Gate Driver. LM5112 Datasheet

LM5112 Driver. Datasheet pdf. Equivalent

Part LM5112
Description Tiny 7-A MOSFET Gate Driver
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LM5112
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LM5112, LM5112-Q1
SNVS234C – SEPTEMBER 2004 – REVISED SEPTEMBER 2016
LM5112, LM5112-Q1 Tiny 7-A MOSFET Gate Driver
1 Features
1 LM5112-Q1 is Qualified for Automotive
Applications
• AEC-Q100 Grade 1 Qualified
• Manufactured on an Automotive Grade Flow
• Compound CMOS and Bipolar Outputs Reduce
Output Current Variation
• 7-A Sink and 3-A Source Current
• Fast Propagation Times: 25 ns (Typical)
• Fast Rise and Fall Times: 14 ns or 12 ns
Rise or Fall With 2-nF Load
• Inverting and Non-Inverting Inputs Provide Either
Configuration With a Single Device
• Supply Rail Undervoltage Lockout Protection
• Dedicated Input Ground (IN_REF) for
Split Supply or Single Supply Operation
• Power Enhanced 6-Pin WSON Package
(3 mm × 3 mm) or Thermally Enhanced
MSOP-PowerPAD Package
• Output Swings From VCC to VEE Which Are
Negative Relative to Input Ground
2 Applications
• DC to DC Switch-Mode Power Supplies
• AC to DC Switch-Mode Power Supplies
• Solar Microinverters
• Solenoid and Motor Drives
3 Description
The LM5112 device MOSFET gate driver provides
high peak gate drive current in the tiny 6-pin WSON
package (SOT-23 equivalent footprint) or an 8-pin
exposed-pad MSOP package with improved power
dissipation required for high frequency operation. The
compound output driver stage includes MOS and
bipolar transistors operating in parallel that together
sink more than 7 A peak from capacitive loads.
Combining the unique characteristics of MOS and
bipolar devices reduces drive current variation with
voltage and temperature. Undervoltage lockout
protection is provided to prevent damage to the
MOSFET due to insufficient gate turnon voltage. The
LM5112 device provides both inverting and non-
inverting inputs to satisfy requirements for inverting
and non-inverting gate drive with a single device type.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LM5112,
LM5112-Q1
WSON (6)
3.00 mm × 3.00 mm
MSOP PowerPAD (8) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
VCC
IN
IN_REF
INB
UVLO
IN_REF
OUT
LM5112
VEE
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



LM5112
LM5112, LM5112-Q1
SNVS234C – SEPTEMBER 2004 – REVISED SEPTEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics .......................................... 5
6.7 Typical Characteristics .............................................. 6
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description .................................................. 9
7.4 Device Functional Modes ....................................... 10
8 Application and Implementation ........................ 11
8.1 Application Information .......................................... 11
8.2 Typical Application ................................................. 11
9 Power Supply Recommendations...................... 13
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 15
11 Device and Documentation Support ................. 16
11.1 Related Links ........................................................ 16
11.2 Receiving Notification of Documentation Updates 16
11.3 Community Resources.......................................... 16
11.4 Trademarks ........................................................... 16
11.5 Electrostatic Discharge Caution ............................ 16
11.6 Glossary ................................................................ 16
12 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2006) to Revision C
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
• Changed values in the Thermal Information table to align with JEDEC standards................................................................ 4
2 Submit Documentation Feedback
Copyright © 2004–2016, Texas Instruments Incorporated
Product Folder Links: LM5112 LM5112-Q1





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