Detection Hall. BU52493NUZ Datasheet

BU52493NUZ Hall. Datasheet pdf. Equivalent

BU52493NUZ Datasheet
Recommendation BU52493NUZ Datasheet
Part BU52493NUZ
Description Omnipolar Detection Hall
Feature BU52493NUZ; Datasheet Omnipolar Detection Hall IC BU52493NUZ General Description The omnipolar detection Hall.
Manufacture ROHM
Datasheet
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ROHM BU52493NUZ
Datasheet
Omnipolar Detection Hall IC
BU52493NUZ
General Description
The omnipolar detection Hall IC is magnetic switch that
can operate both S-and N-pole.
This Hall IC product can be in tablets, smart phones, and
other applications in order to detect open and close of
the cover.
Features
Omnipolar Detection
Micro Power Operation (Small
Intermittent Operation Method)
Ultra-compact Package
Current
Using
Key Specifications
VDD Voltage Range:
Operate Point:
Hysteresis:
Period:
Supply Current(Average):
Output Type:
Operating Temperature Range:
1.65 V to 3.60 V
±4.1 mT(Typ)
0.8 mT(Typ)
50 ms(Typ)
4.2 µA (Typ)
CMOS
-40 °C to +85 °C
Package
VSON04Z1114A
W(Typ) x D(Typ) x H(Max)
1.10mm x 1.40mm x 0.40mm
Applications
Tablets, Smart Phones, Notebook Computers,
Digital Video Cameras, Digital Still Cameras, etc.
Typical Application Circuit and Block Diagram
VDD
HALL
ELEMENT
×
TIMING
LOGIC
0.1µF
Adjust the bypass capacitor value
as necessary, according to power
supply noise conditions, etc.
OUT
Pin Descriptions
Pin No. Pin Name
Function
1
VDD
Power supply(Note 1)
2 GND Ground
3 NC Non Connect
4 OUT Output
The EXP-PAD of the center of
-
product connect to GND or
EXP-PAD floating.
No connection internally.
(Note 1) Dispose a bypass capacitor as close as possible to the IC.
GND
Pin Configurations
TOP VIEW (pads not visible)
VDD OUT
14
2
GND
EXP-PAD
3
NC
Product structure : Silicon monolithic integrated circuit
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 14 001
This product has no designed protection against radioactive rays
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TSZ02201-0M2M0F417040-1-2
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ROHM BU52493NUZ
BU52493NUZ
Contents
General Description ................................................................................................................................................................1
Features .................................................................................................................................................................................1
Applications ............................................................................................................................................................................1
Key Specifications...................................................................................................................................................................1
Package .................................................................................................................................................................................1
Typical Application Circuit and Block Diagram ..........................................................................................................................1
Pin Descriptions......................................................................................................................................................................1
Pin Configurations...................................................................................................................................................................1
Absolute Maximum Ratings .....................................................................................................................................................3
Thermal Resistance ................................................................................................................................................................3
Recommended Operating Conditions ......................................................................................................................................4
Magnetic, Electrical Characteristics .........................................................................................................................................4
Measurement Circuit ...............................................................................................................................................................5
Typical Performance Curves....................................................................................................................................................6
Figure 5. Operate Point, Release Point vs Ambient Temperature...........................................................................................6
Figure 6. Operate Point, Release Point vs Supply Voltage ....................................................................................................6
Figure 7. Period vs Ambient Temperature .............................................................................................................................6
Figure 8. Period vs Supply Voltage.......................................................................................................................................6
Figure 9. Supply Current vs Ambient Temperature ................................................................................................................7
Figure 10. Supply Current vs Supply Voltage........................................................................................................................7
Description of Operations ........................................................................................................................................................8
Intermittent Operation at Power ON ....................................................................................................................................... 10
Magnet Selection .................................................................................................................................................................. 10
Position of the Hall Element................................................................................................................................................... 10
I/O Equivalence Circuit.......................................................................................................................................................... 10
Operational Notes ................................................................................................................................................................. 11
Ordering Information ............................................................................................................................................................. 13
Marking Diagrams................................................................................................................................................................. 13
Physical Dimension and Packing Information ......................................................................................................................... 14
Revision History.................................................................................................................................................................... 15
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
2/15
TSZ02201-0M2M0F417040-1-2
17.Jan.2018 Rev.001



ROHM BU52493NUZ
BU52493NUZ
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VDD 4.5 V
Output Current
IOUT ±0.5 mA
Storage Temperature Range
Tstg -40 to +125 °C
Maximum Junction Temperature
Tjmax
125
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 4)
2s2p(Note 5)
Unit
VSON04Z1114A
Junction to Ambient
θJA 512.5
206.1
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT 281
101 °C/W
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Thickness
70μm
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
Thermal Via(Note 6)
Pitch
Diameter
1.20mm
Φ0.30mm
Top 2 Internal Layers
Copper Pattern
Thickness Copper Pattern Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
(Note 6) This thermal via connects with the copper pattern of all layers.
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
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© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
3/15
TSZ02201-0M2M0F417040-1-2
17.Jan.2018 Rev.001







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