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32-Bit MCU. MK20FX512VMD12 Datasheet

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32-Bit MCU. MK20FX512VMD12 Datasheet






MK20FX512VMD12 MCU. Datasheet pdf. Equivalent




MK20FX512VMD12 MCU. Datasheet pdf. Equivalent





Part

MK20FX512VMD12

Description

32-Bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number K20P144M120SF3 R ev. 7, 02/2018 K20 Sub-Family Supports the following: MK20FX512VLQ12, MK20FN1 M0VLQ12, MK20FX512VMD12, MK20FN1M0VMD12 Key features โ€ข Operating Characteris tics โ€“ Voltage range: 1.71 to 3.6 V โ €“ Flash write voltage range: 1.71 to 3 .6 V โ€“ Temperature range (ambient): - 40 to 105ยฐC โ€ข Performance .
Manufacture

NXP

Datasheet
Download MK20FX512VMD12 Datasheet


NXP MK20FX512VMD12

MK20FX512VMD12; โ€“ Up to 120 MHz Armยฎ Cortexยฎ-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz โ€ข Memories and memory interfaces โ€“ Up to 1024 KB pr ogram flash memory on nonFlexMemory dev ices โ€“ Up to 512 KB program flash mem ory on FlexMemory devices โ€“ Up to 512 KB FlexNVM on FlexMemory devices โ€“ 1 6 KB FlexRAM on FlexMemory devices โ€“ Up to 128 KB RAM โ€“ Serial programm.


NXP MK20FX512VMD12

ing interface (EzPort) โ€“ FlexBus exter nal bus interface โ€“ NAND flash contro ller interface โ€ข Clocks โ€“ 3 to 32 M Hz crystal oscillator โ€“ 32 kHz crysta l oscillator โ€“ Multi-purpose clock ge nerator โ€ข System peripherals โ€“ Mult iple low-power modes to provide power o ptimization based on application requir ements โ€“ Memory protection unit with multi-master protection โ€“ 32-channel.


NXP MK20FX512VMD12

DMA controller, supporting up to 128 re quest sources โ€“ External watchdog mon itor โ€“ Software watchdog โ€“ Low-leak age wakeup unit K20P144M120SF3 โ€ข Sec urity and integrity modules โ€“ Hardwar e CRC module to support fast cyclic red undancy checks โ€“ 128-bit unique ident ification (ID) number per chip โ€ข Huma n-machine interface โ€“ Low-power hardw are touch sensor interface (TSI) โ€“.

Part

MK20FX512VMD12

Description

32-Bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number K20P144M120SF3 R ev. 7, 02/2018 K20 Sub-Family Supports the following: MK20FX512VLQ12, MK20FN1 M0VLQ12, MK20FX512VMD12, MK20FN1M0VMD12 Key features โ€ข Operating Characteris tics โ€“ Voltage range: 1.71 to 3.6 V โ €“ Flash write voltage range: 1.71 to 3 .6 V โ€“ Temperature range (ambient): - 40 to 105ยฐC โ€ข Performance .
Manufacture

NXP

Datasheet
Download MK20FX512VMD12 Datasheet




 MK20FX512VMD12
NXP Semiconductors
Data Sheet: Technical Data
Document Number K20P144M120SF3
Rev. 7, 02/2018
K20 Sub-Family
Supports the following:
MK20FX512VLQ12,
MK20FN1M0VLQ12,
MK20FX512VMD12,
MK20FN1M0VMD12
Key features
โ€ข Operating Characteristics
โ€“ Voltage range: 1.71 to 3.6 V
โ€“ Flash write voltage range: 1.71 to 3.6 V
โ€“ Temperature range (ambient): -40 to 105ยฐC
โ€ข Performance
โ€“ Up to 120 MHz Armยฎ Cortexยฎ-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
โ€ข Memories and memory interfaces
โ€“ Up to 1024 KB program flash memory on non-
FlexMemory devices
โ€“ Up to 512 KB program flash memory on
FlexMemory devices
โ€“ Up to 512 KB FlexNVM on FlexMemory devices
โ€“ 16 KB FlexRAM on FlexMemory devices
โ€“ Up to 128 KB RAM
โ€“ Serial programming interface (EzPort)
โ€“ FlexBus external bus interface
โ€“ NAND flash controller interface
โ€ข Clocks
โ€“ 3 to 32 MHz crystal oscillator
โ€“ 32 kHz crystal oscillator
โ€“ Multi-purpose clock generator
โ€ข System peripherals
โ€“ Multiple low-power modes to provide power
optimization based on application requirements
โ€“ Memory protection unit with multi-master
protection
โ€“ 32-channel DMA controller, supporting up to 128
request sources
โ€“ External watchdog monitor
โ€“ Software watchdog
โ€“ Low-leakage wakeup unit
K20P144M120SF3
โ€ข Security and integrity modules
โ€“ Hardware CRC module to support fast cyclic
redundancy checks
โ€“ 128-bit unique identification (ID) number per chip
โ€ข Human-machine interface
โ€“ Low-power hardware touch sensor interface (TSI)
โ€“ General-purpose input/output
โ€ข Analog modules
โ€“ Four 16-bit SAR ADCs
โ€“ Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
โ€“ Two 12-bit DACs
โ€“ Four analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
โ€“ Voltage reference
โ€ข Timers
โ€“ Programmable delay block
โ€“ Two 8-channel motor control/general purpose/PWM
timers
โ€“ Two 2-channel quadrature decoder/general purpose
timers
โ€“ Periodic interrupt timers
โ€“ 16-bit low-power timer
โ€“ Carrier modulator transmitter
โ€“ Real-time clock
โ€ข Communication interfaces
โ€“ USB high-/full-/low-speed On-the-Go controller
with ULPI interface
โ€“ USB full-/low-speed On-the-Go controller with on-
chip transceiver
โ€“ USB Device Charger detect (USBDCD)
โ€“ Two Controller Area Network (CAN) modules
โ€“ Three SPI modules
โ€“ Two I2C modules
โ€“ Six UART modules
โ€“ Secure Digital Host Controller (SDHC)
โ€“ Two I2S modules
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 MK20FX512VMD12
K20 Sub-Family, Rev. 7, 02/2018
2 NXP Semiconductors




