Mixed-Signal Microcontroller. MSP430F2619S-HT Datasheet

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MSP430F2619S-HT Datasheet
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Part MSP430F2619S-HT
Description Mixed-Signal Microcontroller
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MSP430F2619S-HT
SLAS697E – MARCH 2010 – REVISED NOVEMBER 2016
MSP430F2619S-HT Mixed-Signal Microcontroller
1 Device Overview
1.1 Features
1
• Low-Supply Voltage Range 1.8 V to 3.6 V
• Ultra-Low Power Consumption
– Active Mode: 365 μA at 1 MHz, 2.2 V
– Standby Mode (VLO): 0.5 μA
– Off Mode (RAM Retention): 0.1 μA
• Wake-Up From Standby Mode in Less than 1 μs
• 16-Bit RISC Architecture, 62.5-ns Instruction Cycle
Time
• Three-Channel Internal DMA
• 12-Bit Analog-to-Digital (A/D) Converter With
Internal Reference, Sample-and-Hold, and
Autoscan Feature
• Dual 12-Bit Digital-to-Analog (D/A) Converters With
Synchronization
• 16-Bit Timer_A With Three Capture/Compare
Registers
• 16-Bit Timer_B With Seven Capture/Compare-
With-Shadow Registers
• On-Chip Comparator
• Four Universal Serial Communication Interfaces
(USCIs)
– USCI_A0 and USCI_A1
– Enhanced UART Supporting Auto-Baud-Rate
Detection (LIN)
– IrDA Encoder and Decoder
– Synchronous SPI
– USCI_B0 and USCI_B1
– I2C
– Synchronous SPI
• Supply Voltage Supervisor/Monitor With
Programmable Level Detection
• Brownout Detector
• Bootstrap Loader
• Serial Onboard Programming, No External
Programming Voltage Needed Programmable
Code Protection by Security Fuse
• MSP430F2619S 120KB + 256B Flash Memory,
4KB RAM
• Available in 64-Pin QFP Package or 64-Pin and
80-Pin KGD Options
• For Complete Module Descriptions, Refer to
MSP430x2xx Family User's Guide (SLAU144).
1.2 Applications
• Supports Extreme Temperature Applications:
– Controlled Baseline
– One Assembly/Test Site
– One Fabrication Site
– Extended Product Life Cycle
– Extended Product-Change Notification
– Product Traceability
• This device is qualified for 1000 hours of
continuous operation at maximum rated
temperature.
• TI high-temperature products use highly-optimized
silicon (die) solutions with design and process
enhancements to maximize performance over
extended temperatures.
1.3 Description
The MSP430F2619S ultra-low-power microcontroller features different sets of peripherals targeted for
various applications. The architecture, combined with five low-power modes, is optimized to achieve
extended battery life in portable measurement applications. The device features a powerful 16-bit RISC
CPU, 16-bit registers, and constant generators that attribute to maximum code efficiency. The digitally
controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 μs.
The MSP430F2619S is a microcontroller configuration with two built-in 16-bit timers, a fast 12-bit A/D
converter, a comparator, dual 12-bit D/A converters, four universal serial communication interface (USCI)
modules, DMA, and up to 64 I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values,
and then process the data for display or for transmission to a host system. Stand-alone RF sensor front
end is another area of application.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



etcTI MSP430F2619S-HT
MSP430F2619S-HT
SLAS697E – MARCH 2010 – REVISED NOVEMBER 2016
www.ti.com
Device Information(1)
PART NUMBER
PACKAGE
MSP430F2619SPM
MSP430F2619S64KGD1
MSP430F2619SKGD1
QFP (PM)
KGD 64-Pin Functionality(2)
KGD 80-Pin Functionality(2)
(1) For more information, see Section 8, Mechanical Packaging and Orderable Information.
(2) KGD = Known good die.
TA
–55°C to 150°C
1.4 Functional Block Diagram
XIN/ XOUT/
XT2IN XT2OUT
22
DVCC DVSS
AVCC
AVSS 1.x/P2P.x
P3.x/P4.x
P5.x/P6.x
2x8 4x8
ACLK
Oscillators
Basic Clock SMCLK
System+
MCLK
Flash
120kB
116kB
92kB
92kB
56kB
16MHz
CPU
1MB
incl. 16
Registers
MAB
MDB
RAM
4kB
8kB
8kB
4kB
4kB
ADC12
12-Bit
8
Channels
DAC12
12-Bit
2
Channels
Voltage
Out
Ports
P1/P2
2x8 I/O
Interrupt
capability
Ports
P3/P4
P5/P6
4x8 I/O
USCI A0
UART/
LIN,
IrDA, SPI
USCI B0
SPI, I2C
Emulation
JTAG
Interface
Brownout
Protection
SVS,
SVM
Hardware
Multiplier
MPY,
MPYS,
MAC,
MACS
DMA
Controller
3
Channels
Watchdog
WDT+
15-Bit
Timer_A3
3 CC
Registers
Timer_B7
7 CC
Registers,
Shadow
Reg
Comp_A+
8
Channels
USCI A1
UART/
LIN,
IrDA, SPI
USCI B1
SPI, I2C
RST/NMI
2 Device Overview
Copyright © 2010–2016, Texas Instruments Incorporated
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MSP430F2619S-HT
SLAS697E – MARCH 2010 – REVISED NOVEMBER 2016
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 1
1.3 Description............................................ 1
1.4 Functional Block Diagram ............................ 2
2 Revision History ......................................... 5
3 Terminal Configurations and Functions ............ 6
3.1 Pin Diagram .......................................... 6
3.2 Pin Attributes ......................................... 7
3.3 Bare Die Information ................................ 10
4 Specifications ........................................... 15
4.1 Absolute Maximum Ratings ........................ 15
4.2 ESD Ratings ........................................ 15
4.3 Recommended Operating Conditions .............. 15
4.4 Thermal Information................................. 17
4.5 Active-Mode Supply Current Into AVCC Excluding
External Current –
Electrical Characteristics ........................... 17
