Output Sensor. ZSC31014 Datasheet

ZSC31014 Sensor. Datasheet pdf. Equivalent

ZSC31014 Datasheet
Recommendation ZSC31014 Datasheet
Part ZSC31014
Description Digital Output Sensor
Feature ZSC31014; RBicilite™ Digital Output Sensor Signal Conditioner ZSC31014 Datasheet Brief Description The ZSC31.
Manufacture Renesas
Datasheet
Download ZSC31014 Datasheet




Renesas ZSC31014
RBicilite™ Digital Output Sensor
Signal Conditioner
ZSC31014
Datasheet
Brief Description
The ZSC31014 is a CMOS integrated circuit for
highly accurate amplification and analog-to-digital
conversion of differential and half-bridge input
signals. The ZSC31014 can compensate the mea-
sured signal for offset, 1st and 2nd order span, and 1st
and 2nd order temperature (Tco and Tcg). It is well
suited for sensor-specific correction of bridge sen-
sors. Digital compensation of signal offset,
sensitivity, temperature drift, and non-linearity is
accomplished via an internal digital signal processor
running a correction algorithm with calibration
coefficients stored in a non-volatile EEPROM.
The ZSC31014 is adjustable to nearly all piezo-
resistive bridge sensors. Measured and corrected
bridge values are provided at digital output pins,
which can be configured as I2C™* or SPI. The digital
I2C™ interface can be used for a simple PC-
controlled calibration procedure to program cali-
bration coefficients into an on-chip EEPROM. The
calibrated ZSC31014 and a specific sensor are
mated digitally: fast, precise, and without the cost
overhead associated with trimming by external
devices or laser trimming.
The ZSC31014’s integrated diagnostics functions
are well suited for safety-critical applications.
Features
High accuracy (±0.1% FSO @ -25 to +85°C;
±0.25% FSO @ -40 to +125°C)
2nd order charge-balancing analog-to-digital
converter provides low noise, 14-bit data at
sample rates exceeding 2kHz
Fast power-up to data output response:
3ms at 4MHz
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Eight programmable analog gain settings com-
bine with a digital gain term; accommodates
bridges with spans <1mV/V and high offset
Internal temperature compensation for sensor
correction and for corrected temperature output
48-bit customer ID field for module traceability
* I2C™ is a trademark of NXP.
Benefits
Simple PC-controlled configuration and single-
pass digital calibration via I2C™ interface – quick
and precise; SPI option for measurement mode
Eliminates need for external trimming
components
On-chip diagnostic features add safety to the
application (e.g., EEPROM signature, bridge
connection checks, bridge short detection).
Low-power Sleep Mode lengthens battery life
Enables multiple sensor networks
Available Support
Evaluation Kit
Application Notes
Mass Calibration Solution
Physical Characteristics
Wide supply voltage capability: 2.7V to 5.5V
Current consumption as low as 70μA depending
on programmed sample rate
Low-power Sleep Mode (<2μA @ 25°C)
Operation temperature: -40°C to +125°C
Small SOP8 package
ZSC31014 Application: I2C™ Interface, Low-Power
Bsink Option, Internal Temperature Correction
ZSC31014
VSS
VDD
BSINK INT/SS
VBP SDA/MISO
VBN SCL/SCLK
Vsupply
(2.7V to 5.5V)
0.1µF
GND
© 2016 Integrated Device Technology, Inc.
1
January 20, 2016



