Operational Amplifier. LMR1801YG-C Datasheet

LMR1801YG-C Amplifier. Datasheet pdf. Equivalent

LMR1801YG-C Datasheet
Recommendation LMR1801YG-C Datasheet
Part LMR1801YG-C
Description CMOS Operational Amplifier
Feature LMR1801YG-C; .
Manufacture ROHM
Datasheet
Download LMR1801YG-C Datasheet




ROHM LMR1801YG-C
Datasheet
Operational Amplifier
Automotive Low Noise
CMOS Operational Amplifier
LMR1801YG-C
General Description
LMR1801YG-C is single CMOS operational amplifier
features low noise, low input offset voltage and low input
bias current. It is suitable for automotive requirements
such as sensor amplifier, engine control unit, electric
power steering, anti-lock braking system, and so on.
Features
AEC-Q100 Qualified(Note 1)
Low Input-referred Noise Voltage Density
Driving High Capacitive Load
Full-swing Output
(Note 1) Grade 1
Applications
Engine Control Unit
Electric Power Steering (EPS)
Anti-lock Braking System (ABS)
Automotive Electronics
Sensor Amplifiers
Battery-powered Equipment
Current Monitoring Amplifier
ADC Front Ends, Buffer Amplifier
Photodiode Amplifier
Amplifiers
Key Specifications
Input Offset Voltage:
5 μV (Typ)
Input-referred Noise Voltage Density
f = 10 Hz:
20 nV/Hz (Typ)
f = 1 kHz:
5 nV/Hz (Typ)
Common-mode Input Voltage Range:
Input Bias Current:
VSS to VDD-1.0 V
0.5 pA (Typ)
Operating Supply Voltage Range
Single Supply:
2.2 V to 5.5 V
Dual Supply:
±1.10 V to ±2.75 V
Operating Temperature Range: -40 °C to +125 °C
Package
SSOP5
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
Typical Application Circuit
RIN = 100 Ω
VIN
CF = 10 pF
RF = 10 kΩ
VDD = +2.5 V
OUT
=
VSS = -2.5 V
Product structure : Silicon integrated circuit
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 14 001
This product has no designed protection against radioactive rays
1/19
TSZ02201-0GEG2G500010-1-2
26.Aug.2019 Rev.001



ROHM LMR1801YG-C
LMR1801YG-C
Pin Configuration
Pin Description
Pin No.
1
2
3
4
5
Block Diagram
+IN 1
VSS 2
-IN 3
+
-
(TOP VIEW)
5 VDD
4 OUT
Pin Name
+IN
VSS
-IN
OUT
VDD
Function
Non-inverting input
Negative power supply / Ground
Inverting input
Output
Positive power supply
+IN 1
VSS 2
Iref
+
OPAMP
-
5 VDD
-IN 3
4 OUT
Description of Blocks
1. OPAMP:
This block includes a full-swing output operational amplifier with class-AB output circuit and low-noise-ground-sense
differential input stage.
2. Iref:
This block supplies reference current to operate OPAMP block.
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
2/19
TSZ02201-0GEG2G500010-1-2
26.Aug.2019 Rev.001



ROHM LMR1801YG-C
LMR1801YG-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
Differential Input Voltage(Note 1)
VDD-VSS
VID
7.0
VDD-VSS
V
V
Common-mode Input Voltage Range VICMR
(VSS - 0.3) to (VDD + 0.3)
V
Input Current
II ±10 mA
Maximum Junction Temperature
Tjmax
150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 4)
2s2p(Note 5)
Unit
SSOP5
Junction to Ambient
θJA 376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT 40
30 °C/W
(Note 2) Based on JESD51-2A (Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70 μm
Layer Number of
Measurement Board
4 Layers
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70 μm
2 Internal Layers
Copper Pattern
Thickness
74.2 mm x 74.2 mm 35 μm
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Recommended Operating Conditions
Parameter
Symbol
Operating Supply Voltage
Operating Temperature
VDD
Topr
Min
2.2
±1.10
-40
Typ
5.0
±2.50
+25
Max
5.5
±2.75
+125
Unit
V
°C
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
3/19
TSZ02201-0GEG2G500010-1-2
26.Aug.2019 Rev.001







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