4.6 Typical Characteristics – Active-Mode Supply
Current (Into DVCC + AVCC)......................... 18
4.7 Active-Mode Current vs DCO Frequency ........... 19
4.8 Low-Power-Mode Supply Currents Into AVCC
Excluding External Current – Electrical
Characteristics ...................................... 20
4.9 Typical Characteristics – LPM4 Current ............ 21
4.10 Schmitt-Trigger Inputs (Ports P1 Through P6, and
RST/NMI, JTAG, XIN, and XT2IN) – Electrical
Characteristics ...................................... 22
4.11 Inputs (Ports P1 and P2) – Electrical
Characteristics....................................... 22
4.12 Leakage Current (Ports P1 Through P6) – Electrical
Characteristics....................................... 22
4.13 Standard Inputs - RST/NMI – Electrical
Characteristics....................................... 22
4.14 Outputs (Ports P1 Through P6) – Electrical
Characteristics....................................... 23
4.15 Output Frequency (Ports P1 Through P6) –
Electrical Characteristics ............................ 23
4.16 Typical Characteristics – Outputs ................... 24
4.17 POR/Brownout Reset (BOR) – Electrical
Characteristics ...................................... 25
4.18 Typical Characteristics - POR/Brownout Reset
(BOR)................................................ 26
4.19 SVS (Supply Voltage Supervisor/Monitor) -
Electrical Characteristics ............................ 27
4.20 Typical Characteristics - SVS ....................... 28
4.21 Main DCO Characteristics .......................... 29
4.22 DCO Frequency – Electrical Characteristics........ 29
4.23 Calibrated DCO Frequencies (Tolerance at
Calibration) – Electrical Characteristics ............. 30
4.24 Calibrated DCO Frequencies (Tolerance Over
Temperature) – Electrical Characteristics........... 31
4.25 Calibrated DCO Frequencies (Tolerance Over
Supply Voltage VCC) – Electrical Characteristics ... 32
4.26 Calibrated DCO Frequencies (Overall Tolerance) –
Electrical Characteristics ............................ 32
4.27 Typical Characteristics – Calibrated DCO
Frequency ........................................... 33
4.28 Wake-Up From Low-Power Modes (LPM3/4) –
Electrical Characteristics ........................... 34
4.29 Typical Characteristics – DCO Clock Wake-Up Time
From LPM3/4........................................ 34
4.30 DCChaOraWctiethrisEtixctser.n.a.l..R.e..s.i.s.to..r.R..O.S..C....E.l.e.c.t.r.ic..a.l...... 34
4.31 Typical Characteristics - DCO With External
Resistor ROSC ...................................... 35
4.32 Crystal Oscillator (LFXT1) Low-Frequency Modes –
Electrical Characteristics ........................... 36
4.33 Internal Very-Low-Power, Low-Frequency Oscillator
(VLO) – Electrical Characteristics................... 36
4.34 Crystal Oscillator (LFXT1) High Frequency Modes –
Electrical Characteristics ........................... 37
4.35 Typical Characteristics – LFXT1 Oscillator in HF
Mode (XTS = 1) ..................................... 38
4.36 Crystal Oscillator (XT2) – Electrical Characteristics
...................................................... 39
4.37 Typical Characteristics – XT2 Oscillator ............ 40
4.38 Timer_A – Electrical Characteristics ................ 40
4.39 Timer_B – Electrical Characteristics ................ 40
4.40 USCI (UART Mode) – Electrical Characteristics .... 40
4.41 USCI (SPI Master Mode) – Electrical
Characteristics....................................... 41
4.42 USCI (SPI Slave Mode) – Electrical Characteristics 42
4.43 USCI (I2C Mode) – Electrical Characteristics....... 45
4.44 Comparator_A+ – Electrical Characteristics ....... 46
4.45 Typical Characteristics – Comparator A+ ........... 48
4.46 12-Bit ADC Power-Supply and Input Range
Conditions – Electrical Characteristics ............. 49
4.47 12-Bit ADC External Reference – Electrical
Characteristics....................................... 50
4.48 12-Bit ADC Built-In Reference – Electrical
Characteristics....................................... 51
4.49 Typical Characteristics – ADC12.................... 51
4.50 12-Bit ADC Timing Parameters – Electrical
Characteristics....................................... 53
4.51 12-Bit ADC Linearity Parameters – Electrical
Characteristics ...................................... 53
4.52 12-Bit ADC Temperature Sensor and Built-In VMID
Electrical Characteristics ............................ 54
4.53 12-Bit DAC Supply Specifications – Electrical
Characteristics ...................................... 54
4.54 12-Bit DAC Linearity Parameters – Electrical
Characteristics ...................................... 55
4.55 Typical Characteristics - 12-Bit DAC Linearity
Specifications........................................ 56
4.56 12-Bit DAC Output Specifications – Electrical
Characteristics ...................................... 57
4.57 12-Bit DAC Reference Input Specifications –
Electrical Characteristics ............................ 58
4.58 12-Bit DAC Dynamic Specifications, VREF = VCC,
DAC12IR = 1 – Electrical Characteristics ........... 59
4.59 Flash Memory – Electrical Characteristics .......... 60
4.60 RAM – Electrical Characteristics.................... 61
4.61 JTAG and Spy-Bi-Wire Interface – Electrical
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Table of Contents
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