequency (MHz)
C001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LMZ10500
LMZ10500
SNVS723G – OCTOBER 2011 – REVISED JULY 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 System Characteristics ............................................. 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 11
8 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application ................................................. 13
9 Power Supply Recommendations...................... 20
9.1 Voltage Range ........................................................ 20
9.2 Current Capability ................................................... 20
9.3 Input Connection .................................................... 20
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 21
10.3 Package Considerations ....................................... 22
11 Device and Documentation Support ................. 23
11.1 Device Support .................................................... 23
11.2 Documentation Support ........................................ 23
11.3 Receiving Notification of Documentation Updates 23
11.4 Community Resources.......................................... 23
11.5 Trademarks ........................................................... 23
11.6 Electrostatic Discharge Caution ............................ 23
11.7 Glossary ................................................................ 23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
12.1 Tape and Reel Information ................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (February 2015) to Revision G
Page
• editorial rebranding for SEO ................................................................................................................................................... 1
• Added links for Webench ....................................................................................................................................................... 1
• Move storage temperature spec to Abs Max table ................................................................................................................ 4
• Changed "Handling" to "ESD" Ratings .................................................................................................................................. 4
• Added Device Support ......................................................................................................................................................... 23
• Changed SIL package drawing to SIL0008G ...................................................................................................................... 24
Changes from Revision E (September 2014) to Revision F
Page
• Switched Figure 16 and Figure 17 ....................................................................................................................................... 15
Changes from Revision D (January 2014) to Revision E
Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision C (March 2013) to Revision D
Page
• Added new package SIL0008A .............................................................................................................................................. 3
2 Submit Documentation Feedback
Product Folder Links: LMZ10500
Copyright © 2011–2018, Texas Instruments Incorporated



Texas Instruments LMZ10500
www.ti.com
5 Pin Configuration and Functions
TOP VIEW
18
27
36
45
SIL Package
8-Pin µSIP
SIDE VIEW
LMZ10500
SNVS723G – OCTOBER 2011 – REVISED JULY 2018
BOTTOM VIEW
8 VREF
EN 1
7 VIN
6 PGND
PAD
(SGND)
VCON 2
FB 3
5 VOUT
SGND 4
PIN
NO. NAME
1 EN
2 VCON
3 FB
4 SGND
5 VOUT
6 PGND
7 VIN
8 VREF
— PAD
Pin Functions
I/O DESCRIPTION
I Enable input. Set this digital input higher than 1.2 V for normal operation. For shutdown, set low.
Pin is internally pulled up to VIN and can be left floating for always-on operation.
I Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to
set the VOUT voltage. VOUT = 2.5 × VCON. Connect a small (470 pF) capacitor from this pin to
SGND to provide noise filtering.
I Feedback of the error amplifier. Connect directly to output capacitor to sense VOUT.
I Ground for analog and control circuitry. Connect to PGND at a single point.
O Output Voltage. Connected to one pin of the integrated inductor. Connect output filter capacitor
between VOUT and PGND.
I Power ground for the power MOSFETs and gate-drive circuitry.
I Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to
these two pins. Typical capacitor values are between 4.7 µF and 22 µF.
O 2.35 V voltage reference output. Typically connected to VCON pin through a resistive divider to set
the output voltage.
I The center pad underneath the SIL0008A package is internally tied to SGND. Connect this pad to
the ground plane for improved thermal performance.
Copyright © 2011–2018, Texas Instruments Incorporated
Product Folder Links: LMZ10500
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