Power Module. LMZ10503EXT Datasheet

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LMZ10503EXT Datasheet
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Part LMZ10503EXT
Description 3-A Power Module
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LMZ10503EXT
SNVS668J – JUNE 2010 – REVISED APRIL 2019
LMZ10503EXT 3-A Power Module With 5.5-V Maximum Input Voltage for Demanding and
Rugged Applications
1 Features
1 Integrated Shielded Inductor
• Flexible Start-up Sequencing Using External Soft
Start, Tracking, and Precision Enable
• Protection Against In-Rush Currents and Faults
Such as Input UVLO and Output Short-Circuit
• Single Exposed Pad and Standard Pinout for Easy
Mounting and Manufacturing
• Pin-to-Pin Compatible With
– LMZ10504EXT (4-A/20-W Maximum)
– LMZ10505EXT (5-A/25-W Maximum)
• Fast Transient Response for Powering FPGAs
and ASICs
• Electrical Specifications
– 15-W Maximum Total Output Power
– Up to 3-A Output Current
– Input Voltage Range 2.95 V to 5.5 V
– Output Voltage Range 0.8 V to 5 V
– ±1.63% Feedback Voltage Accuracy Over
Temperature
• Performance Benefits
– Operates at High Ambient Temperatures
– Low Radiated Emissions (EMI) Tested to
EN55022 Class B Standard
– Passes 10-V/m Radiated Immunity EMI Tested
to Standard EN61000 4-3
– Passes Vibration Standard
– MIL-STD-883 Method 2007.2 Condition A
– JESD22-B103B Condition 1
– Passes Drop Standard
– MIL-STD-883 Method 2002.3 Condition B
– JESD22-B110 Condition B
– Create a Custom Design Using the LMZ10503
With the WEBENCH® Power Designer
Typical Application Circuit
VIN
Cin
6, 7
VOUT
1
VIN
EN
2
LMZ10503EXT
5
FB
SS GND
3
CSS
4, EP
CO
Rfbt
Rfbb
Rcomp Ccomp
VOUT
2 Applications
• Point-of-Load Conversions From 3.3-V and 5-V
Rails
• Space-Constrained Applications
• Noise-Sensitive Applications (Such as
Transceiver, Medical)
3 Description
The LMZ10503EXT power module is a complete,
easy-to-use, DC-DC solution capable of driving up to
a 3-A load with exceptional power conversion
efficiency, output voltage accuracy, line and load
regulation. The LMZ10503EXT is available in an
innovative package that enhances thermal
performance and allows for hand or machine
soldering.
The LMZ10503EXT accepts an input voltage rail
between 2.95 V and 5.5 V and delivers an adjustable
and highly accurate output voltage as low as 0.8 V. 1-
MHz fixed-frequency PWM switching provides a
predictable EMI characteristic. Two external
compensation components can be adjusted to set the
fastest response time, while allowing the option to
use ceramic or electrolytic output capacitors.
Externally programmable soft-start capacitor
facilitates controlled start-up. The LMZ10503EXT is a
reliable and robust solution with the following
features: lossless cycle-by-cycle peak current limit to
protect for over current or short-circuit fault, thermal
shutdown, input undervoltage lockout, and prebiased
start-up. The LMZ10503EXT is also fully-enabled for
WEBENCH® and Power Designer tools.
Device Information(1)(2)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMZ10503EXT
TO-PMOD (7) 9.85 mm × 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) Peak reflow temperature equals 245°C. See Design Summary
LMZ1xxx and LMZ2xxx Power Module Family for more
details.
Efficiency VOUT = 3.3 V
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LMZ10503EXT
LMZ10503EXT
SNVS668J – JUNE 2010 – REVISED APRIL 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application .................................................. 14
8.3 System Examples ................................................... 20
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Examples................................................... 24
10.3 Estimate Power Dissipation and Thermal
Considerations ......................................................... 27
10.4 Power Module SMT Guidelines ............................ 28
11 Device and Documentation Support ................. 29
11.1 Device Support...................................................... 29
11.2 Documentation Support ........................................ 29
11.3 Community Resources.......................................... 29
11.4 Trademarks ........................................................... 30
11.5 Electrostatic Discharge Caution ............................ 30
11.6 Glossary ................................................................ 30
12 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (June 2017) to Revision J
Page
• Editorial changes only; no technical changes ....................................................................................................................... 1
Changes from Revision H (September 2015) to Revision I
Page
• Changed language of WEBENCH list item; added additional content and links for WEBENCH further in data sheet ......... 1
• Updated Equation 1 ............................................................................................................................................................. 10
• Moved the Low Radiated Emissions (EMI) footnote to the Application Information section ............................................... 14
Changes from Revision G (October 2013) to Revision H
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changes from Revision F (April 2013) to Revision G
Page
• Deleted 10 mils....................................................................................................................................................................... 4
• Changed 10 mils................................................................................................................................................................... 23
• Changed 10 mils................................................................................................................................................................... 27
• Added Power Module SMT Guidelines................................................................................................................................. 28
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Copyright © 2010–2019, Texas Instruments Incorporated
Product Folder Links: LMZ10503EXT



Texas Instruments LMZ10503EXT
www.ti.com
5 Pin Configuration and Functions
LMZ10503EXT
SNVS668J – JUNE 2010 – REVISED APRIL 2019
Exposed Pad
Connect to GND
NDW Package
7-Lead TO-PMOD
Top View
7
6
5
4
3
2
1
VOUT
VOUT
FB
GND
SS
EN
VIN
NAME
EN
PIN
NO.
2
Exposed Pad
FB
GND
5
4
SS 3
VIN
VOUT
1
6, 7
TYPE
Analog
Ground
Analog
Ground
Analog
Power
Power
Pin Functions
DESCRIPTION
Active-high enable input for the device.
Exposed pad thermal connection. Connect this pad to the PCB ground plane in order to
reduce thermal resistance value. It also provides an electrical connection to the input and
output capacitors ground terminals.
Feedback pin. This is the inverting input of the error amplifier used for sensing the output
voltage.
Power ground and signal ground. Connect the bottom feedback resistor between this pin and
the feedback pin.
Soft-start control pin. An internal 2-µA current source charges and external capacitor
connected between this pin and GND (pin 4) to set the output voltage ramp rate during start-
up. This pin can also be used to configure the tracking feature.
A low-ESR input capacitance should be located as close as possible to VIN pin and GND
pin.
This is the output of the internal inductor. Connect an external resistor voltage divider from
VOUT to FB to ground.
Copyright © 2010–2019, Texas Instruments Incorporated
Product Folder Links: LMZ10503EXT
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