32-bit MCU. S9KEAZN8ACFK Datasheet

S9KEAZN8ACFK MCU. Datasheet pdf. Equivalent

Part S9KEAZN8ACFK
Description 32-bit MCU
Feature NXP Semiconductors Data Sheet: Technical Data Document Number S9KEA8P44M48SF0 Rev. 5, 10/2019 KEA8.
Manufacture NXP
Total Page 30 Pages
Datasheet
Download S9KEAZN8ACFK Datasheet



S9KEAZN8ACFK
NXP Semiconductors
Data Sheet: Technical Data
Document Number S9KEA8P44M48SF0
Rev. 5, 10/2019
KEA8 Sub-Family Data Sheet
Supports the following:
S9KEAZN8ACTG(R),
S9KEAZN8ACFK(R),
S9KEAZN8AMTG(R) and
S9KEAZN8AMFK(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 125°C
• Performance
– Up to 48 MHz Arm® Cortex-M0+ core
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 8 KB flash
– Up to 1 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 24 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 37.5 kHz pre-trimmed
internal reference for 48 MHz system clock
– Internal 1 kHz low-power oscillator (LPO)
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Aliased SRAM bitband region (BIT-BAND)
– Bit manipulation engine (BME)
S9KEA8P44M48SF0
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Up to 37 general-purpose input/output (GPIO)
– Up to 22 general-purpose input/output (GPIO)
– Up to 14 general-purpose input/output (GPIO)
– Two up to 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One 12-channel 12-bit SAR ADC, operation in Stop
mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC
and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– One 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One pulse width timer (PWT)
– One real-time clock (RTC)
• Communication interfaces
– One SPI module (SPI)
– One UART module (UART)
– One I2C module (I2C)
• Package options
– 24-pin QFN
– 16-pin TSSOP
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.



S9KEAZN8ACFK
Table of Contents
1 Ordering parts.......................................................................................3
4.2.2 FTM module timing....................................................... 15
1.1 Determining valid orderable parts............................................... 3
4.3 Thermal specifications................................................................. 16
2 Part identification................................................................................. 3
4.3.1 Thermal characteristics.................................................. 16
2.1 Description...................................................................................3
5 Peripheral operating requirements and behaviors................................ 17
2.2 Format.......................................................................................... 3
5.1 Core modules............................................................................... 17
2.3 Fields............................................................................................3
5.1.1 SWD electricals .............................................................18
2.4 Example....................................................................................... 4
5.2 External oscillator (OSC) and ICS characteristics.......................19
3 Ratings..................................................................................................4
5.3 NVM specifications..................................................................... 21
3.1 Thermal handling ratings............................................................. 4
5.4 Analog..........................................................................................22
3.2 Moisture handling ratings............................................................ 4
5.4.1 ADC characteristics....................................................... 22
3.3 ESD handling ratings................................................................... 5
5.4.2 Analog comparator (ACMP) electricals.........................24
3.4 Voltage and current operating ratings..........................................5
5.5 Communication interfaces........................................................... 25
4 General................................................................................................. 6
5.5.1 SPI switching specifications.......................................... 25
4.1 Nonswitching electrical specifications........................................ 6
6 Dimensions...........................................................................................28
4.1.1 DC characteristics.......................................................... 6
6.1 Obtaining package dimensions.................................................... 28
4.1.2 Supply current characteristics........................................ 12
7 Pinout................................................................................................... 28
4.1.3 EMC performance..........................................................14
7.1 Signal multiplexing and pin assignments.................................... 28
4.2 Switching specifications.............................................................. 14
8 Revision History...................................................................................29
4.2.1 Control timing................................................................ 14
KEA8 Sub-Family Data Sheet, Rev. 5, 10/2019
2 NXP Semiconductors





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