Gate Driver. LM5134 Datasheet

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LM5134 Datasheet
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Part LM5134
Description Low-Side Gate Driver
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LM5134
SNVS808C – MAY 2012 – REVISED FEBRURARY 2016
LM5134 Single 7.6-A Peak Current Low-Side Gate Driver With a PILOT Output
1 Features
1 7.6-A and 4.5-A Peak Sink and Source Drive
Current for Main Output
• 820-mA and 660-mA Peak Sink and Source
Current for PILOT Output
• 4-V to 12.6-V Single-Power Supply
• Matching Delay Time Between Inverting and Non-
Inverting Inputs
• TTL/CMOS Logic Inputs
• Up to 14-V Logic Inputs (Regardless of VDD
Voltage)
• –40°C to 125°C Junction Temperature Range
2 Applications
• Motor Drivers
• Solid-State Power Controllers
• Power Factor Correction Converters
3 Description
The LM5134 is a high-speed single low-side driver
capable of sinking and sourcing 7.6-A and 4.5-A peak
currents. The LM5134 has inverting and noninverting
inputs that give the user greater flexibility in
controlling the FET. The LM5134 features one main
output, OUT, and an extra gate drive output, PILOT.
The PILOT pin logic is complementary to the OUT
pin, and can be used to drive a small MOSFET
located close to the main power FET. This
configuration minimizes the turnoff loop and reduces
the consequent parasitic inductance. It is particularly
useful for driving high-speed FETs or multiple FETs
in parallel. The LM5134 is available in the 6-pin
SOT-23 package and the 6-pin WSON package with
an exposed pad to aid thermal dissipation.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LM5134
SOT-23 (6)
WSON (6)
2.90 mm × 1.60 mm
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Noninverting Input
Inverting Input
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LM5134
LM5134
SNVS808C – MAY 2012 – REVISED FEBRURARY 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics .......................................... 4
6.6 Switching Characteristics .......................................... 6
6.7 Typical Characteristics .............................................. 8
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 12
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application ................................................. 14
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
10.3 Power Dissipation ................................................. 19
11 Device and Documentation Support ................. 20
11.1 Community Resources.......................................... 20
11.2 Trademarks ........................................................... 20
11.3 Electrostatic Discharge Caution ............................ 20
11.4 Glossary ................................................................ 20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1
Changes from Revision A (April 2013) to Revision B
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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Product Folder Links: LM5134
Copyright © 2012–2016, Texas Instruments Incorporated



Texas Instruments LM5134
www.ti.com
5 Pin Configuration and Functions
DBV Package, NGG Package
6-Pin SOT-23, 6-Pin WSON
Top View
LM5134
SNVS808C – MAY 2012 – REVISED FEBRURARY 2016
VDD 1
PILOT 2
OUT 3
6 IN
5 INB
4 VSS
PIN
NAME
NO.
VDD
1
PILOT
2
OUT
VSS
INB
IN
3
4
5
6
EP EP
Pin Functions
I/O DESCRIPTION
APPLICATION INFORMATION
— Gate drive supply
Locally decouple to VSS using low ESR/ESL capacitor located as
close as possible to the IC.
O
Gate drive output for an external Connect to the gate of a small turnoff MOSFET with a short, low
turnoff FET
inductance path. The turnoff FET provides a local turnoff path.
O
Gate drive output for the power
FET
Connect to the gate of the power FET with a short, low inductance
path. A gate resistor can be used to eliminate potential gate
oscillations.
— Ground
All signals are referenced to this ground.
I Inverting logic input
Connect to VSS when not used.
I Non-inverting logic input
Connect to VDD when not used.
— Exposed Pad
It is recommended that the exposed pad on the bottom of the
package be soldered to ground plane on the PC board, and that
ground plane extend out from beneath the IC to help dissipate
heat.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Pin voltage
VDD to VSS
IN, INB to VSS
0.3 14
0.3 14
V
Junction temperature, TJ
Storage temperature, Tstg
150
55 150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
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