Transistor Array. BA12003DF-Z Datasheet

BA12003DF-Z Array. Datasheet pdf. Equivalent

BA12003DF-Z Datasheet
Recommendation BA12003DF-Z Datasheet
Part BA12003DF-Z
Description Darlington Transistor Array
Feature BA12003DF-Z; Datasheet 7 Circuits Darlington Transistor Array BA12003DF-Z BA12004DF-Z General Description BA120.
Manufacture ROHM
Datasheet
Download BA12003DF-Z Datasheet




ROHM BA12003DF-Z
Datasheet
7 Circuits
Darlington Transistor Array
BA12003DF-Z BA12004DF-Z
General Description
BA12003DF-Z, BA12004DF-Z are darlington transistor
array consist of 7circuits, input resistor to limit base
current and output surge absorption clamp diode.
Features
Built-in 7 circuits
High output break down voltage
High DC output current gain
Built-in input resistor to limit base current
Built-in output surge absorption clamp diode
Applications
Motor Drivers
LED Drivers
Solenoid Drivers
Low Side Switch
Key Specifications
Output break down voltage
VCE=60V(max)
Output current
Io=500mA/ch(max)
Operating supply voltage range-0.5V to +30V
Operating temperature range-40°C to +85°C
DC current gain
hfe=1000(min)
Input resistor
BA12003DF-Z Rin=2.7kΩ
BA12004DF-Z Rin=10.5kΩ
Packages
SOP-J16A
W(Typ) x D(Typ) x H(Max)
9.90mm x 6.00mm x 1.725mm
SOP-J16A
BA12003DF-Z / BA12004DF-Z
Typical Application Circuit
VCC
VCC
VCC
16 15 14 13 12 11 10 9
12345678
μCOM
Product structure: Silicon monolithic integrated circuit This product has not designed protection against radioactive rays
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ2211114001
1/13
TSZ02201-0GPG0GZ00010-1-2
24.Aug.2018 Rev.009



ROHM BA12003DF-Z
BA12003DF-Z BA12004DF-Z
Pin Configuration
SOP-J16A
(TOP VIEW)
OUT
1
OUT
2
OUT
3
OUT
4
OUT
5
OUT
6
OUT
7
COM
16 15 14 13 12 11 10 9
Block Diagram
16 15 14 13 12 11 10 9
12345678
IN1 IN2 IN3 IN4 IN5 IN6 IN7 GND
Pin Description
Pin No.
1
2
3
4
5
6
7
8
Pin Name
Function
IN1 Input 1
IN2 Input 2
IN3 Input 3
IN4 Input 4
IN5 Input 5
IN6 Input 6
IN7 Input 7
GND
Ground
12345678
Pin No.
9
10
11
12
13
14
15
16
Pin Name
Function
COM Clamp diode cathode
OUT7 Output 7
OUT6 Output 6
OUT5 Output 5
OUT4 Output 4
OUT3 Output 3
OUT2 Output 2
OUT1 Output 1
I/O Equivalence Circuit
COM [Pin.9]
COM [Pin.9]
2.7kΩ
IN
[Pin.1 to 7]
7.2kΩ 3kΩ
OUT
[Pin.10 to 16]
10.5kΩ
IN
[Pin.1 to 7]
7.2kΩ 3kΩ
OUT
[Pin.10 to 16]
GND [Pin.8]
BA12003DF-Z
GND [Pin.8]
BA12004DF-Z
Note : The diode indicating the junction with a dotted line is a parasitic element.
Note : The input and output parasitic diodes cannot be used as clamp diodes.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
2/13
TSZ02201-0GPG0GZ00010-1-2
24.Aug.2018 Rev.009



ROHM BA12003DF-Z
BA12003DF-Z BA12004DF-Z
Absolute Maximum Ratings (TA=25)
Parameter
Symbol
Rating
Unit
Output Voltage
VCE -0.5 to +60
V
Output Current
IO
500 mA/circuit
Input Voltage
VI -0.5 to +30
V
Diode Reverse Voltage
VR
60
V
Diode Forward Current
GND Terminal Current
IF
IGND
500
2.3(Note 1)
mA/ circuit
A
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +150
°C
(Note 1) Pulse width20ms, Duty Cycle10%, 7 circuits flow the same current.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
SOP-J16A
Junction to Ambient
θJA 169.7
115.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT 21
20 °C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
4 Layers
FR-4
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Copper Pattern Thickness
74.2mm x 74.2mm
35μm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
3/13
TSZ02201-0GPG0GZ00010-1-2
24.Aug.2018 Rev.009







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