 MK20FX512VMD12
Table of Contents
1 Ordering parts.......................................................................................4
6.2 System modules........................................................................... 26
1.1 Determining valid orderable parts............................................... 4
6.3 Clock modules............................................................................. 26
2 Part identification................................................................................. 4
6.3.1 MCG specifications..................................................... 26
2.1 Description...................................................................................4
6.3.2 Oscillator electrical specifications...............................28
2.2 Format.......................................................................................... 4
6.3.3 32 kHz oscillator electrical characteristics.................. 30
2.3 Fields............................................................................................4
6.4 Memories and memory interfaces................................................31
2.4 Example....................................................................................... 5
6.4.1 Flash (FTFE) electrical specifications.........................31
3 Terminology and guidelines.................................................................5
6.4.2 EzPort switching specifications...................................35
3.1 Definitions................................................................................... 5
6.4.3 NAND flash controller specifications......................... 36
3.2 Examples......................................................................................5
6.4.4 Flexbus switching specifications.................................39
3.3 Typical-value conditions..............................................................6
6.5 Security and integrity modules.................................................... 42
3.4 Relationship between ratings and operating requirements.......... 6
6.6 Analog..........................................................................................42
3.5 Guidelines for ratings and operating requirements......................7
6.6.1 ADC electrical specifications...................................... 42
4 Ratings..................................................................................................7
6.6.2 CMP and 6-bit DAC electrical specifications............. 50
4.1 Thermal handling ratings............................................................. 7
6.6.3 12-bit DAC electrical characteristics...........................52
4.2 Moisture handling ratings............................................................ 8
6.6.4 Voltage reference electrical specifications..................55
4.3 ESD handling ratings................................................................... 8
6.7 Timers.......................................................................................... 56
4.4 Voltage and current operating ratings..........................................8
6.8 Communication interfaces........................................................... 56
5 General................................................................................................. 9
6.8.1 USB electrical specifications.......................................56
5.1 AC electrical characteristics........................................................ 9
6.8.2 USB DCD electrical specifications............................. 57
5.2 Nonswitching electrical specifications........................................ 9
6.8.3 USB VREG electrical specifications...........................57
5.2.1 Voltage and current operating requirements............... 9
6.8.4 ULPI timing specifications..........................................58
5.2.2 LVD and POR operating requirements....................... 10
6.8.5 CAN switching specifications..................................... 59
5.2.3 Voltage and current operating behaviors.....................11
6.8.6 DSPI switching specifications (limited voltage
5.2.4 Power mode transition operating behaviors................ 13
range)........................................................................... 59
5.2.5 Power consumption operating behaviors.....................14
6.8.7 DSPI switching specifications (full voltage range)..... 61
5.2.6 EMC radiated emissions operating behaviors............. 17
6.8.8 Inter-Integrated Circuit Interface (I2C) timing............62
5.2.7 Designing with radiated emissions in mind.................18
6.8.9 UART switching specifications...................................63
5.2.8 Capacitance attributes..................................................18
6.8.10 SDHC specifications................................................... 64
5.3 Switching specifications.............................................................. 18
6.8.11 I2S/SAI switching specifications................................ 65
5.3.1 Device clock specifications......................................... 18
6.9 Human-machine interfaces (HMI)...............................................71
5.3.2 General switching specifications.................................19
6.9.1 TSI electrical specifications........................................ 71
5.4 Thermal specifications................................................................. 20
7 Dimensions...........................................................................................72
5.4.1 Thermal operating requirements..................................20
7.1 Obtaining package dimensions.................................................... 72
5.4.2 Thermal attributes........................................................21
8 Pinout................................................................................................... 73
6 Peripheral operating requirements and behaviors................................ 22
8.1 Pins with active pull control after reset....................................... 73
6.1 Core modules............................................................................... 22
8.2 K20 Signal Multiplexing and Pin Assignments...........................73
6.1.1 Debug trace timing specifications............................... 22
8.3 K20 pinouts..................................................................................80
6.1.2 JTAG electricals.......................................................... 23
9 Revision History...................................................................................81
NXP Semiconductors
K20 Sub-Family, Rev. 7, 02/2018
3






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