Red Thermometer. MLX90615 Datasheet

MLX90615 Thermometer. Datasheet pdf. Equivalent

MLX90615 Datasheet
Recommendation MLX90615 Datasheet
Part MLX90615
Description Infra Red Thermometer
Feature MLX90615; MLX90615 Infra Red Thermometer Features and Benefits Small size, low cost Easy to integrate Factory.
Manufacture Melexis
Datasheet
Download MLX90615 Datasheet




Melexis MLX90615
MLX90615
Infra Red Thermometer
Features and Benefits
Small size, low cost
Easy to integrate
Factory calibrated in wide temperature range:
-40…85˚C for sensor temperature and
-40…115˚C for object temperature
High accuracy of 0.5°C over wide temperature
range (0...+50°C for both TA and TO )
High (medical) accuracy calibration
Measurement resolution of 0.02°C
SMBus compatible digital interface
Power saving mode
Customizable PWM output for continuous
reading
Embedded emissivity compensation
3V supply voltage
Applications Examples
High precision non-contact temperature
measurements
Hand-held thermometers
Ear thermometers
Home appliances with temperature control
Healthcare
Livestock monitoring
Multiple zone temperature control – up to 127
sensors can be read via common 2 wires
Ordering Information
Part No.
MLX90615
Temperature
Code
S (-20°C...85°C)
Package
Code
SG (TO-46)
- Option Code
-X X X
(1) (2) (3)
Standard Packing
part form
-000
-TU
(1) Accuracy
D – medical accuracy
(2) Specifics:
A – straight pins for thru hole
mounting
(3) Package options:
A – 100°FOV
G – 80°FOV
Example:
MLX90615SSG-DAA-000-TU
1 Functional diagram
J1
SCL
MLX90615 4
U1 Vss
SDA
1 SDA
SCL 3
Vdd
GND
CON1
Vdd
C1
2
0.1uF
C1 value and type may differ
in different applications
for optimum EMC
Figure 1 Typical application schematics –
MLX90615 connection to SMBus
2 General description
The MLX90615 is an Infra Red thermometer for non
contact temperature measurements. Both the IR sensitive
thermopile detector chip and the signal conditioning chip are
integrated in the same TO-46 can package.
Thanks to its low noise amplifier, 16-bit ADC and
powerful DSP unit, a high accuracy and resolution of the
thermometer is achieved.
The thermometer is factory calibrated with the digital
SMBus compatible interface enabled. Readout resolution is
0.02°C.
3901090615
Rev 005
Page 1 of 32
Data Sheet
08 November 2013



Melexis MLX90615
MLX90615
Infra Red Thermometer
General description (continued)
The MLX90615 is built from 2 chips, the Infra Red thermopile detector and the signal conditioning
chip MLX90325, specially designed by Melexis to process the output of IR sensor.
The device is available in an industry standard TO-46 package.
Thanks to the low noise amplifier, high resolution 16-bit ADC and powerful DSP unit of the
MLX90325, Melexis is able to deliver a high accuracy and high resolution infrared thermometer. The
calculated object and ambient temperatures are available in the RAM memory of the MLX90325 with a
resolution of 0.02˚C. The values are accessible by 2 wire serial SMBus compatible protocol with a resolution
of 0.02°C or via a 10-bit PWM (Pulse Width Modulated) signal from the device.
The MLX90615 is factory calibrated in standard temperature ranges from: -40...85˚C for the ambient
temperature and from -40...115˚C for the object temperature.
As a standard, the MLX90615 is delivered with a programmed object emissivity of 1. It can be easily
customized by the customer for any other emissivity in the range 0.1...1.0 without the need of recalibration
with a black body.
The MLX90615 can be battery powered.
An optical filter (5.5µm …14µm long-wave pass) that cuts off the visible and near infra-red radiant
flux is integrated in the package to make the sensor insensitive to visible light.
3901090615
Rev 005
Page 2 of 32
Data Sheet
08 November 2013



Melexis MLX90615
MLX90615
Infra Red Thermometer
3 Table of Contents
1 Functional diagram ................................................................................................................................................................................ 1
2 General description................................................................................................................................................................................ 1
3 Table of Contents .................................................................................................................................................................................. 3
4 Glossary of Terms ................................................................................................................................................................................. 4
5 Maximum ratings ................................................................................................................................................................................... 4
6 Pin definitions and descriptions.............................................................................................................................................................. 5
7 Electrical Specification........................................................................................................................................................................... 6
8 Detailed description ............................................................................................................................................................................... 8
8.1 Block diagram ................................................................................................................................................................................ 8
8.2 Signal processing principle ............................................................................................................................................................. 8
8.3 Block description ............................................................................................................................................................................ 8
8.3.1 Amplifier.................................................................................................................................................................................. 8
8.3.2 Power-On-Reset (POR) .......................................................................................................................................................... 9
8.3.3 EEPROM ................................................................................................................................................................................ 9
8.3.4 RAM...................................................................................................................................................................................... 10
8.4 SMBus compatible 2-wire protocol ............................................................................................................................................... 11
8.4.1 Functional description ........................................................................................................................................................... 11
8.4.2 Differences with the standard SMBus specification (reference [1]) ........................................................................................ 11
8.4.3 Detailed description............................................................................................................................................................... 11
8.4.4 Bit transfer ............................................................................................................................................................................ 13
8.4.5 Commands ........................................................................................................................................................................... 13
8.4.6 SMBus Communication examples......................................................................................................................................... 14
8.4.7 Timing specification............................................................................................................................................................... 14
8.4.8 Sleep Mode........................................................................................................................................................................... 15
8.5 Switching between PWM and SMBus........................................................................................................................................... 16
8.5.1 PWM to SMBus mode........................................................................................................................................................... 16
8.5.2 SMBus to PWM mode........................................................................................................................................................... 16
8.6 PWM ............................................................................................................................................................................................ 16
8.6.1 PWM format.......................................................................................................................................................................... 17
8.6.2 Customizing the temperature range for PWM output ............................................................................................................. 17
8.7 Principle of operation.................................................................................................................................................................... 19
8.7.1 Ambient temperature TA ........................................................................................................................................................ 19
8.7.2 Object temperature TO .......................................................................................................................................................... 19
9 Performance Graphs ........................................................................................................................................................................... 20
9.1 Temperature accuracy of the MLX90615 ...................................................................................................................................... 20
9.2 Field Of View (FOV) ..................................................................................................................................................................... 21
10 Applications Information..................................................................................................................................................................... 23
10.1 Use of the MLX90615 thermometer in SMBus configuration....................................................................................................... 23
10.2 Use of multiple MLX90615s in SMBus configuration................................................................................................................... 23
10.3 PWM output ............................................................................................................................................................................... 24
11 Application Comments....................................................................................................................................................................... 25
12 Standard information regarding manufacturability of Melexis products with different soldering processes.......................................... 26
13 ESD Precautions ............................................................................................................................................................................... 27
14 FAQ................................................................................................................................................................................................... 27
15 Package Information.......................................................................................................................................................................... 29
16 Part marking ...................................................................................................................................................................................... 29
17 Table of figures.................................................................................................................................................................................. 30
18 References ........................................................................................................................................................................................ 31
19 Disclaimer.......................................................................................................................................................................................... 31
3901090615
Rev 005
Page 3 of 32
Data Sheet
08 November 2013







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