N-Channel MOSFET. AOT2500L Datasheet
150V N-Channel MOSFET
The AOT2500L/AOB2500L uses Trench MOSFET
technology that is uniquely optimized to provide the most
efficient high frequency switching performance. Both
conduction and switching power losses are minimized
due to an extremely low combination of RDS(ON), Ciss and
Coss. This device is ideal for boost converters and
synchronous rectifiers for consumer, telecom, industrial
power supplies and LED backlighting.
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
RDS(ON) (at VGS=6V)
100% UIS Tested
100% Rg Tested
Absolute Maximum Ratings TA=25°C unless otherwise noted
Pulsed Drain Current C
Avalanche Current C
Avalanche energy L=0.3mH C
Power Dissipation B TC=100°C
Power Dissipation A TA=70°C
Junction and Storage Temperature Range
-55 to 175
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
t ≤ 10s
* Surface mount package TO263
Rev.1. 0: July 2013
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Electrical Characteristics (TJ=25°C unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage
IDSS Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
RDS(ON) Static Drain-Source On-Resistance
Min Typ Max Units
5.6 7.3 mΩ
gFS Forward Transconductance
VSD Diode Forward Voltage
IS Maximum Body-Diode Continuous Current
Ciss Input Capacitance
Coss Output Capacitance
VGS=0V, VDS=75V, f=1MHz
Crss Reverse Transfer Capacitance
Rg Gate resistance
VGS=0V, VDS=0V, f=1MHz
1 2.1 3.2 Ω
Total Gate Charge
Gate Source Charge
VGS=10V, VDS=75V, ID=20A
97 136 nC
Qgd Gate Drain Charge
Turn-On Rise Time
VGS=10V, VDS=75V, RL=3.75Ω,
tf Turn-Off Fall Time
trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs
Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current limited by package.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.1. 0: July 2013
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