Buck Controller. LM5116 Datasheet

LM5116 Controller. Datasheet pdf. Equivalent

LM5116 Datasheet
Recommendation LM5116 Datasheet
Part LM5116
Description Wide Range Synchronous Buck Controller
Feature LM5116; Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Des.
Manufacture etcTI
Datasheet
Download LM5116 Datasheet




Texas Instruments LM5116
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
LM5116
SNVS499H – FEBRUARY 2007 – REVISED JULY 2015
LM5116 Wide Range Synchronous Buck Controller
1 Features
1 Emulated Peak Current Mode
• Wide Operating Range Up to 100 V
• Low IQ Shutdown (< 10 µA)
• Drives Standard or Logic Level MOSFETs
• Robust 3.5-A Peak Gate Drive
• Free-run or Synchronous Operation to 1 MHz
• Optional Diode Emulation Mode
• Programmable Output from 1.215 V to 80 V
• Precision 1.5% Voltage Reference
• Programmable Current Limit
• Programmable Soft-Start
• Programmable Line Undervoltage Lockout
• Automatic Switch to External Bias Supply
• HTSSOP-20 Exposed Pad
• Thermal Shutdown
• Create a Custom Design Using the LM5116 with
the WEBENCH Power Designer
2 Applications
• Automotive Infotainment
• Industrial DC-DC Motor Drivers
• Automotive USB Adapters
• Telecom Servers
3 Description
The LM5116 is a synchronous buck controller
intended for step-down regulator applications from a
high-voltage or widely varying input supply. The
control method is based upon current mode control
utilizing an emulated current ramp. Current mode
control provides inherent line feed-forward, cycle-by-
cycle current limiting, and ease-of-loop
compensation. The use of an emulated control ramp
reduces noise sensitivity of the pulse-width
modulation circuit, allowing reliable control of very
small duty cycles necessary in high-input voltage
applications.
The operating frequency is programmable from 50
kHz to 1 MHz. The LM5116 drives external high-side
and low-side NMOS power switches with adaptive
dead-time control. A user-selectable diode emulation
mode enables discontinuous mode operation, for
improved efficiency at light load conditions. A low
quiescent current shutdown disables the controller
and consumes less than 10 µA of total input current.
Additional features include a high-voltage bias
regulator, automatic switch-over to external bias for
improved efficiency, thermal shutdown, frequency
synchronization, cycle-by-cycle current limit, and
adjustable line undervoltage lockout. The device is
available in a power enhanced HTSSOP-20 package
featuring an exposed die attach pad to aid thermal
dissipation.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LM5116
HTSSOP (20)
6.50 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
VIN
VIN
CIN RUV2
UVLO
RUV1
CSYNC
RT
EN
RT/ SYNC
LM 5116
VCC
HB
CHB
HO
SW
LO
CS
CHF
CCOMP
RCOMP
COMP
FB
SS
CSG
DEMB
RAMP
VOUT
VCCX
AGND PGND
CSS
C RAMP
C VCC
VIN
L
RS
R FB2
RFB1
VOUT
C OUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LM5116
LM5116
SNVS499H – FEBRUARY 2007 – REVISED JULY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics .......................................... 8
6.7 Typical Performance Characteristics ........................ 9
7 Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 14
7.4 Device Functional Modes........................................ 19
8 Application and Implementation ........................ 21
8.1 Application Information............................................ 21
8.2 Typical Application ................................................. 21
9 Power Supply Recommendations...................... 33
10 Layout................................................................... 33
10.1 Layout Guidelines ................................................. 33
10.2 Layout Example .................................................... 33
11 Device and Documentation Support ................. 34
11.1 Custom Design with WEBENCH Tools................. 34
11.2 Receiving Notification of Documentation Updates 34
11.3 Device Support...................................................... 34
11.4 Community Resources.......................................... 34
11.5 Trademarks ........................................................... 34
11.6 Electrostatic Discharge Caution ............................ 34
11.7 Glossary ................................................................ 35
12 Mechanical, Packaging, and Orderable
Information ........................................................... 35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (March 2013) to Revision H
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changes from Revision F (March 2013) to Revision G
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 21
2 Submit Documentation Feedback
Product Folder Links: LM5116
Copyright © 2007–2015, Texas Instruments Incorporated



Texas Instruments LM5116
www.ti.com
5 Pin Configuration and Functions
LM5116
SNVS499H – FEBRUARY 2007 – REVISED JULY 2015
PWP Package
20-Pin HTSSOP
Top View
VIN
UVLO
RT/ SYNC
EN
RAMP
AGND
SS
FB
COMP
VOUT
1
2
3
4
5
6
7
8
9
10
20 SW
19 HO
18 HB
17 VCCX
16 VCC
TSSOP- 20
15 LO
14 PGND
13 CSG
EP
12 CS
11 DEMB
NAME
AGND
COMP
CS
CSG
PIN
NO.
6
9
12
13
DEMB
11
EN
FB
HB
HO
LO
PGND
RAMP
RT/SYNC
4
8
18
19
15
14
5
3
I/O (1)
G
O
I
G
I
I
I
P
O
O
G
I
I
Pin Functions
DESCRIPTION
Analog ground.Connect to PGND through the exposed pad ground connection under the
LM5116.
Output of the internal error amplifier. The loop compensation network should be connected
between this pin and the FB pin.
Current sense amplifier input. Connect to the top of the current sense resistor or the drain of
the low-sided MOSFET if RDS(ON) current sensing is used.
Current sense amplifier input. Connect to the bottom of the sense resistor or the source of
the low-side MOSFET if RDS(ON) current sensing is used.
Low-side MOSFET source voltage monitor for diode emulation. For start-up into a pre-biased
load, tie this pin to ground at the CSG connection. For fully synchronous operation, use an
external series resistor between DEMB and ground to raise the diode emulation threshold
above the low-side SW on-voltage.
If the EN pin is below 0.5 V, the regulator is in a low-power state, drawing less than 10 µA
from VIN. EN must be pulled above 3.3 V for normal operation. The maximum EN transition
time for proper operation is one switching period.
Feedback signal from the regulated output. This pin is connected to the inverting input of the
internal error amplifier. The regulation threshold is 1.215 V.
High-side driver supply for bootstrap gate drive. Connect to the cathode of the bootstrap
diode and the positive terminal of the bootstrap capacitor. The bootstrap capacitor supplies
current to charge the high-side MOSFET gate and should be placed as close to the
controller as possible.
Connect to the gate of the high-side synchronous MOSFET through a short, low inductance
path
Connect to the gate of the low-side synchronous MOSFET through a short, low inductance
path.
Power ground. Connect to AGND through the exposed pad ground connection under the
LM5116
Ramp control signal. An external capacitor connected between this pin and the AGND pin
sets the ramp slope used for current mode control.
The internal oscillator is set with a single resistor between this pin and the AGND pin. The
recommended frequency range is 50 kHz to 1 MHz. The internal oscillator can be
synchronized to an external clock by AC coupling a positive edge onto this node.
(1) G = Ground, I = Input, O = Output, P = Power
Copyright © 2007–2015, Texas Instruments Incorporated
Product Folder Links: LM5116
Submit Documentation Feedback
3





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)