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32-bit MCU. MC56F83789 Datasheet

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32-bit MCU. MC56F83789 Datasheet






MC56F83789 MCU. Datasheet pdf. Equivalent




MC56F83789 MCU. Datasheet pdf. Equivalent





Part

MC56F83789

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data MC56F837xx Supports MC56F837xx Fe atures β€’ This family of digital signa l controllers (DSCs) is based on the 32 -bit 56800EX core. On a single chip, ea ch device combines the processing power of a DSP and the functionality of an M CU, with a flexible set of peripherals to support many target applications: β€ “ Industrial control –.
Manufacture

NXP

Datasheet
Download MC56F83789 Datasheet


NXP MC56F83789

MC56F83789; Home appliances – General-purpose inv erters – Smart sensors, fire and secu rity systems – Switched-mode power su pply and power management – Power dis tribution systems – Motor control (AC IM, BLDC, PMSM, SR, stepper) – Uninte rruptible power supplies (UPS) – Sola r inverter – Medical monitoring appli cations β€’ DSC based on 32-bit 56800EX core – Up to 100 MIPS at 100 MHz co.


NXP MC56F83789

re frequency – DSP and MCU functionali ty in a unified, C-efficient architectu re β€’ On-chip memory – Up to 2Γ—128 KB dual partition flash memory with ECC protection and partition swap function – Up to 64 KB data/program RAM – B oth on-chip flash memory and RAM can be mapped into both program and data memo ry spaces – 32 KB boot ROM supports b oot from SCI, I2C and CAN β€’ Ana.


NXP MC56F83789

log – Two high-speed, 8-ch external an d 2-ch internal, 12bit ADCs with dynami c x1, x2, and x4 programmable amplifier – Four analog comparators with integ rated 8-bit DAC references – Up to tw o 12-bit digital-to-analog converters ( DAC) β€’ Two high resolution eFlexPWM m odules with up to 2x8 PWM outputs, incl uding 2x8 channels with 312ps resolutio n NanoEdge placement Docu.

Part

MC56F83789

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data MC56F837xx Supports MC56F837xx Fe atures β€’ This family of digital signa l controllers (DSCs) is based on the 32 -bit 56800EX core. On a single chip, ea ch device combines the processing power of a DSP and the functionality of an M CU, with a flexible set of peripherals to support many target applications: β€ “ Industrial control –.
Manufacture

