Power Delivery. BD93F59MWV Datasheet

BD93F59MWV Delivery. Datasheet pdf. Equivalent

Part BD93F59MWV
Description USB Type-C Power Delivery
Feature Datasheet USB Type-C Power Delivery High Voltage Protection of CC Pins USB Type-C Power Delivery Co.
Manufacture ROHM
Datasheet
Download BD93F59MWV Datasheet



BD93F59MWV
Datasheet
USB Type-C Power Delivery
High Voltage Protection of CC Pins
USB Type-C Power Delivery Controller
BD93F59MWV
General Description
BD93F59MWV is a full function USB Type-C Power
Delivery (PD) Controller that supports USB PD using
base-band communication. It is compatible with USB
Type-C Specification and Power Delivery specification.
BD93F59MWV includes support for the PD policy
engine.
Features
32 Bit ARM® Cortex®-M0 Processor Embedded
USB Type-C Specification Ver.1.3 Compatible
USB PD Specification Ver.3.0 Compatible
Integrated VBUS N-ch MOSFET Switch Gate Driver
Integrated VBUS Discharge Switch
Withstand Voltage of CC Pins is 28 V
Key Specifications
VBUS Voltage Range:
VSVR Voltage Range:
Operating Temperature Range:
Protection Voltage of CC Pins:
3.67 V to 22 V
3.1 V to 5.5 V
-30 °C to +85 °C
28 V
FW Revision
Rev6767(1A6Fh)
Applications
Printers
Projectors
Mobile Batteries
Drone / Robot controller
Package
UQFN040V5050
W (Typ) x D (Typ) x H (Max)
5.0 mm x 5.0 mm x 1.0 mm
Typical Application Circuits
VBUS
RDSCHG
120 Ω
Q10 Q11
CVB RS1G
10 μF 0 Ω
CS1S
1.0 μF
CVS
0.1 μF
Power Supply
(5 V)
CC1
USB
Type-C PD
Receptacle
CC2
D+/D-
RX1+/RX1-
RX2+/RX2-
TX1+/TX1-
TX2+/TX2-
GND
9 VCONNIN
7 XCLPOFF1
8 CC1
10 CC2
11 XCLPOFF2
RTHU
22 kΩ
RTHD
t°
USB
PHY
RIDD
100 kΩ
RAT1
100 kΩ
5 ADVREF
14 ADCIN
15 IDSEL
16 ATST1
BD93F59MWV
(Package: UQFN040V5050)
5.0 mm x 5.0 mm x 1.0 mm
U1
VSVR 39
VDDIO
VDDIO 20
RGPIO10
3.3 kΩ
GPIO10 18
GPIO11 19
GPIO0 21
GPIO1 22
GPIO2 23
GPIO3 24
GPIO4 25
GPIO5 26
GPIO6 27
GPIO7 28
GPIO8 29
GPIO9 30
(open)
(open)
(open)
(open)
(open)
(open)
(open)
(open)
RGPIO11
3.3 kΩ
PLUGDET
USBHDET
XRST 40
CVCC
4.7 μF
CV15
1.0 μF
RS 10 mΩ
GND
“ARM® Cortex® “is a registered trademark of Arm Limited.
Product structure : Silicon integrated circuit
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
This product has no designed protection against radioactive rays.
1/18
TSZ02201-0Q3Q0H507700-1-2
02.Dec.2019 Rev.001



BD93F59MWV
BD93F59MWV
Contents
General Description ........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
FW Revision ...................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuits .............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Description................................................................................................................................................................................4
Block Diagram ................................................................................................................................................................................5
Description of Block ........................................................................................................................................................................6
Absolute Maximum Ratings ............................................................................................................................................................7
Thermal Resistance........................................................................................................................................................................7
Recommended Operating Conditions .............................................................................................................................................8
Internal Memory Cell Characteristic ................................................................................................................................................8
Electrical Characteristic ..................................................................................................................................................................8
Timing Chart .................................................................................................................................................................................10
I/O Equivalence Circuits................................................................................................................................................................12
Operational Notes.........................................................................................................................................................................14
1. Reverse Connection of Power Supply ............................................................................................................................14
2. Power Supply Lines........................................................................................................................................................14
3. Ground Voltage...............................................................................................................................................................14
4. Ground Wiring Pattern....................................................................................................................................................14
5. Recommended Operating Conditions.............................................................................................................................14
6. Inrush Current.................................................................................................................................................................14
7. Testing on Application Boards ........................................................................................................................................14
8. Inter-pin Short and Mounting Errors ...............................................................................................................................14
9. Unused Input Pins ..........................................................................................................................................................14
10. Regarding the Input Pin of the IC ...................................................................................................................................15
11. Ceramic Capacitor..........................................................................................................................................................15
12. Thermal Shutdown Circuit (TSD)....................................................................................................................................15
13. Over Current Protection Circuit (OCP) ...........................................................................................................................15
Ordering Information.....................................................................................................................................................................16
Marking Diagram ..........................................................................................................................................................................16
Physical Dimension and Packing Information ...............................................................................................................................17
Revision History............................................................................................................................................................................18
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/18
TSZ02201-0Q3Q0H507700-1-2
02.Dec.2019 Rev.001





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