UHD DMD. DLP660TE Datasheet

DLP660TE DMD. Datasheet pdf. Equivalent

Part DLP660TE
Description 0.66 4K UHD DMD
Feature Product Folder Order Now Technical Documents Tools & Software Support & Community DLP660TE 0.66.
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DLP660TE
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
DLP660TE 0.66 4K UHD DMD
DLP660TE
DLPS163 – APRIL 2019
1 Features
1 0.66-Inch diagonal micromirror array
– System displays 4K ultra high definition (UHD)
3840 x 2160 pixels on the screen
– 5.4-Micron micromirror pitch
– ±17° micromirror tilt (relative to flat surface)
– Bottom illumination
• 2xLVDS input data bus
• Dedicated DLPC4422 display controller and
DLPA100 power management IC and motor driver
for reliable operation
2 Applications
• 4K UHD display
• Digital signage
• Laser TV
• Projection mapping
3 Description
The TI DLP660TE digital micromirror device (DMD) is
a digitally controlled micro-opto-electromechanical
system (MOEMS) spatial light modulator (SLM) that
enables bright, affordable full 4K UHD display
solutions. When coupled to an appropriate optical
system, DLP660TE DMD displays true 4K UHD
resolution (8.3M pixels on screen) and is capable of
delivering accurate, detailed images to a variety of
surfaces. The DLP660TE DMD, together with the
DLPC4422 display controller and DLPA100 power
and motor driver, comprise the DLP® 4K UHD
chipset. This solution is a great fit for display systems
that require high resolution, high brightness and
system simplicity.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DLP660TE
FYG (350)
35mm x 32mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
DLP® DLP660TE 0.66 4K UHD DMD
DLPC4422
Display Controller
DAD_CTRL
SCP_CTRL
3.3V
3.3V to 1.8V
Translators
C/D_DMD_DATA
C/D_DMD_CLK
C/D_DMD_SCTRL
DAD_CTRL
SCP_CTRL
TPS65145
VO FFS ET
VB IAS
VRES ET
PG _OFFSE T
EN_OFFSE T
DLP660TE DMD
DLPC4422
Display Controller
A/B_DMD_DATA
A/B_DMD_CLK
A/B_DMD_SCTRL
VREG
1.8V
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP660TE
DLP660TE
DLPS163 – APRIL 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications....................................................... 11
6.1 Absolute Maximum Ratings .................................... 11
6.2 Storage Conditions.................................................. 12
6.3 ESD Ratings............................................................ 12
6.4 Recommended Operating Conditions..................... 12
6.5 Thermal Information ................................................ 15
6.6 Electrical Characteristics......................................... 15
6.7 Capacitance at Recommended Operating
Conditions ................................................................ 15
6.8 Timing Requirements .............................................. 16
6.9 System Mounting Interface Loads .......................... 19
6.10 Micromirror Array Physical Characteristics ........... 19
6.11 Micromirror Array Optical Characteristics ............. 21
6.12 Window Characteristics......................................... 22
6.13 Chipset Component Usage Specification ............. 22
7 Detailed Description ............................................ 23
7.1 Overview ................................................................. 23
7.2 Functional Block Diagram ....................................... 23
7.3 Feature Description................................................. 24
7.4 Device Functional Modes........................................ 24
7.5 Optical Interface and System Image Quality
Considerations ......................................................... 24
7.6 Micromirror Array Temperature Calculation............ 25
7.7 Micromirror Landed-On/Landed-Off Duty Cycle ..... 26
8 Application and Implementation ........................ 29
8.1 Application Information............................................ 29
8.2 Typical Application ................................................. 29
8.3 DMD Die Temperature Sensing.............................. 30
9 Power Supply Recommendations...................... 32
9.1 DMD Power Supply Power-Up Procedure .............. 32
9.2 DMD Power Supply Power-Down Procedure ......... 32
10 Layout................................................................... 35
10.1 Layout Guidelines ................................................. 35
10.2 Layout Example .................................................... 35
11 Device and Documentation Support ................. 37
11.1 Device Support...................................................... 37
11.2 Documentation Support ....................................... 38
11.3 Receiving Notification of Documentation Updates 38
11.4 Community Resources.......................................... 38
11.5 Trademarks ........................................................... 38
11.6 Electrostatic Discharge Caution ............................ 38
11.7 Glossary ................................................................ 38
12 Mechanical, Packaging, and Orderable
Information ........................................................... 39
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
April 2019
REVISION
*
NOTES
Initial release.
2 Submit Documentation Feedback
Product Folder Links: DLP660TE
Copyright © 2019, Texas Instruments Incorporated





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