Renesas ZSC31014
RBicilite™ Digital Output Sensor
Signal Conditioner
ZSC31014
Datasheet
ZSC31014 Block Diagram
0.1µF
VDD
(2.7V - 5.5V)
Applications:
Industrial: building automation, data
loggers, pressure meters, leak
detection monitoring
Medical: infusion pumps, blood
pressure meters, air mattresses,
apnea monitors
White Goods / Appliances: fluid
level, refrigerant
Consumer: body monitors, portable
monitors, desktop weather stations,
bathroom scales, toys/games
Sensor
Diagnostics
Temperature
Reference
RBiciLite
ZSC31014
POR/Oscillator
VBP
VBN
Optional
Bsink
INMUX
PreAmp
A
D
14-Bit ADC
Bsupply
EEPROM w/
Charge Pump
& Checksum
DSP
Core
I2C™ or SPI
Interface
INT/SS
SDA/MISO
SCL/SCLK
VSS
Application: Half-Bridge Voltage Measurement
Vsupply 5V
e.g. HIH4000
ZSC31014
VSS
VDD
BSOINK
INT/SS
VBUP SDA/MISO
VBN SCL/SCLK
0.1µF
GND
Application: Generic Differential A2D Converter
Differential
Signal from
Any Source
ZSC31014
VSS
VDD
BSINK INT/SS
VBP SDA/MISO
VBN SCL/SCLK
V Supply
0 .1 µF
GND
Ordering Examples (Refer to section 10 in the data sheet for additional options.)
Sales Code
ZSC31014EAB
Description
ZSC31014 Die — Temperature range: -40°C to +125°C
Package
Unsawn on Wafer
ZSC31014EAC ZSC31014 Die — Temperature range: -40°C to +125°C
Sawn on Wafer Frame
ZSC31014EAG1
ZSC31014KIT
ZSC31014 SOP8 (150 mil) — Temperature range: -40° to +125°C
Tube: add “-T” to sales code / Reel: add “-R”
ZSC31014 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement Board, USB Cable, 5 IC Samples
(software can downloaded on www.IDT.com/ZSC31014)
2 January 20, 2016



Renesas ZSC31014
ZSC31014 Datasheet
Contents
List of Figures .......................................................................................................................................................... 4
List of Tables ........................................................................................................................................................... 5
1 IC Characteristics ............................................................................................................................................. 6
1.1. Absolute Maximum Ratings....................................................................................................................... 6
1.2. Recommended Operating Conditions ....................................................................................................... 6
1.3. Electrical Parameters ................................................................................................................................ 7
1.4. Current Consumption ................................................................................................................................ 9
1.4.1. Update Mode Current Consumption ................................................................................................... 9
1.4.2. Sleep Mode Current Consumption.................................................................................................... 10
1.5. Analog Input versus Output Resolution................................................................................................... 10
2 Circuit Description .......................................................................................................................................... 13
2.1. Signal Flow and Block Diagram............................................................................................................... 13
2.2. Analog Front End..................................................................................................................................... 14
2.2.1. Preamplifier (PreAmp)....................................................................................................................... 14
2.2.2. Analog-to-Digital Converter............................................................................................................... 15
2.2.3. Temperature Measurement .............................................................................................................. 18
2.2.4. Bridge Supply (Bsink)........................................................................................................................ 18
2.2.5. Analog Front-End Configuration ....................................................................................................... 19
2.3. Digital Signal Processor .......................................................................................................................... 19
2.3.1. Digital Core ....................................................................................................................................... 19
2.3.2. Normal Operation Mode.................................................................................................................... 20
2.3.3. EEPROM........................................................................................................................................... 20
2.3.4. Digital Interface – I2C™..................................................................................................................... 20
2.3.5. Digital Interface – SPI ....................................................................................................................... 22
2.3.6. Clock Generator / Power-On Reset (CLKPOR) ................................................................................ 23
2.4. Diagnostic Features................................................................................................................................. 23
2.4.1. EEPROM Integrity............................................................................................................................. 25
2.4.2. Sensor Connection Check ................................................................................................................ 25
2.4.3. Sensor Short Check .......................................................................................................................... 25
3 Functional Description.................................................................................................................................... 26
3.1. General Working Mode............................................................................................................................ 26
3.1.1. Update Mode..................................................................................................................................... 28
3.1.2. Sleep Mode ....................................................................................................................................... 30
3.2. ZSC31014 Read Operations with I2C™ .................................................................................................. 33
3.2.1. I2C™ Read_MR (Measurement Request) ........................................................................................ 34
3.2.2. I2C™ Read_DF (Data Fetch) ............................................................................................................ 34
3.3. SPI Read Operations............................................................................................................................... 34
3.3.1. SPI Read_MR (Measurement Request) ........................................................................................... 34
3 January 20, 2016







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