NXP

Datasheet
Download MC56F83789 Datasheet




 MC56F83789
NXP Semiconductors
Data Sheet: Technical Data
MC56F837xx
Supports MC56F837xx
Features
β€’ This family of digital signal controllers (DSCs) is
based on the 32-bit 56800EX core. On a single chip,
each device combines the processing power of a DSP
and the functionality of an MCU, with a flexible set of
peripherals to support many target applications:
– Industrial control
– Home appliances
– General-purpose inverters
– Smart sensors, fire and security systems
– Switched-mode power supply and power
management
– Power distribution systems
– Motor control (ACIM, BLDC, PMSM, SR, stepper)
– Uninterruptible power supplies (UPS)
– Solar inverter
– Medical monitoring applications
β€’ DSC based on 32-bit 56800EX core
– Up to 100 MIPS at 100 MHz core frequency
– DSP and MCU functionality in a unified, C-efficient
architecture
β€’ On-chip memory
– Up to 2Γ—128 KB dual partition flash memory with
ECC protection and partition swap function
– Up to 64 KB data/program RAM
– Both on-chip flash memory and RAM can be
mapped into both program and data memory spaces
– 32 KB boot ROM supports boot from SCI, I2C and
CAN
β€’ Analog
– Two high-speed, 8-ch external and 2-ch internal, 12-
bit ADCs with dynamic x1, x2, and x4
programmable amplifier
– Four analog comparators with integrated 8-bit DAC
references
– Up to two 12-bit digital-to-analog converters (DAC)
β€’ Two high resolution eFlexPWM modules with up to
2x8 PWM outputs, including 2x8 channels with 312ps
resolution NanoEdge placement
Document Number MC56F837XXDS
Rev. 1.6, 09/2019
MC56F837XXDS
β€’ Communication interfaces
– Up to three high-speed queued SCI (QSCI) modules
with LIN slave functionality
– Up to two queued SPI (QSPI) modules
– Two I2C/SMBus ports
– One FlexCAN module, with Flexible Data-rate
(CAN-FD) supported
– One USB2.0 controller with integrated PHY
β€’ Timers
– Two 16-bit quad timer (2 x 4 16-bit timer)
– Two Periodic Interval Timers (PITs)
β€’ Security and integrity
– Cyclic Redundancy Check (CRC) generator
– Windowed Computer operating properly (COP)
watchdog
– External Watchdog Monitor (EWM)
β€’ Clocks
– On-chip relaxation oscillators: 200 kHz, and 48
MHz IRC
– Crystal / resonator oscillator
β€’ System
– Integrated power-on reset (POR) and low-voltage
interrupt (LVI) and brown-out reset module
– Inter-Module Crossbar and Event Generator
– JTAG/enhanced on-chip emulation (EOnCE) for
unobtrusive, real-time debugging
β€’ Operating characteristics
– Single supply: 2.7 V to 3.6 V
– 5 V–tolerant I/O (except for 3.3 V RESETB and
USB_DP/USB_DM pins)
– Operation ambient temperature: V temperature
option: -40Β°C to 105Β°C
β€’ 100-pin LQFP, 80-pin LQFP, and 64-pin LQFP
packages
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 MC56F83789
Table of Contents
1 Overview............................................................................................ 3
5.2 Moisture handling ratings........................................................21
1.1 Product Family........................................................................ 3
5.3 ESD handling ratings.............................................................. 21
1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........4
5.4 Voltage and current operating ratings..................................... 21
1.3 Operation Parameters.............................................................. 4
6 General............................................................................................... 23
1.4 Interrupt Controller................................................................. 5
6.1 General characteristics............................................................ 23
1.5 Peripheral highlights............................................................... 5
6.2 AC electrical characteristics....................................................24
1.6 Block diagrams........................................................................12
6.3 Nonswitching electrical specifications....................................24
2 Ordering parts.....................................................................................14
6.4 Switching specifications..........................................................30
2.1 Determining valid orderable parts...........................................15
6.5 Thermal specifications............................................................ 31
2.2 Part number list....................................................................... 15
7 Peripheral operating requirements and behaviors.............................. 32
3 Part identification............................................................................... 15
7.1 Core modules...........................................................................32
3.1 Description.............................................................................. 15
7.2 System modules.......................................................................34
3.2 Format..................................................................................... 15
7.3 Clock modules.........................................................................34
3.3 Fields....................................................................................... 15
7.4 Memories and memory interfaces........................................... 36
3.4 Example...................................................................................16
7.5 Analog..................................................................................... 38
4 Terminology and guidelines...............................................................16
7.6 PWMs and timers.................................................................... 44
4.1 Definition: Operating requirement.......................................... 16
7.7 Communication interfaces.......................................................45
4.2 Definition: Operating behavior............................................... 17
8 Design Considerations....................................................................... 51
4.3 Definition: Attribute................................................................17
8.1 Thermal design considerations................................................51
4.4 Definition: Rating....................................................................17
8.2 Electrical design considerations.............................................. 52
4.5 Result of exceeding a rating.................................................... 18
8.3 Power-on Reset design considerations....................................54
4.6 Relationship between ratings and operating requirements......18
9 Obtaining package dimensions.......................................................... 55
4.7 Guidelines for ratings and operating requirements................. 19
10 Pinout................................................................................................. 55
4.8 Definition: Typical value........................................................ 19
10.1 Signal Multiplexing and Pin Assignments.............................. 55
4.9 Typical value conditions......................................................... 20
10.2 Pinout diagrams.......................................................................58
5 Ratings................................................................................................20
11 Product documentation.......................................................................61
5.1 Thermal handling ratings........................................................ 20
12 Revision history................................................................................. 62
MC56F837xx, Rev. 1.6, 09/2019
2 NXP Semiconductors




 MC56F83789
Overview
1 Overview
1.1 Product Family
The following table lists major features, including features that differ among members of
the family. Features not listed are shared by all members of the family.
Table 1. MC56F837xx Family
Feature
Core frequency (MHz)
Flash memory (KB)
RAM (KB)
ROM (KB)
Flash block Swap
Inter-module Xbar
Event Generator
Windowed Watchdog
External Watchdog Monitor
eDMA
Internal OSC
External Crystal Oscillator
Comparator
Cyclic ADC channels (External + Internal)
NanoEdge PWM: high-resolution
Timers
Periodic Interval Timers
12bit DAC
CAN-FD
I2C/SMBus
QSCI
QSPI
USB 2.0 FS/LS
GPIO
Operating Temperature
LQFP package pin count
789 769
256 128
64 48
2x8
3
2
1
82
100 LQFP
MC56F83
786 766
100
256 128
64 48
32
Yes
Yes
4
1
1
4-Ch
200 kHz / 48 MHz
Yes (4 MHz ~ 16 MHz)
4
2 x (8+2)
2x81
2x4
2
2
1
2
3
2
β€”
68
105℃
80 LQFP
783 763
256 128
64 48
1x8+1x62
2
1
β€”
54
64 LQFP
1. The outputs of PWMB_3A and PWMB_3B are available through the on-chip inter-module crossbar (XBAR).
2. The outputs of PWMB are available through XBAR. PWMA_3A/PWMB_3B coupled with XB_OUT10/XB_OUT11.
NXP Semiconductors
MC56F837xx, Rev. 1.6, 09/2019
3






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