Delivery Controller. BM92A30MWV-Z Datasheet

BM92A30MWV-Z Controller. Datasheet pdf. Equivalent

Part BM92A30MWV-Z
Description USB Type-C Power Delivery Controller
Feature Datasheet USB Type-C Power Delivery Controller BM92A30MWV-Z General Description BM92A30MWV-Z is a.
Manufacture ROHM
Datasheet
Download BM92A30MWV-Z Datasheet



BM92A30MWV-Z
Datasheet
USB Type-C Power Delivery Controller
BM92A30MWV-Z
General Description
BM92A30MWV-Z is a full function USB Type-C Power
Delivery (PD) controller that supports USB Power
Delivery using baseband communication.
BM92A30MWV-Z includes support for the PD policy
engine and communicates with an Embedded Controller
or the SoC via host interface. It supports SOP, SOP’ and
SOP’’ signaling, allowing it to communicate with cable
marker ICs, support alternate modes.
Features
USB Type-C Specification Compatible
USB PD Specification Compatible (BMC-PHY)
Supports Display Port Control
Automatic Mode without Ext-MCU
Two Power Path Control using N-ch MOSFET
Drivers with Back Flow Prevention
Type-C Cable Orientation Detection
Built-in VCONN Switch and VCONN Controller
Direct VBUS Powered Operation
Supports DFP/UFP/DRP Mode
Supports Dead Battery Operation
SMBus Interface for Host Communication
Key Specifications
VBUS Voltage Range:
4.75 V to 20 V
Power Consumption at Sleep Power: 0.4 mW (Typ)
Operating Temperature Range: -30 °C to +105 °C
Applications
Consumer Applications:
Laptop PCs, Tablet PCs
Package
UQFN40V5050A
W (Typ) x D(Typ) x H(Max)
5.00 mm x 5.00 mm x 1.00 mm
Typical Application Circuit
VBUS
Hi-side
Switch
EN
Sink Path
Source Path
CC1
CC2
VCONN
(5 V)
D1
VCONN_IN
CC1
CC2
USB Type-C
Receptacle
XCLPOFF1
XCLPOFF2
USB-PHY
D+
D-
RX1+, RX1-
RX2+, RX2-
TX1+, TX1-
TX2+, TX2-
USB 3.x SS
MUX
VDDIO
SMDATA
SMCLK
VDDIO
GPIO0(HPD_OUT)
GPIO1(ALERT#)
GPO2/VDIV(BST_EN)
BM92A30MWV-Z GPO3/FB(HSSWEN)
UQFN40V5050A
GPIO7(MSEL1)
GPIO6(MSEL0)
GPIO5(ORIENT)
GPIO4
VDDIO
DBGMODDT
DBGRSTCK
IDSEL/ATST1
VSTR/ATST2
XRST
VCCIN
Charger Power
Power Supply
For Prov (5 V)
VSVR
(3.3 V to 5 V)
VDDIO
(1.8 V to 5 V)
Optional
Ext-MCU
USB3.x-SS/
DP-MUX
Control
N-ch
Open
Drain
DP
HPD_OUT
VCCIN
Reset
GND GND
Product structure : Silicon monolithic integrated circuit
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 14 001
This product has no designed protection against radioactive rays
1/27
TSZ02201-0232AA000660-1-2
19.Jan.2018 Rev.003



BM92A30MWV-Z
BM92A30MWV-Z
Contents
General Description ........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications...........................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Package
W (Typ) x D(Typ) x H(Max).....................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Notation ..........................................................................................................................................................................................3
Reference .......................................................................................................................................................................................3
Pin Configuration ............................................................................................................................................................................4
Pin Descriptions..............................................................................................................................................................................5
Block Diagram ................................................................................................................................................................................6
Absolute Maximum Ratings (Ta=25 °C) ..........................................................................................................................................7
Thermal Resistance(Note 3) ...............................................................................................................................................................7
Recommended Operating Conditions .............................................................................................................................................8
Electrical Characteristics.................................................................................................................................................................8
1. Internal Memory Cell Characteristics ..............................................................................................................................8
2. Circuit Power Characteristics ..........................................................................................................................................8
3. Digital Pin DC Characteristics .........................................................................................................................................9
4. Power Supply Management ..........................................................................................................................................10
5. CC_PHY .......................................................................................................................................................................12
6. Voltage Detection ..........................................................................................................................................................14
7. VBUS Discharge ...........................................................................................................................................................14
8. Power FET Gate Driver .................................................................................................................................................15
Timing Chart .................................................................................................................................................................................16
1. Power On Sequence (Non Dead Battery Operation).....................................................................................................16
2. Power On Sequence (Dead Battery Operation) ............................................................................................................16
3. Reset Timing .................................................................................................................................................................17
4. Power Off Sequence .....................................................................................................................................................17
Application Example .....................................................................................................................................................................18
Selection of Components Externally Connected...........................................................................................................................18
I/O Equivalence Circuit .................................................................................................................................................................19
Operational Notes.........................................................................................................................................................................23
1. Reverse Connection of Power Supply...........................................................................................................................23
2. Power Supply Lines ......................................................................................................................................................23
3. Ground Voltage .............................................................................................................................................................23
4. Ground Wiring Pattern ..................................................................................................................................................23
5. Recommended Operating Conditions ...........................................................................................................................23
6. Inrush Current ...............................................................................................................................................................23
7. Operation Under Strong Electromagnetic Field .............................................................................................................23
8. Testing on Application Boards .......................................................................................................................................23
9. Inter-pin Short and Mounting Errors ..............................................................................................................................24
10. Unused Input Pins.........................................................................................................................................................24
11. Regarding the Input Pin of the IC ..................................................................................................................................24
12. Ceramic Capacitor ........................................................................................................................................................24
13. Area of Safe Operation (ASO) ......................................................................................................................................24
14. Over Current Protection Circuit (OCP) ..........................................................................................................................24
Ordering Information.....................................................................................................................................................................25
Marking Diagrams.........................................................................................................................................................................25
Physical Dimension and Packing Information ...............................................................................................................................26
Revision History............................................................................................................................................................................27
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
2/27
TSZ02201-0232AA000660-1-2
19.Jan.2018 Rev.003





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